TY - CHAP A1 - Seliger, Norbert A1 - Ramminger, S. A1 - Franke, T. A1 - Wachutka, G. T1 - A study of heel crack failures in wire bonds under mechanical cycling T2 - Proceedings of Micromat 2000 KW - wire bond KW - reliability KW - heel crack Y1 - 2023 ER - TY - CHAP A1 - Weidner, Karl A1 - Kaspar, Michael A1 - Seliger, Norbert T1 - Planar Interconnect Technology for Power Module System Integration T2 - 7th International Conference on Integrated Power Electronics Systems (CIPS) N2 - The recent developments in power semiconductor devices and increasing demands on reliability as well as on operation performance require innovative package technologies. Such a novel package technique based on a Planar Interconnect Technology (SiPLITĀ®) for power modules is introduced in this work. This package features thick Cu interconnects on a high-reliable insulating film for power semiconductor chip top contacts. Due to the conductor structure and contact technology, on-resistance and stray inductances are very low compared to state-of-the-art Al wire bonds. In addition, large area contacting improves the power cycling capability and surge current robustness significantly. These remark-able properties have been verified on several prototype modules where the manufacturing process has also been optimised in terms of cost-effectiveness, system integration and maturity for series production. KW - planar interconnect technology KW - power module system integration KW - power semiconductor devices KW - reliability KW - innovative package KW - SiPLIT KW - power cycling capability Y1 - 2012 SP - 13.1 PB - VDE-VERLAG GMBH ER -