High temperature reliability on automotive power modules verified by power cycling tests up to 150°C
Author: | G. Coquery, G. Lefranc, T. Licht, R. Lallemand, Norbert SeligerORCiD, H. Berg |
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DOI: | https://doi.org/10.1016/S0026-2714(03)00318-4 |
ISSN: | 0026-2714 |
Parent Title (German): | Microelectronics Reliability |
Document Type: | Article (peer reviewed) |
Language: | English |
Publication Year: | 2003 |
Volume: | 43 |
Issue: | 9 |
Page Number: | 6 |
First Page: | 1871 |
Last Page: | 1876 |
faculties / departments: | Fakultät für Ingenieurwissenschaften |