DRAM Failure Analysis and Defect Localization Techniques, Microelectronics Failure Analysis
- Comprehensive guide to the process and test methods used for electronic device failure analysis. Contains dozens of articles—contributed by industry experts—covering a wide range of topics involving the failure analysis of microelectronics. It places the most important and up-to-date information on this subject at your fingertips. Topic coverage includes: Failure Analysis Process Flow Failure Verification Failure Modes and Failure Classification Special Devices (MEMS, Optoelectronics, Passives) Fault Localization Techniques: Package Level (NDT) Die Level (Depackaging, Photon Emission, Microthermography, Laser-Based Methods, Particle Beam Methods) Deprocessing & Imaging Techniques: Deprocessing General Imaging Techniques Local Deprocessing & Imaging Circuit Edit and Design Modification Material Analysis Techniques Reference Information: Important Topics for Semiconductor Devices Failure Analysis Techniques Roadmap Failure Analysis Operations and Management Appendices: Failure Analysis Terms, Definitions, and Acronyms Industry Standards
Author: | Martin Versen |
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Parent Title (English): | Desk Reference Sixth Edition |
Publisher: | ASM International |
Place of publication: | Ohio |
Document Type: | Part of a Book |
Language: | English |
Publication Year: | 2011 |
Tag: | DRAM Failure Analysis; Microelectronics |
faculties / departments: | Fakultät für Ingenieurwissenschaften |
Dewey Decimal Classification: | 6 Technik, Medizin, angewandte Wissenschaften / 62 Ingenieurwissenschaften / 620 Ingenieurwissenschaften und zugeordnete Tätigkeiten |