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Reliability model for Al wire bonds subjected to heel crack failures

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Author:S. Ramminger, Norbert SeligerORCiD, G. Wachutka
DOI:https://doi.org/10.1016/S0026-2714(00)00139-6
ISSN:0026-2714
Parent Title (German):Microelectronics Reliability
Document Type:Article (peer reviewed)
Language:English
Publication Year:2000
Volume:40
Issue:8
Page Number:5
First Page:1521
Last Page:1525
faculties / departments:Fakultät für Ingenieurwissenschaften