TY - JOUR A1 - Gerber, M. A1 - Seliger, Norbert A1 - Ferreira, J. A. A1 - Hofsajer, I. W. T1 - Magnetic component miniaturisation for application in power electronic modules JF - 4th International Conference on Integrated Power Systems KW - Windings KW - Heating Y1 - 2023 UR - https://ieeexplore.ieee.org/document/5758070 SP - 1 EP - 6 ER - TY - CHAP A1 - Gerber, M. A1 - Ferreira, J.A. A1 - Hofsajer, I.W. A1 - Seliger, Norbert T1 - High density packaging of the passive components in an automotive DC/DC converter T2 - 2002 IEEE 33rd Annual IEEE Power Electronics Specialists Conference. Proceedings (Cat. No.02CH37289) KW - Automotive engineering KW - Cooling KW - DC-DC power converters KW - Filters KW - Inductors KW - Packaging KW - Resistance heating KW - Temperature KW - Thermal conductivity KW - Thermal resistance Y1 - 2023 U6 - https://doi.org/10.1109/PSEC.2002.1022545 VL - 2 SP - 761 EP - 767 ER - TY - JOUR A1 - Gerber, M. A1 - Ferreira, J.A. A1 - Hofsajer, I.W. A1 - Seliger, Norbert T1 - A volumetric optimization of a low-pass filter JF - IEEE Transactions on Industry Applications KW - DC-DC power converters KW - Electronic packaging thermal management KW - Industry Applications Society KW - Integrated circuit interconnections KW - Low pass filters KW - Magnetic separation KW - Manufacturing KW - Power electronics KW - Power system interconnection Y1 - 2023 U6 - https://doi.org/10.1109/TIA.2002.802996 SN - 1939-9367 VL - 38 IS - 5 SP - 1432 EP - 1440 ER - TY - JOUR A1 - Gerber, M. A1 - Ferreira, J.A. A1 - Seliger, Norbert A1 - Hofsajer, I.W. T1 - Integral 3-D thermal, electrical and mechanical design of an automotive DC/DC converter JF - IEEE Transactions on Power Electronics KW - DC/DC converter Y1 - 2023 VL - 20 IS - 3 SP - 566 EP - 575 PB - IEEE ER - TY - JOUR A1 - Gerber, M. A1 - Ferreira, J.A. A1 - Seliger, Norbert A1 - Hofsajer, I.W. T1 - High density packaging of the passive components in an automotive DC/DC converter JF - IEEE Transactions on Power Electronics KW - DC/DC converter Y1 - 2023 VL - 20 IS - 2 SP - 268 EP - 275 PB - IEEE ER - TY - CHAP A1 - Gerber, M. A1 - Ferreira, J.A. A1 - Hofsajer, I.W. A1 - Seliger, Norbert T1 - An improved 3D integrated DC/DC converter for high temperature environments T2 - IEEE 35th Annual Power Electronics Specialists Conference (IEEE Cat. No.04CH37551) KW - DC/DC converter Y1 - 2023 SP - 2779 EP - 2785 PB - IEEE ER - TY - CHAP A1 - Gerber, M. A1 - Ferreira, J.A. A1 - Hofsajer, I.W. A1 - Seliger, Norbert T1 - Interleaving optimization in synchronous rectified DC/DC converters T2 - IEEE 35th Annual Power Electronics Specialists Conference (IEEE Cat. No.04CH37551) KW - DC/DC converter Y1 - 2023 SP - 4655 EP - 4661 PB - IEEE ER - TY - CHAP A1 - Gerber, M. A1 - Ferreira, J.A. A1 - Hofsajer, I.W. A1 - Seliger, Norbert T1 - Integral design of a high power density DC/DC converter for harsh environments T2 - European Conference on Power Electronics and Applications KW - DC/DC converter Y1 - 2023 PB - IEEE ER - TY - JOUR A1 - Gerber, M. A1 - Ferreira, J.A. A1 - Hofsajer, I.W. A1 - Seliger, Norbert T1 - A high-density heat-sink-mounted inductor for automotive applications JF - IEEE Transactions on Industry Applications KW - inductor Y1 - 2023 VL - 40 IS - 4 SP - 1031 EP - 1038 PB - IEEE ER - TY - CHAP A1 - Gerber, M. A1 - Ferreira, J.A. A1 - Seliger, Norbert A1 - Hofsajer, I.W. T1 - Design and evaluation of an automotive integrated system module T2 - Conference Record of the 2005 Industry Applications Conference KW - power module Y1 - 2023 SP - 1144 EP - 1151 PB - IEEE ER - TY - CHAP A1 - Gerber, M. A1 - Ferreira, J.A. A1 - Hofsajer, I.W. A1 - Seliger, Norbert T1 - A very high density, heatsink mounted inductor for automotive applications T2 - Conference Record of the 2002 IEEE Industry Applications Conference. 37th IAS Annual Meeting (Cat. No.02CH37344) KW - inductor Y1 - 2023 U6 - https://doi.org/10.1109/IAS.2002.1042672 SP - 948 EP - 954 PB - IEEE ER - TY - CHAP A1 - Gerber, M. A1 - Ferreira, J.A. A1 - Hofsajer, I.W. A1 - Seliger, Norbert T1 - A volumetric optimization of a low pass filter T2 - Conference Record of the 2001 IEEE Industry Applications Conference. 36th IAS Annual Meeting (Cat. No.01CH37248) KW - low pass filter Y1 - 2023 U6 - https://doi.org/10.1109/IAS.2001.955934 SP - 2224 EP - 2231 PB - IEEE ER - TY - CHAP A1 - Gerber, M. A1 - Ferreira, J.A. A1 - Hofsajer, I.W. A1 - Seliger, Norbert T1 - A high power density DC/DC converter for automotive applications T2 - SAUPEC 2002 Proceedings of the Eleventh Southern African Universities Power Engineering Conference KW - DC/DC converter Y1 - 2023 PB - IEEE ER - TY - CHAP A1 - Gerber, M. A1 - Ferreira, J.A. A1 - Hofsajer, I.W. A1 - Seliger, Norbert T1 - High temperature, high power density packaging for automotive applications T2 - IEEE 34th Annual Conference on Power Electronics Specialist, 2003. PESC '03. N2 - The automotive industry is pushing power electronic packaging to higher operating and heatsink temperatures while still requiring very high power densities due to limited space. Currently, the power electronics that is implemented within the engine compartment of the vehicle must operate with heatsink temperatures of approximately 85/spl deg/C and this temperature can be expected to increase to 125/spl deg/C in the near future. The high temperature operation of the power electronic structure is fundamentally limited by the employed materials maximum temperatures. A packaging concept is introduced that describes a structure realisation that enables the materials to operate at high ambient temperatures without exceeding their individual maximum temperatures. This in turn allows the complete power electronic structure to operate at a higher system temperature. In this paper, the packaging concept that can be used to meet these difficult requirements of high temperature and high power-density is introduced, discussed and implemented. Two case studies are considered and implemented to illustrate the packaging concept. KW - high temperature electronic packaging Y1 - 2003 U6 - https://doi.org/10.1109/PESC.2003.1218329 SP - 425 EP - 430 PB - IEEE ER -