TY - JOUR A1 - Gerber, M. A1 - Ferreira, J.A. A1 - Hofsajer, I.W. A1 - Seliger, Norbert T1 - A high-density heat-sink-mounted inductor for automotive applications JF - IEEE Transactions on Industry Applications KW - inductor Y1 - 2023 VL - 40 IS - 4 SP - 1031 EP - 1038 PB - IEEE ER - TY - JOUR A1 - Gerber, M. A1 - Ferreira, J.A. A1 - Seliger, Norbert A1 - Hofsajer, I.W. T1 - High density packaging of the passive components in an automotive DC/DC converter JF - IEEE Transactions on Power Electronics KW - DC/DC converter Y1 - 2023 VL - 20 IS - 2 SP - 268 EP - 275 PB - IEEE ER - TY - JOUR A1 - Gerber, M. A1 - Ferreira, J.A. A1 - Seliger, Norbert A1 - Hofsajer, I.W. T1 - Integral 3-D thermal, electrical and mechanical design of an automotive DC/DC converter JF - IEEE Transactions on Power Electronics KW - DC/DC converter Y1 - 2023 VL - 20 IS - 3 SP - 566 EP - 575 PB - IEEE ER - TY - JOUR A1 - Fürböck, C. A1 - Pogany, D. A1 - Litzenberger, M. A1 - Gornik, E. A1 - Seliger, Norbert A1 - Gossner, H. A1 - Müller-Lynch, T. A1 - Stecher, M. A1 - Werner, W. T1 - Interferometric temperature mapping during ESD stress and failure analysis of smart power technology ESD protection devices JF - Journal of Electrostatics KW - ESD KW - smart power device Y1 - 2023 VL - 49 SP - 195 EP - 213 ER - TY - JOUR A1 - Seliger, Norbert A1 - Faltlhauser, Georg T1 - Progressive Expansion Sampling of Quasi-Static Magnetic Fields in Unconfined Regions JF - IEEE Transactions on Components, Packaging and Manufacturing Technology N2 - We present a fast and accurate measurement technique for quasi-static magnetic fields by employing a progressive sampling method in an unconfined input space. The proposed machine learning algorithm is tested against uniform sampling on printed circuit board test structures and a buck converter. We prove allocation of multiple, separated regions with predefined lateral field limits at MHz frequencies. The feasibility of equivalent magnetic dipole source modeling based on a small number of samples is demonstrated. Compared to uniform testing, progressive expansion sampling identifies contours of given field limits in less than 3% of the reference measurement time. KW - Progressive Expansion Sampling KW - Near-Field Scanning KW - Machine Learning KW - Gaussian Process Classifier KW - MoM modeling Y1 - 2023 U6 - https://doi.org/10.1109/TCPMT.2023.3283285 ER - TY - JOUR A1 - Pogany, D. A1 - Seliger, Norbert A1 - Litzenberger, M. A1 - Gossner, H. A1 - Stecher, M. A1 - Müller-Lynch, T. A1 - Werner, W. A1 - Gornik, E. T1 - Damage analysis in smart-power technology electrostatic discharge (ESD) protection devices JF - Microelectronics Reliability Y1 - 2023 U6 - https://doi.org/10.1016/S0026-2714(99)00162-6 SN - 0026-2714 VL - 39 IS - 6 SP - 1143 EP - 1148 ER - TY - JOUR A1 - Seliger, Norbert A1 - Wolfgang, E. A1 - Lefranc, G. A1 - Berg, H. A1 - Licht, T. T1 - Reliable power electronics for automotive applications JF - Microelectronics Reliability Y1 - 2023 U6 - https://doi.org/10.1016/S0026-2714(02)00197-X SN - 0026-2714 VL - 42 IS - 9-11 SP - 1597 EP - 1604 ER - TY - JOUR A1 - Fürböck, C. A1 - Litzenberger, M. A1 - Pogany, D. A1 - Gornik, E. A1 - Seliger, Norbert A1 - Müller-Lynch, T. A1 - Stecher, M. A1 - Goßner, H. A1 - Werner, W. T1 - Laser interferometric method for ns-time scale thermal mapping of Smart Power ESD protection devices during ESD stress JF - Microelectronics Reliability Y1 - 2023 U6 - https://doi.org/10.1016/S0026-2714(99)00124-9 SN - 0026-2714 VL - 39 IS - 6 SP - 925 EP - 930 ER - TY - JOUR A1 - Ramminger, S. A1 - Seliger, Norbert A1 - Wachutka, G. T1 - Reliability model for Al wire bonds subjected to heel crack failures JF - Microelectronics Reliability Y1 - 2023 U6 - https://doi.org/10.1016/S0026-2714(00)00139-6 SN - 0026-2714 VL - 40 IS - 8 SP - 1521 EP - 1525 ER - TY - JOUR A1 - Castellazzi, A. A1 - Kraus, R. A1 - Seliger, Norbert A1 - Schmitt-Landsiedel, D. T1 - Reliability analysis of power MOSFET’s with the help of compact models and circuit simulation JF - Microelectronics Reliability Y1 - 2023 U6 - https://doi.org/10.1016/S0026-2714(02)00198-1 SN - 0026-2714 VL - 42 IS - 9 SP - 1605 EP - 1610 ER - TY - JOUR A1 - Castellazzi, A. A1 - Kartal, V. A1 - Kraus, R. A1 - Seliger, Norbert A1 - Honsberg-Riedl, M. A1 - Schmitt-Landsiedel, D. T1 - Hot-Spot Meaurements and Analysis of Electro-Thermal Effects in Low-Voltage Power-MOSFET’s JF - Microelectronics Reliability Y1 - 2023 U6 - https://doi.org/10.1016/S0026-2714(03)00319-6 SN - 0026-2714 VL - 43 IS - 9 SP - 1877 EP - 1882 ER - TY - JOUR A1 - Coquery, G. A1 - Lefranc, G. A1 - Licht, T. A1 - Lallemand, R. A1 - Seliger, Norbert A1 - Berg, H. T1 - High temperature reliability on automotive power modules verified by power cycling tests up to 150°C JF - Microelectronics Reliability Y1 - 2023 U6 - https://doi.org/10.1016/S0026-2714(03)00318-4 SN - 0026-2714 VL - 43 IS - 9 SP - 1871 EP - 1876 ER - TY - JOUR A1 - Gerber, M. A1 - Ferreira, J.A. A1 - Hofsajer, I.W. A1 - Seliger, Norbert T1 - A volumetric optimization of a low-pass filter JF - IEEE Transactions on Industry Applications KW - DC-DC power converters KW - Electronic packaging thermal management KW - Industry Applications Society KW - Integrated circuit interconnections KW - Low pass filters KW - Magnetic separation KW - Manufacturing KW - Power electronics KW - Power system interconnection Y1 - 2023 U6 - https://doi.org/10.1109/TIA.2002.802996 SN - 1939-9367 VL - 38 IS - 5 SP - 1432 EP - 1440 ER - TY - JOUR A1 - Kanert, W. A1 - Dettmer, H. A1 - Plikat, B. A1 - Seliger, Norbert T1 - Reliability aspects of semiconductor devices in high temperature applications JF - Microelectronics Reliability Y1 - 2023 U6 - https://doi.org/10.1016/S0026-2714(03)00313-5 SN - 0026-2714 VL - 43 IS - 9 SP - 1839 EP - 1846 ER - TY - JOUR A1 - Gerber, M. A1 - Seliger, Norbert A1 - Ferreira, J. A. A1 - Hofsajer, I. W. T1 - Magnetic component miniaturisation for application in power electronic modules JF - 4th International Conference on Integrated Power Systems KW - Windings KW - Heating Y1 - 2023 UR - https://ieeexplore.ieee.org/document/5758070 SP - 1 EP - 6 ER - TY - JOUR A1 - Pogany, D. A1 - Seliger, Norbert A1 - Lalinsky, T. A1 - Kuzmik, J. A1 - Habas, P. A1 - Hrkut, P. A1 - Gornik, E. T1 - Study of Thermal Effects in GaAs Micromachined Power Sensor Microsystems by an Optical Interferometer Technique JF - Microelectronics Journal Y1 - 2023 U6 - https://doi.org/10.1016/S0026-2692(97)00057-8 VL - 29 IS - 4-5 SP - 191 EP - 198 ER - TY - JOUR A1 - Seliger, Norbert A1 - Gornik, E. A1 - Pogany, D. A1 - Fuerboeck, C. A1 - Habas, P. A1 - Thalhammer, R. A1 - Stoisiek, M. T1 - Characterisation of Semiconductor Devices by Infrared Laser Interferometry JF - E&I Elektrotechnik und Informationstechnik, Sonderheft Trends in der Mikrotechnik Y1 - 2023 U6 - https://doi.org/10.1007/BF03159611 IS - 7-8 SP - 403 EP - 403 ER - TY - JOUR A1 - Pogany, D. A1 - Seliger, Norbert A1 - Gornik, E. A1 - Stoisiek, M. A1 - Lalinsky, T. T1 - Analysis of the temperature evolution from the time resolved thermo-optical interferometric measurements with few Fabry-Perot peaks JF - Journal of Applied Physics Y1 - 2023 U6 - https://doi.org/10.1063/1.368674 VL - 84 IS - 8 SP - 4495 EP - 4501 ER - TY - JOUR A1 - Fuerboeck, C. A1 - Seliger, Norbert A1 - Pogany, D. A1 - Litzenberger, M. A1 - Gornik, E. A1 - Stecher, M. A1 - Gosser, H. A1 - Werner, W. T1 - Backside laserprober characterization of thermal effects during high current stress in smart power ESD protection devices JF - International Electron Devices Meeting (IEDM ’98) Technical Digest Y1 - 2023 U6 - https://doi.org/10.1109/IEDM.1998.746451 SP - 691 EP - 694 ER - TY - JOUR A1 - Seliger, Norbert A1 - Habas, P. A1 - Pogany, D. A1 - Gornik, E. T1 - Time-Resolved Analysis of Self-Heating in Power VDMOSFETs Using Backside-Laserprobing JF - Solid-State Electronics Y1 - 2023 U6 - https://doi.org/10.1016/S0038-1101(97)00131-7 VL - 41 IS - 9 SP - 1285 EP - 1292 ER -