TY - JOUR A1 - Ramminger, S. A1 - Seliger, Norbert A1 - Wachutka, G. T1 - Reliability model for Al wire bonds subjected to heel crack failures JF - Microelectronics Reliability Y1 - 2023 U6 - https://doi.org/10.1016/S0026-2714(00)00139-6 SN - 0026-2714 VL - 40 IS - 8 SP - 1521 EP - 1525 ER - TY - CHAP A1 - Seliger, Norbert A1 - Ramminger, S. A1 - Franke, T. A1 - Wachutka, G. T1 - A study of heel crack failures in wire bonds under mechanical cycling T2 - Proceedings of Micromat 2000 KW - wire bond KW - reliability KW - heel crack Y1 - 2023 ER - TY - CHAP A1 - Renken, F. A1 - Ehbauer, G. A1 - Karrer, V. A1 - Knorr, R. A1 - Ramminger, S. A1 - Seliger, Norbert A1 - Wolfgang, E. T1 - Reliability of high temperature inverters for HEV T2 - Proceedings Power Conversion Conference KW - HEV KW - Reliability KW - High-Temperature Electronics Y1 - 2023 U6 - https://doi.org/10.1109/PCCON.2007.373022 SP - 563 EP - 568 PB - IEEE CY - Nagoya ER -