TY - CHAP A1 - Seliger, Norbert A1 - Fuerboeck, C. A1 - Habas, P. A1 - Pogany, D. A1 - Gornik, E. T1 - Backside-Laserprober Technique for Characterisation of Semiconductor Power Devices T2 - Proceedings of the Seminar Basics and Technology of Electronic Devices Y1 - 2023 SP - 143 EP - 147 ER - TY - CHAP A1 - Versen, Martin ED - Gandhi, Tejinder T1 - DRAM Failure Analysis and Defect Localization Techniques T2 - Microelectronics Failure Analysis, Desk Reference KW - Failure Analysis Y1 - 2019 SN - 978-1-62708-247-1 SP - 499 EP - 505 PB - ASM International CY - Ohio ET - Seventh Edition ER - TY - CHAP A1 - Versen, Martin T1 - DRAM Failure Analysis and Defect Localization Techniques, Microelectronics Failure Analysis T2 - Desk Reference Sixth Edition N2 - Comprehensive guide to the process and test methods used for electronic device failure analysis. Contains dozens of articles—contributed by industry experts—covering a wide range of topics involving the failure analysis of microelectronics. It places the most important and up-to-date information on this subject at your fingertips.  Topic coverage includes:  Failure Analysis Process Flow Failure Verification  Failure Modes and Failure Classification  Special Devices (MEMS, Optoelectronics, Passives)  Fault Localization Techniques: Package Level (NDT)  Die Level (Depackaging, Photon Emission, Microthermography, Laser-Based Methods, Particle Beam Methods)  Deprocessing & Imaging Techniques: Deprocessing  General Imaging Techniques  Local Deprocessing & Imaging  Circuit Edit and Design Modification  Material Analysis Techniques  Reference Information: Important Topics for Semiconductor Devices  Failure Analysis Techniques Roadmap  Failure Analysis Operations and Management  Appendices: Failure Analysis Terms, Definitions, and Acronyms  Industry Standards KW - Microelectronics KW - DRAM Failure Analysis Y1 - 2018 PB - ASM International CY - Ohio ER -