Reliability model for Al wire bonds subjected to heel crack failures
Author: | S. Ramminger, Norbert SeligerORCiD, G. Wachutka |
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DOI: | https://doi.org/10.1016/S0026-2714(00)00139-6 |
ISSN: | 0026-2714 |
Parent Title (German): | Microelectronics Reliability |
Document Type: | Article (peer reviewed) |
Language: | English |
Publication Year: | 2000 |
Volume: | 40 |
Issue: | 8 |
Page Number: | 5 |
First Page: | 1521 |
Last Page: | 1525 |
faculties / departments: | Fakultät für Ingenieurwissenschaften |