TY - CHAP A1 - Seliger, Norbert T1 - Zuverlässigkeit mechatronischer Systeme: Bewertung der Lebensdauer der Leistungselektronik T2 - Internationales Forum Mechatronik KW - Lebensdauer Kondensatoren KW - Zuverlässigkeit KW - PFC KW - Reliability Y1 - 2012 ER - TY - CHAP A1 - Weidner, Karl A1 - Kaspar, Michael A1 - Seliger, Norbert T1 - Planar Interconnect Technology for Power Module System Integration T2 - 7th International Conference on Integrated Power Electronics Systems (CIPS) N2 - The recent developments in power semiconductor devices and increasing demands on reliability as well as on operation performance require innovative package technologies. Such a novel package technique based on a Planar Interconnect Technology (SiPLIT®) for power modules is introduced in this work. This package features thick Cu interconnects on a high-reliable insulating film for power semiconductor chip top contacts. Due to the conductor structure and contact technology, on-resistance and stray inductances are very low compared to state-of-the-art Al wire bonds. In addition, large area contacting improves the power cycling capability and surge current robustness significantly. These remark-able properties have been verified on several prototype modules where the manufacturing process has also been optimised in terms of cost-effectiveness, system integration and maturity for series production. KW - planar interconnect technology KW - power module system integration KW - power semiconductor devices KW - reliability KW - innovative package KW - SiPLIT KW - power cycling capability Y1 - 2012 SP - 13.1 PB - VDE-VERLAG GMBH ER - TY - CHAP A1 - Versen, Martin A1 - Bernhardt, A1 - Heigl, M. A1 - Viehhauser, P. A1 - Zentgraf, P. T1 - System for real-time data acquisition and processing on a hail-fighter aeroplane T2 - Proceedings of the 5th European DSP Education and Research Conference N2 - The System HAILsens implements a device for Real-Time sensor data processing, running on a Texas Instruments Concerto M3 core. An I2C interface is used for sensor communications. Ethernet with UDP on a custom developed three layered frame organisation of sensor data serves as a link to the main system on board of an aeroplane. For backing up the acquired data, all frames are locally stored on an SD Card. To have the possibility of easily checking the current system status, an LCD module and a push-button provide a minimal user interface. KW - sensors KW - aircraft instrumentation KW - data acquisition KW - liquid crystal displays Y1 - 2018 ER -