<?xml version="1.0" encoding="utf-8"?>
<export-example>
  <doc>
    <id>3000</id>
    <completedYear>2025</completedYear>
    <publishedYear/>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst/>
    <pageLast/>
    <pageNumber>9</pageNumber>
    <edition/>
    <issue/>
    <volume/>
    <type>conferenceobject</type>
    <publisherName>IEEE</publisherName>
    <publisherPlace/>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>2025-04-28</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">Introducing Environmental Sustainability in an RF and EMC Lab Course Utilizing Reusable, Recyclable and Biodegradable Circuits</title>
    <abstract language="eng">We propose to introduce environmental sustainability in a radio frequency (RF) and electromagnetic compatibility (EMC) laboratory course for an electrical engineering bachelor’s program utilizing reusable, easily recyclable and ecologically harmless (biodegradable) circuits. Our concept is based on the replacement of state-of-the-art printed circuit boards by substrates with mechanically structured adhesive Cu and Zinc films. Furthermore, organic based circuit carriers can be substituted by biodegradable paper substrates. As an example for the RF lab, we discuss the design, simulation and experimental characterization of a microwave low-pass&#13;
filter with 1.2GHz cut-off frequency. Secondly, for an EMC lab we suggest a prototype for power integrity (PI) studies based on the current imbalance method for reducing common mode radiated emission. As a novel feature during the lab course, the instructor in addition gives a&#13;
lecture highlighting the electronic waste challenge, which is accompanied by group discussions on sustainability and recycling. As a final lab course task students are asked to disassemble the boards or prepare them for reuse, followed by material sorting and submission to recycling&#13;
institutions.</abstract>
    <parentTitle language="eng">Proceedings IEEE educon 2025</parentTitle>
    <identifier type="doi">10.1109/EDUCON62633.2025.11016365</identifier>
    <enrichment key="PeerReviewed">Ja</enrichment>
    <enrichment key="RS_Correlation">Ja</enrichment>
    <enrichment key="OpusConferenceName">IEEE Global Engineering Education Conference (IEEE EDUCON 2025)</enrichment>
    <enrichment key="conference_date">April 22-25, 2025</enrichment>
    <enrichment key="OpusConferencePlace">London, United Kingdom</enrichment>
    <enrichment key="opus.source">publish</enrichment>
    <enrichment key="review.accepted_by">2</enrichment>
    <author>Norbert Seliger</author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Microstrip Filters</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Electromagnetic Compatibility</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Printed Circuits</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Electronics Engineering Education</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Electromagnetic Engineering Education</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Biodegradable Electronics</value>
    </subject>
    <collection role="ddc" number="600">Technik, Technologie</collection>
    <collection role="institutes" number="">Fakultät für Ingenieurwissenschaften</collection>
    <thesisPublisher>Technische Hochschule Rosenheim</thesisPublisher>
  </doc>
</export-example>
