<?xml version="1.0" encoding="utf-8"?>
<export-example>
  <doc>
    <id>1254</id>
    <completedYear>2019</completedYear>
    <publishedYear>2018</publishedYear>
    <thesisYearAccepted/>
    <language>deu</language>
    <pageFirst/>
    <pageLast/>
    <pageNumber/>
    <edition/>
    <issue/>
    <volume/>
    <type>doctoralthesis</type>
    <publisherName/>
    <publisherPlace/>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>2019-01-11</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>2018-10-12</thesisDateAccepted>
    <title language="deu">Werkstoffeinflüsse auf den Spritzgussprozess von hochgefüllten Phenol-Formaldehydharz­ Formmassen</title>
    <abstract language="deu">Im Rahmen der vorliegenden Arbeit wurden verschiedene duroplastische Formmassen laboranalytisch hinsichtlich der rheologischen und thermischen Eigenschaften untersucht. Es wurde u.a. gezielt die absolute Materialfeuchte gesteigert, um den Einfluss dieser auf das Fließ­ Härtungsverhalten zu charakterisieren. Anschließend wurden die Materialien auf einer hochinstrumentierten Spritzgussmaschine mit einem Fließspiralenwerkzeug untersucht. Dabei konnte ein direkter Zusammenhang zwischen dem Rückfluss und dem Plastifizierdrehmoment in Abhängigkeit der Materialfeuchte und der Prozessparameter detektiert werden . Des Weiteren wurden über die Differenzdruckmessung im Fließspiralenwerkzeug die scheinbaren Viskositäten über den Fließweg ermittelt. Hierbei konnten unterschiedliche Aufschmelzeffekte über die Fließweglänge in Abhängigke it der duroplastischen Formmasse, der absoluten Materialfeuchte und der Prozessparameter detektiert werden . Durch Schererwärmung konnte die Formmassentemperatur teilweise die Werkzeugtemperatur übersteigen. Hinsichtlich der mechanischen Eigenschaften (Schlagzähigkeit, Biegefestigkeit) konnten keine signifikanten Einflussgrößen detektiert werden. Hinsichtlich des Tg konnten systematischen Unterschiede detektiert und begründet werden. Die beste Möglichkeit zur Ermittlung des Tg lieferte die TMA. Die thermischen Glasübergänge korrelieren mit den in der DSC ermittelten Aushärtegraden , wobei mit steigender Materialfeuchte ein geringer Aushärtegrad detektiert wird.</abstract>
    <identifier type="url">http://nbn-resolving.de/urn:nbn:de:bsz:ch1-qucosa2-322005</identifier>
    <enrichment key="RS_Correlation">Ja</enrichment>
    <author>Thomas Scheffler</author>
    <subject>
      <language>deu</language>
      <type>uncontrolled</type>
      <value>Duroplaste</value>
    </subject>
    <subject>
      <language>deu</language>
      <type>uncontrolled</type>
      <value>duroplastische Formmassen</value>
    </subject>
    <subject>
      <language>deu</language>
      <type>uncontrolled</type>
      <value>Phenolharz</value>
    </subject>
    <subject>
      <language>deu</language>
      <type>uncontrolled</type>
      <value>Feuchtegehalt</value>
    </subject>
    <subject>
      <language>deu</language>
      <type>uncontrolled</type>
      <value>Rotationsrheometer</value>
    </subject>
    <subject>
      <language>deu</language>
      <type>uncontrolled</type>
      <value>Hochdruck-DSC</value>
    </subject>
    <subject>
      <language>deu</language>
      <type>uncontrolled</type>
      <value>Fließspirale</value>
    </subject>
    <subject>
      <language>deu</language>
      <type>uncontrolled</type>
      <value>Forminnendruckmessung</value>
    </subject>
    <subject>
      <language>deu</language>
      <type>uncontrolled</type>
      <value>Aushärtegrad</value>
    </subject>
    <collection role="ddc" number="600">Technik, Technologie</collection>
    <collection role="institutes" number="">Fakultät für Ingenieurwissenschaften</collection>
    <thesisPublisher>Technische Hochschule Rosenheim</thesisPublisher>
    <thesisGrantor>Technische Universität Chemnitz</thesisGrantor>
  </doc>
  <doc>
    <id>1328</id>
    <completedYear>2019</completedYear>
    <publishedYear/>
    <thesisYearAccepted/>
    <language>deu</language>
    <pageFirst/>
    <pageLast/>
    <pageNumber>2</pageNumber>
    <edition/>
    <issue>07</issue>
    <volume>07/2019</volume>
    <type>contributiontoperiodical</type>
    <publisherName>Hüthig GmbH</publisherName>
    <publisherPlace>Heidelberg</publisherPlace>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="deu">GmbH – Glasfaserhybride mit bester Haftung: Variotherme Temperierung für Organobleche</title>
    <abstract language="deu">Durch Integrieren der Variothermie können Organobleche wirtschaftlich und technisch verbessert zu Hybridbauteilen verarbeitet werden. Somit steigert sich der Wettbewerbsvorteil gegenüber konventionellen Werkstoffen weiter. An einer Technische Hochschule wird seit mehr als zehn Jahren intensiv an der Thematik der Verbindungstechnologien sowie den Haftungsmechanismen zwischen endlosfaserverstärkten Thermoplasten, den sogenannten Organoblechen, und angespritzten Funktionsstrukturen geforscht. Im Fokus stehen prozesstechnische Einflüsse, die die Verbundhaftung der Hybridleichtbaustrukturen erhöhen.</abstract>
    <parentTitle language="deu">Plastverarbeiter</parentTitle>
    <identifier type="url">https://www.plastverarbeiter.de/88054/variotherme-temperierung-fuer-organobleche/</identifier>
    <enrichment key="RS_Acronym">OrganoRipp</enrichment>
    <enrichment key="RS_Correlation">Ja</enrichment>
    <enrichment key="RS_ProjectTitle">Bewertung und Optimierung der Verbundhaftung von  angespritzten Verstärkungsrippen auf Organoblechen  mittels konturnaher, variothermer Temperierung  und Parameterstudien“</enrichment>
    <enrichment key="RS_FundingAgency">AiF Projekt GmbH</enrichment>
    <enrichment key="RS_GrantNumber">KF3325202US4</enrichment>
    <enrichment key="opus.doi.autoCreate">false</enrichment>
    <enrichment key="opus.urn.autoCreate">true</enrichment>
    <author>Sabine Hummel</author>
    <author>Micheal Schemme</author>
    <author>Peter Karlinger</author>
    <subject>
      <language>deu</language>
      <type>uncontrolled</type>
      <value>Organoblech</value>
    </subject>
    <subject>
      <language>deu</language>
      <type>uncontrolled</type>
      <value>Variotherm</value>
    </subject>
    <subject>
      <language>deu</language>
      <type>uncontrolled</type>
      <value>Verbundhaftung</value>
    </subject>
    <subject>
      <language>deu</language>
      <type>uncontrolled</type>
      <value>langfaser verstärkte Thermoplaste</value>
    </subject>
    <collection role="ddc" number="600">Technik, Technologie</collection>
    <collection role="institutes" number="">Fakultät für Ingenieurwissenschaften</collection>
    <collection role="institutes" number="">Forschung und Entwicklung</collection>
    <thesisPublisher>Technische Hochschule Rosenheim</thesisPublisher>
  </doc>
  <doc>
    <id>1662</id>
    <completedYear>2021</completedYear>
    <publishedYear/>
    <thesisYearAccepted/>
    <language>deu</language>
    <pageFirst>87</pageFirst>
    <pageLast>111</pageLast>
    <pageNumber/>
    <edition/>
    <issue>2</issue>
    <volume>2021</volume>
    <type>article</type>
    <publisherName>Carl Hanser Verlag</publisherName>
    <publisherPlace>München</publisherPlace>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="deu">Verstärkung von Polypropylen mit Holzfasern durch Direkt-Compoundierung</title>
    <abstract language="deu">Ergänzend zum bisherigen Stand der Wissenschaft und Technik wurden in dieser Veröffentlichung Fichtefasern aus einem thermo-mechanischen Aufschlussprozess über einen Spritzgusscompounder mit Polypropylen und Haftvermittler direkt compoundiert. Bei der direkten einstufigen Verarbeitung wurde ein steigender Holzfaseranteil bis 30 Gew.-% untersucht. Die Charakterisierung der Materialkombinationen erfolgte durch Zugversuche, Melt-Flow-Rate Messungen, Dichtebestimmung, Mikroskopie und Kerbschlagbiegeversuche. Bei steigendem Holzfaseranteil wird eine Steigerung der Zugeigenschaften, der Viskosität und der Dichte festgestellt. Die Kerbschlagzähigkeit bleibt bei steigendem Holzfaseranteil im Rahmen der Standardabweichung konstant, ist jedoch im Vergleich zum unveränderten Grundpolymer geringer.</abstract>
    <parentTitle language="deu">Zeitschrift Kunststofftechnik</parentTitle>
    <enrichment key="PeerReviewed">Ja</enrichment>
    <enrichment key="RS_Acronym">NFRipp</enrichment>
    <enrichment key="RS_Correlation">Ja</enrichment>
    <enrichment key="RS_FundingAgency">BMBF</enrichment>
    <enrichment key="RS_GrantNumber">13FH069PX6</enrichment>
    <enrichment key="opus.source">publish</enrichment>
    <enrichment key="opus.doi.autoCreate">false</enrichment>
    <enrichment key="opus.urn.autoCreate">false</enrichment>
    <author>Frederik Obermeier</author>
    <author>Mara Schumacher</author>
    <author>Simon Barth</author>
    <author>Peter Karlinger</author>
    <author>Michael Schemme</author>
    <author>Volker Altstädt</author>
    <subject>
      <language>deu</language>
      <type>uncontrolled</type>
      <value>Direkt-Compoundierung</value>
    </subject>
    <subject>
      <language>deu</language>
      <type>uncontrolled</type>
      <value>Spritzgusscompounder</value>
    </subject>
    <subject>
      <language>deu</language>
      <type>uncontrolled</type>
      <value>Holz</value>
    </subject>
    <subject>
      <language>deu</language>
      <type>uncontrolled</type>
      <value>Holzfaser</value>
    </subject>
    <subject>
      <language>deu</language>
      <type>uncontrolled</type>
      <value>Polypropylen</value>
    </subject>
    <collection role="ddc" number="600">Technik, Technologie</collection>
    <collection role="institutes" number="">Fakultät für Ingenieurwissenschaften</collection>
    <thesisPublisher>Technische Hochschule Rosenheim</thesisPublisher>
  </doc>
  <doc>
    <id>1851</id>
    <completedYear>2022</completedYear>
    <publishedYear/>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst>2473</pageFirst>
    <pageLast/>
    <pageNumber/>
    <edition/>
    <issue>7</issue>
    <volume>15</volume>
    <type>article</type>
    <publisherName/>
    <publisherPlace/>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">Thermoplastic Hybrid Composites with Wood Fibers: Bond Strength of Back-Injected Structures</title>
    <abstract language="eng">Due to their lightweight potential and good eco-balance, thermoplastic hybrid composites with natural fiber reinforcement have long been used in the automotive industry. A good alternative to natural fibers is wood fibers, which have similar properties but are also a single-material solution using domestic raw materials. However, there has been hardly any research into wood fibers in thermoplastic back-injected hybrid composites. This article compares the bond strength of an injection molded rib from polypropylene (PP) and wood fibers to different non-wovens. The non-wovens consisted of wood fibers (spruce) or alternatively natural fibers (kenaf, hemp), both with a polypropylene matrix. Pull-off and instrumented puncture impact tests show that, given similar parameters, the natural and wood-fiber-hybrid composites exhibit very similar trends in bond strength. Further tests using viscosity measurements, microscopy, and computed tomography confirm the results. Wood-fiber-reinforced thermoplastic hybrid composites can thus compete with the natural fiber composites in terms of their mechanical behavior and therefore present a good alternative in technical semi-structural applications.</abstract>
    <parentTitle language="eng">Materials</parentTitle>
    <identifier type="url">https://doi.org/10.3390/ma15072473</identifier>
    <enrichment key="PeerReviewed">Ja</enrichment>
    <enrichment key="RS_Acronym">NFRipp</enrichment>
    <enrichment key="RS_Correlation">Ja</enrichment>
    <enrichment key="RS_ProjectTitle">Prozess- und Materialtechnische Untersuchungen von Hybridverbundstrukturen mit nachwachsenden Rohstoffen in Form von Natur- und Holzfasern</enrichment>
    <enrichment key="RS_FundingAgency">BMBF</enrichment>
    <enrichment key="RS_GrantNumber">13FH069PX6</enrichment>
    <enrichment key="opus.source">publish</enrichment>
    <enrichment key="opus.doi.autoCreate">false</enrichment>
    <enrichment key="opus.urn.autoCreate">true</enrichment>
    <author>Frederik Obermeier</author>
    <author>Peter Karlinger</author>
    <author>Michael Schemme</author>
    <author>Volker Altstädt</author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>biocomposites</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>wood fibers</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>polypropylene</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>back-injection molding</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>bond strength</value>
    </subject>
    <collection role="ddc" number="600">Technik, Technologie</collection>
    <collection role="institutes" number="">Fakultät für Ingenieurwissenschaften</collection>
    <thesisPublisher>Technische Hochschule Rosenheim</thesisPublisher>
  </doc>
  <doc>
    <id>1810</id>
    <completedYear>2021</completedYear>
    <publishedYear/>
    <thesisYearAccepted/>
    <language>deu</language>
    <pageFirst>1</pageFirst>
    <pageLast>12</pageLast>
    <pageNumber>12</pageNumber>
    <edition/>
    <issue/>
    <volume/>
    <type>conferenceobject</type>
    <publisherName>Technische Universität Chemnitz</publisherName>
    <publisherPlace>Chemnitz</publisherPlace>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="deu">Verbundhaftung von thermoplastischen Hybridverbunden mit Natur-und Holzfaserverstärkung</title>
    <abstract language="deu">Leichtbau, ressourcenschonende Herstellungstechnologien und die Verwendung nachwachsender Rohstoffe sind zentrale Themen des 21. Jahrhunderts. Thermoplastische Hybridverbunde mit Naturfaserverstärkung sind seit langem Stand der Technik und werden vor allem in der Automobilindustrie verwendet. Holzfasern sind in diesem Bereich jedoch noch nicht umfassend untersucht.&#13;
Der Vortrag befasst sich mit dem Potenzial von Holzfasern (Fichte) für thermoplastische Hybridverbunde im Vergleich zu Naturfasern (Kenaf, Hanf). Dabei werden mechanische Untersuchungen (Kopf-Zug-Versuch und instrumentierter Durchstoßversuch) von zwei hybriden Bauteilen gezeigt. Die Verbundhaftung wird bei unterschiedlichen Schädigungsmechanismen in Abhängigkeit ausgewählter Parameter dargestellt. Die relevanten Effekte werden ergänzend durch Mikroskopie und Computertomographie beschrieben. &#13;
Es zeigt sich, dass thermoplastische Hybridverbunde mit Holzfasern mit dem Benchmark aus Naturfasern mechanisch konkurrieren können. Zudem zeigen Holzfasern andere Vorteile wie geringe Rohstoffrisiken.</abstract>
    <parentTitle language="deu">Technomer 2021</parentTitle>
    <identifier type="isbn">978-3-939382-15-7</identifier>
    <enrichment key="RS_Correlation">Ja</enrichment>
    <enrichment key="opus.source">publish</enrichment>
    <author>Frederik Obermeier</author>
    <author>Peter Karlinger</author>
    <author>Michael Schemme</author>
    <author>Volker Altstädt</author>
    <subject>
      <language>deu</language>
      <type>uncontrolled</type>
      <value>Thermoplaste</value>
    </subject>
    <subject>
      <language>deu</language>
      <type>uncontrolled</type>
      <value>Holzfasern</value>
    </subject>
    <subject>
      <language>deu</language>
      <type>uncontrolled</type>
      <value>Naturfasern</value>
    </subject>
    <subject>
      <language>deu</language>
      <type>uncontrolled</type>
      <value>Hybridverbunde</value>
    </subject>
    <subject>
      <language>deu</language>
      <type>uncontrolled</type>
      <value>Verbundhaftung</value>
    </subject>
    <collection role="ddc" number="600">Technik, Technologie</collection>
    <collection role="institutes" number="">Fakultät für Ingenieurwissenschaften</collection>
    <thesisPublisher>Technische Hochschule Rosenheim</thesisPublisher>
  </doc>
  <doc>
    <id>1813</id>
    <completedYear>2021</completedYear>
    <publishedYear/>
    <thesisYearAccepted/>
    <language>deu</language>
    <pageFirst>1</pageFirst>
    <pageLast>13</pageLast>
    <pageNumber>13</pageNumber>
    <edition/>
    <issue/>
    <volume/>
    <type>conferenceobject</type>
    <publisherName>Technische Universität Chemnitz</publisherName>
    <publisherPlace>Chemnitz</publisherPlace>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="deu">Vergleich von unterschiedlichen Aufschmelzverfahren und die daraus resultierenden Eigenschaften für WPC-Spritzgussteile</title>
    <abstract language="deu">Leichtbau und ressourcenschonende Herstellungstechnologien sind zentrale Themen des 21. Jahrhunderts. Im Zuge dessen werden vermehrt Naturprodukte in der Kunststoffverarbeitung eingesetzt. Eine Sparte dabei bilden Holz-Polymer Werkstoffe (WPC), welche seit 2014 eine Verdoppelung in der Produktionsmenge erfahren haben. Dabei werden meist Holzpartikel statt Fasern als Füll- und Verstärkungsstoff eingesetzt.&#13;
Der Vortrag befasst sich mit dem Vergleich von verschiedenen Aufbereitungsmöglichkeiten von WPCs mit Holzfaserverstärkung hinsichtlich Mechanik und thermischer Schädigung des temperaturempfindlichen Holzes. Teil der Untersuchung ist die einstufige Verarbeitung mittels eines Injection-Moulding-Compounders sowie die zweistufige Verarbeitung mittels Compounder und Heiz-Kühl-Mischer mit anschließendem Urformen an der Spritzgussmaschine.</abstract>
    <parentTitle language="deu">Technomer 2021</parentTitle>
    <identifier type="isbn">978-3-939382-15-7</identifier>
    <enrichment key="RS_Correlation">Ja</enrichment>
    <enrichment key="opus.source">publish</enrichment>
    <author>Sebastian Wiedl</author>
    <author>Peter Karlinger</author>
    <author>Michael Schemme</author>
    <author>Manuela List</author>
    <subject>
      <language>deu</language>
      <type>uncontrolled</type>
      <value>Holzfasern</value>
    </subject>
    <subject>
      <language>deu</language>
      <type>uncontrolled</type>
      <value>Compoundierverfahren</value>
    </subject>
    <subject>
      <language>deu</language>
      <type>uncontrolled</type>
      <value>Spritzguss</value>
    </subject>
    <subject>
      <language>deu</language>
      <type>uncontrolled</type>
      <value>Thermische Beanspruchung</value>
    </subject>
    <subject>
      <language>deu</language>
      <type>uncontrolled</type>
      <value>Mechanik</value>
    </subject>
    <collection role="ddc" number="600">Technik, Technologie</collection>
    <collection role="institutes" number="">Fakultät für Ingenieurwissenschaften</collection>
    <thesisPublisher>Technische Hochschule Rosenheim</thesisPublisher>
  </doc>
  <doc>
    <id>2275</id>
    <completedYear>2002</completedYear>
    <publishedYear/>
    <thesisYearAccepted/>
    <language>deu</language>
    <pageFirst>120</pageFirst>
    <pageLast>128</pageLast>
    <pageNumber/>
    <edition/>
    <issue/>
    <volume/>
    <type>conferenceobject</type>
    <publisherName>MESAGO Messe- und Kongress-GmbH</publisherName>
    <publisherPlace>Stuttgart (Germany)</publisherPlace>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="deu">Kompakte und hochzuverlaessige Aufbau- und Verbindungstechnik fuer leistungselektronische Systeme am Beispiel Starter Generator</title>
    <abstract language="eng">A compact and high-reliable converter design for an Integrated Starter Generator is presented. The concept is based on integration of the power switches with both the cooling system and the DC link capacitor, which optimizes the thermal management and minimizes inductive and conductive losses. The materials and joining technologies are selected in such a way that the converter can be operated up to 125 C ambient temperature. Therefore, the water cooling system of the combustion engine can directly be used. The paper further reports on circuit simulation results verifying the converter design and on first electrical measurements obtained on a functional prototype operating under normal load conditions (6kW rated power).</abstract>
    <parentTitle language="deu">Proceedings ECT 2002: Electronics and communications in traffic systems.</parentTitle>
    <identifier type="isbn">3-7785-2885-8</identifier>
    <enrichment key="PeerReviewed">Nein</enrichment>
    <enrichment key="RS_Correlation">Nein</enrichment>
    <enrichment key="opus.source">publish</enrichment>
    <author>Norbert Seliger</author>
    <author>J. Rackles</author>
    <author>H. Schwarzbauer</author>
    <author>E. Wolfgang</author>
    <author>S. Bolz</author>
    <subject>
      <language>deu</language>
      <type>uncontrolled</type>
      <value>DC/DC converter</value>
    </subject>
    <collection role="ddc" number="600">Technik, Technologie</collection>
    <collection role="institutes" number="">Fakultät für Ingenieurwissenschaften</collection>
    <thesisPublisher>Technische Hochschule Rosenheim</thesisPublisher>
  </doc>
  <doc>
    <id>2276</id>
    <completedYear>2003</completedYear>
    <publishedYear/>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst>425</pageFirst>
    <pageLast>430</pageLast>
    <pageNumber/>
    <edition/>
    <issue/>
    <volume/>
    <type>conferenceobject</type>
    <publisherName>IEEE</publisherName>
    <publisherPlace/>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">High temperature, high power density packaging for automotive applications</title>
    <abstract language="eng">The automotive industry is pushing power electronic packaging to higher operating and heatsink temperatures while still requiring very high power densities due to limited space. Currently, the power electronics that is implemented within the engine compartment of the vehicle must operate with heatsink temperatures of approximately 85/spl deg/C and this temperature can be expected to increase to 125/spl deg/C in the near future. The high temperature operation of the power electronic structure is fundamentally limited by the employed materials maximum temperatures. A packaging concept is introduced that describes a structure realisation that enables the materials to operate at high ambient temperatures without exceeding their individual maximum temperatures. This in turn allows the complete power electronic structure to operate at a higher system temperature. In this paper, the packaging concept that can be used to meet these difficult requirements of high temperature and high power-density is introduced, discussed and implemented. Two case studies are considered and implemented to illustrate the packaging concept.</abstract>
    <parentTitle language="eng">IEEE 34th Annual Conference on Power Electronics Specialist, 2003. PESC '03.</parentTitle>
    <identifier type="doi">10.1109/PESC.2003.1218329</identifier>
    <enrichment key="PeerReviewed">Ja</enrichment>
    <enrichment key="RS_Correlation">Nein</enrichment>
    <enrichment key="opus.source">publish</enrichment>
    <enrichment key="opus.doi.autoCreate">false</enrichment>
    <enrichment key="opus.urn.autoCreate">true</enrichment>
    <author>M. Gerber</author>
    <author>J.A. Ferreira</author>
    <author>I.W. Hofsajer</author>
    <author>Norbert Seliger</author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>high temperature electronic packaging</value>
    </subject>
    <collection role="ddc" number="600">Technik, Technologie</collection>
    <collection role="institutes" number="">Fakultät für Ingenieurwissenschaften</collection>
    <thesisPublisher>Technische Hochschule Rosenheim</thesisPublisher>
  </doc>
  <doc>
    <id>2277</id>
    <completedYear>2002</completedYear>
    <publishedYear/>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst>248</pageFirst>
    <pageLast>255</pageLast>
    <pageNumber/>
    <edition/>
    <issue/>
    <volume/>
    <type>conferenceobject</type>
    <publisherName>expert verlag GmbH</publisherName>
    <publisherPlace/>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">Compact and robust power electronics packaging and interconnection technology for an Integrated Starter Generator</title>
    <parentTitle language="eng">Optimization of the Power Train in Vehicles by Using the Integrated Starter Generator (ISG)</parentTitle>
    <identifier type="isbn">9783816920779</identifier>
    <enrichment key="PeerReviewed">Nein</enrichment>
    <enrichment key="RS_Correlation">Nein</enrichment>
    <enrichment key="opus.source">publish</enrichment>
    <author>Norbert Seliger</author>
    <author>J. Rackles</author>
    <author>H. Schwarzbauer</author>
    <author>W. Kiffe</author>
    <author>S. Bolz</author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>power electronics packaging</value>
    </subject>
    <collection role="ddc" number="600">Technik, Technologie</collection>
    <collection role="institutes" number="">Fakultät für Ingenieurwissenschaften</collection>
    <thesisPublisher>Technische Hochschule Rosenheim</thesisPublisher>
  </doc>
  <doc>
    <id>2278</id>
    <completedYear>2003</completedYear>
    <publishedYear/>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst/>
    <pageLast/>
    <pageNumber/>
    <edition/>
    <issue/>
    <volume/>
    <type>conferenceobject</type>
    <publisherName>expert verlag</publisherName>
    <publisherPlace/>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">Optimization of DC-Link Capacitors in an Integrated Starter Generator Unit</title>
    <parentTitle language="eng">The New Automotive 42V Power Net</parentTitle>
    <identifier type="isbn">978-3-8169-1992-6</identifier>
    <enrichment key="PeerReviewed">Nein</enrichment>
    <enrichment key="RS_Correlation">Nein</enrichment>
    <enrichment key="opus.source">publish</enrichment>
    <author>J. Rackles</author>
    <author>Norbert Seliger</author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>capacitor</value>
    </subject>
    <collection role="ddc" number="600">Technik, Technologie</collection>
    <collection role="institutes" number="">Fakultät für Ingenieurwissenschaften</collection>
    <thesisPublisher>Technische Hochschule Rosenheim</thesisPublisher>
  </doc>
  <doc>
    <id>2279</id>
    <completedYear>1999</completedYear>
    <publishedYear/>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst/>
    <pageLast/>
    <pageNumber/>
    <edition/>
    <issue/>
    <volume/>
    <type>conferenceobject</type>
    <publisherName>Gesellschaft für Mikroelektronik (GMe)</publisherName>
    <publisherPlace/>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">Internal Characterisation of IGBTs Using the Backside Laserprober Technique</title>
    <parentTitle language="eng">Jahrestagung der GMe, Bad Hofgastein Tagungsband 1999</parentTitle>
    <identifier type="isbn">3-901678-04-8</identifier>
    <enrichment key="PeerReviewed">Nein</enrichment>
    <enrichment key="RS_Correlation">Nein</enrichment>
    <enrichment key="opus.source">publish</enrichment>
    <author>C. Fürböck</author>
    <author>R. Thalhammer</author>
    <author>M. Litzenberger</author>
    <author>Norbert Seliger</author>
    <author>D. Pogany</author>
    <author>E. Gornik</author>
    <author>G. Wachutka</author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>IGBT</value>
    </subject>
    <collection role="ddc" number="600">Technik, Technologie</collection>
    <collection role="institutes" number="">Fakultät für Ingenieurwissenschaften</collection>
    <thesisPublisher>Technische Hochschule Rosenheim</thesisPublisher>
  </doc>
  <doc>
    <id>2314</id>
    <completedYear>2023</completedYear>
    <publishedYear/>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst/>
    <pageLast/>
    <pageNumber>6</pageNumber>
    <edition/>
    <issue/>
    <volume/>
    <type>conferenceobject</type>
    <publisherName>IEEE</publisherName>
    <publisherPlace>Krakov</publisherPlace>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">Progressive Expansion Sampling of Quasi-Static Magnetic Fields for EMI Noise Detection and Equivalent Source Modeling</title>
    <abstract language="eng">We introduce a quick and accurate quasi-static magnetic field scanning technique by employing a progressive sampling method in an unconfined input space. The proposed&#13;
machine learning algorithm is tested against uniform sampling on a printed circuit board test structure. We prove allocation of multiple, separated regions with predefined tangential field strengths at MHz frequencies. The feasibility of equivalent magnetic dipole source modeling based on a small number of samples is demonstrated. Compared to uniform testing, progressive expansion sampling detects contours of given field limits in less than 3% of the reference measurement time.</abstract>
    <parentTitle language="eng">Proceedings EMC Europe 2023</parentTitle>
    <enrichment key="PeerReviewed">Nein</enrichment>
    <enrichment key="RS_Correlation">Ja</enrichment>
    <enrichment key="opus.source">publish</enrichment>
    <enrichment key="opus.doi.autoCreate">false</enrichment>
    <enrichment key="opus.urn.autoCreate">true</enrichment>
    <author>Norbert Seliger</author>
    <author>Georg Faltlhauser</author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>magnetic near field</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Gaussian process classifier</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>EMI</value>
    </subject>
    <collection role="ddc" number="600">Technik, Technologie</collection>
    <collection role="institutes" number="">Fakultät für Ingenieurwissenschaften</collection>
    <thesisPublisher>Technische Hochschule Rosenheim</thesisPublisher>
  </doc>
  <doc>
    <id>2222</id>
    <completedYear>2023</completedYear>
    <publishedYear/>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst/>
    <pageLast/>
    <pageNumber>9</pageNumber>
    <edition/>
    <issue/>
    <volume/>
    <type>article</type>
    <publisherName/>
    <publisherPlace/>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">Progressive Expansion Sampling of Quasi-Static Magnetic Fields in Unconfined Regions</title>
    <abstract language="eng">We present a fast and accurate measurement technique for quasi-static magnetic fields by employing a progressive sampling method in an unconfined input space. The proposed machine learning algorithm is tested against uniform sampling on printed circuit board test structures and a buck converter. We prove allocation of multiple, separated regions with predefined lateral field limits at MHz frequencies. The feasibility of equivalent magnetic dipole source modeling based on a small number of samples is demonstrated. Compared to uniform testing, progressive expansion sampling identifies contours of given field limits in less than 3% of the reference measurement time.</abstract>
    <parentTitle language="eng">IEEE Transactions on Components, Packaging and Manufacturing Technology</parentTitle>
    <identifier type="doi">10.1109/TCPMT.2023.3283285</identifier>
    <enrichment key="PeerReviewed">Ja</enrichment>
    <enrichment key="RS_Correlation">Ja</enrichment>
    <enrichment key="opus.source">publish</enrichment>
    <enrichment key="opus.doi.autoCreate">false</enrichment>
    <enrichment key="opus.urn.autoCreate">true</enrichment>
    <author>Norbert Seliger</author>
    <author>Georg Faltlhauser</author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Progressive Expansion Sampling</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Near-Field Scanning</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Machine Learning</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Gaussian Process Classifier</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>MoM modeling</value>
    </subject>
    <collection role="ddc" number="600">Technik, Technologie</collection>
    <collection role="institutes" number="">Fakultät für Ingenieurwissenschaften</collection>
    <thesisPublisher>Technische Hochschule Rosenheim</thesisPublisher>
  </doc>
  <doc>
    <id>2262</id>
    <completedYear>2001</completedYear>
    <publishedYear/>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst>2224</pageFirst>
    <pageLast>2231</pageLast>
    <pageNumber/>
    <edition/>
    <issue/>
    <volume/>
    <type>conferenceobject</type>
    <publisherName>IEEE</publisherName>
    <publisherPlace/>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>2023-06-19</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">A volumetric optimization of a low pass filter</title>
    <parentTitle language="eng">Conference Record of the 2001 IEEE Industry Applications Conference. 36th IAS Annual Meeting (Cat. No.01CH37248)</parentTitle>
    <identifier type="doi">10.1109/IAS.2001.955934</identifier>
    <enrichment key="PeerReviewed">Ja</enrichment>
    <enrichment key="RS_Correlation">Nein</enrichment>
    <enrichment key="opus.source">publish</enrichment>
    <enrichment key="opus.doi.autoCreate">false</enrichment>
    <enrichment key="opus.urn.autoCreate">true</enrichment>
    <enrichment key="review.accepted_by">2</enrichment>
    <author>M. Gerber</author>
    <author>J.A. Ferreira</author>
    <author>I.W. Hofsajer</author>
    <author>Norbert Seliger</author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>low pass filter</value>
    </subject>
    <collection role="ddc" number="600">Technik, Technologie</collection>
    <collection role="institutes" number="">Fakultät für Ingenieurwissenschaften</collection>
    <thesisPublisher>Technische Hochschule Rosenheim</thesisPublisher>
  </doc>
  <doc>
    <id>2263</id>
    <completedYear>2002</completedYear>
    <publishedYear/>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst>948</pageFirst>
    <pageLast>954</pageLast>
    <pageNumber/>
    <edition/>
    <issue/>
    <volume/>
    <type>conferenceobject</type>
    <publisherName>IEEE</publisherName>
    <publisherPlace/>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>2023-06-19</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">A very high density, heatsink mounted inductor for automotive applications</title>
    <parentTitle language="eng">Conference Record of the 2002 IEEE Industry Applications Conference. 37th IAS Annual Meeting (Cat. No.02CH37344)</parentTitle>
    <identifier type="doi">10.1109/IAS.2002.1042672</identifier>
    <enrichment key="PeerReviewed">Ja</enrichment>
    <enrichment key="RS_Correlation">Nein</enrichment>
    <enrichment key="opus.source">publish</enrichment>
    <enrichment key="opus.doi.autoCreate">false</enrichment>
    <enrichment key="opus.urn.autoCreate">true</enrichment>
    <enrichment key="review.accepted_by">2</enrichment>
    <author>M. Gerber</author>
    <author>J.A. Ferreira</author>
    <author>I.W. Hofsajer</author>
    <author>Norbert Seliger</author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>inductor</value>
    </subject>
    <collection role="ddc" number="600">Technik, Technologie</collection>
    <collection role="institutes" number="">Fakultät für Ingenieurwissenschaften</collection>
    <thesisPublisher>Technische Hochschule Rosenheim</thesisPublisher>
  </doc>
  <doc>
    <id>2242</id>
    <completedYear>1999</completedYear>
    <publishedYear/>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst>193</pageFirst>
    <pageLast>196</pageLast>
    <pageNumber/>
    <edition/>
    <issue/>
    <volume/>
    <type>conferenceobject</type>
    <publisherName>IEEE</publisherName>
    <publisherPlace/>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>2023-06-15</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">A differential backside laserprobing technique for the investigation of the lateral temperature distribution in power devices</title>
    <parentTitle language="eng">11th International Symposium on Power Semiconductor Devices and ICs. ISPSD’99 Proceedings</parentTitle>
    <identifier type="doi">10.1109/ISPSD.1999.764095</identifier>
    <enrichment key="PeerReviewed">Ja</enrichment>
    <enrichment key="RS_Correlation">Nein</enrichment>
    <enrichment key="opus.source">publish</enrichment>
    <enrichment key="opus.doi.autoCreate">false</enrichment>
    <enrichment key="opus.urn.autoCreate">true</enrichment>
    <enrichment key="review.accepted_by">2</enrichment>
    <author>C. Fürböck</author>
    <author>R. Thalhammer</author>
    <author>M. Litzenberger</author>
    <author>Norbert Seliger</author>
    <author>D. Pogany</author>
    <author>E. Gornik</author>
    <author>G. Wachutka</author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>backside laserprobing</value>
    </subject>
    <collection role="ddc" number="600">Technik, Technologie</collection>
    <collection role="institutes" number="">Fakultät für Ingenieurwissenschaften</collection>
    <thesisPublisher>Technische Hochschule Rosenheim</thesisPublisher>
  </doc>
  <doc>
    <id>2243</id>
    <completedYear>2000</completedYear>
    <publishedYear/>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst/>
    <pageLast/>
    <pageNumber/>
    <edition/>
    <issue/>
    <volume/>
    <type>conferenceobject</type>
    <publisherName/>
    <publisherPlace/>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>2023-06-15</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">A study of heel crack failures in wire bonds under mechanical cycling</title>
    <parentTitle language="eng">Proceedings of Micromat 2000</parentTitle>
    <enrichment key="PeerReviewed">Nein</enrichment>
    <enrichment key="RS_Correlation">Nein</enrichment>
    <enrichment key="opus.source">publish</enrichment>
    <enrichment key="review.accepted_by">2</enrichment>
    <author>Norbert Seliger</author>
    <author>S. Ramminger</author>
    <author>T. Franke</author>
    <author>G. Wachutka</author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>wire bond</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>reliability</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>heel crack</value>
    </subject>
    <collection role="ddc" number="600">Technik, Technologie</collection>
    <collection role="institutes" number="">Fakultät für Ingenieurwissenschaften</collection>
    <thesisPublisher>Technische Hochschule Rosenheim</thesisPublisher>
  </doc>
  <doc>
    <id>2244</id>
    <completedYear>1999</completedYear>
    <publishedYear/>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst>241</pageFirst>
    <pageLast>250</pageLast>
    <pageNumber/>
    <edition/>
    <issue/>
    <volume/>
    <type>conferenceobject</type>
    <publisherName>IEEE</publisherName>
    <publisherPlace/>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>2023-06-15</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">Interferometric temperature mapping during ESD stress and failure analysis of smart power technology ESD protection devices</title>
    <parentTitle language="eng">Electrical Overstress/Electrostatic Discharge Symposium Proceedings</parentTitle>
    <identifier type="doi">10.1109/EOSESD.1999.819067</identifier>
    <enrichment key="PeerReviewed">Ja</enrichment>
    <enrichment key="RS_Correlation">Nein</enrichment>
    <enrichment key="opus.source">publish</enrichment>
    <enrichment key="opus.doi.autoCreate">false</enrichment>
    <enrichment key="opus.urn.autoCreate">true</enrichment>
    <enrichment key="review.accepted_by">2</enrichment>
    <author>C. Fürböck</author>
    <author>D. Pogany</author>
    <author>M. Litzenberger</author>
    <author>E. Gornik</author>
    <author>Norbert Seliger</author>
    <author>H. Gossner</author>
    <author>T. Müller-Lynch</author>
    <author>M. Stecher</author>
    <author>W. Werner</author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>ESD</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>smart power device</value>
    </subject>
    <collection role="ddc" number="600">Technik, Technologie</collection>
    <collection role="institutes" number="">Fakultät für Ingenieurwissenschaften</collection>
    <thesisPublisher>Technische Hochschule Rosenheim</thesisPublisher>
  </doc>
  <doc>
    <id>2245</id>
    <completedYear>2000</completedYear>
    <publishedYear/>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst>195</pageFirst>
    <pageLast>213</pageLast>
    <pageNumber/>
    <edition/>
    <issue/>
    <volume>49</volume>
    <type>article</type>
    <publisherName/>
    <publisherPlace/>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>2023-06-15</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">Interferometric temperature mapping during ESD stress and failure analysis of smart power technology ESD protection devices</title>
    <parentTitle language="eng">Journal of Electrostatics</parentTitle>
    <enrichment key="PeerReviewed">Ja</enrichment>
    <enrichment key="RS_Correlation">Nein</enrichment>
    <enrichment key="opus.source">publish</enrichment>
    <enrichment key="review.accepted_by">2</enrichment>
    <author>C. Fürböck</author>
    <author>D. Pogany</author>
    <author>M. Litzenberger</author>
    <author>E. Gornik</author>
    <author>Norbert Seliger</author>
    <author>H. Gossner</author>
    <author>T. Müller-Lynch</author>
    <author>M. Stecher</author>
    <author>W. Werner</author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>ESD</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>smart power device</value>
    </subject>
    <collection role="ddc" number="600">Technik, Technologie</collection>
    <collection role="institutes" number="">Fakultät für Ingenieurwissenschaften</collection>
    <thesisPublisher>Technische Hochschule Rosenheim</thesisPublisher>
  </doc>
  <doc>
    <id>2246</id>
    <completedYear>2002</completedYear>
    <publishedYear/>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst>297</pageFirst>
    <pageLast>302</pageLast>
    <pageNumber/>
    <edition/>
    <issue/>
    <volume/>
    <type>conferenceobject</type>
    <publisherName/>
    <publisherPlace/>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>2023-06-15</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">Efficient calculation of transient temperature fields responding to fast changing heatsources over long duration in high frequency DC/DC converter</title>
    <parentTitle language="eng">Proceedings of THERMINIC</parentTitle>
    <enrichment key="PeerReviewed">Ja</enrichment>
    <enrichment key="RS_Correlation">Nein</enrichment>
    <enrichment key="opus.source">publish</enrichment>
    <enrichment key="review.accepted_by">2</enrichment>
    <author>Y.C. Gerstenmaier</author>
    <author>G. Wachutka</author>
    <author>Norbert Seliger</author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>DC/DC converter</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>thermal management</value>
    </subject>
    <collection role="ddc" number="600">Technik, Technologie</collection>
    <collection role="institutes" number="">Fakultät für Ingenieurwissenschaften</collection>
    <thesisPublisher>Technische Hochschule Rosenheim</thesisPublisher>
  </doc>
  <doc>
    <id>2247</id>
    <completedYear>2007</completedYear>
    <publishedYear/>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst>563</pageFirst>
    <pageLast>568</pageLast>
    <pageNumber/>
    <edition/>
    <issue/>
    <volume/>
    <type>conferenceobject</type>
    <publisherName>IEEE</publisherName>
    <publisherPlace>Nagoya</publisherPlace>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>2023-06-15</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">Reliability of high temperature inverters for HEV</title>
    <parentTitle language="eng">Proceedings Power Conversion Conference</parentTitle>
    <identifier type="doi">10.1109/PCCON.2007.373022</identifier>
    <enrichment key="PeerReviewed">Ja</enrichment>
    <enrichment key="RS_Correlation">Nein</enrichment>
    <enrichment key="opus.source">publish</enrichment>
    <enrichment key="opus.doi.autoCreate">false</enrichment>
    <enrichment key="opus.urn.autoCreate">true</enrichment>
    <enrichment key="review.accepted_by">2</enrichment>
    <author>F. Renken</author>
    <author>G. Ehbauer</author>
    <author>V. Karrer</author>
    <author>R. Knorr</author>
    <author>S. Ramminger</author>
    <author>Norbert Seliger</author>
    <author>E. Wolfgang</author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>HEV</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Reliability</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>High-Temperature Electronics</value>
    </subject>
    <collection role="ddc" number="600">Technik, Technologie</collection>
    <collection role="institutes" number="">Fakultät für Ingenieurwissenschaften</collection>
    <thesisPublisher>Technische Hochschule Rosenheim</thesisPublisher>
  </doc>
  <doc>
    <id>2248</id>
    <completedYear>2005</completedYear>
    <publishedYear/>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst>566</pageFirst>
    <pageLast>575</pageLast>
    <pageNumber/>
    <edition/>
    <issue>3</issue>
    <volume>20</volume>
    <type>article</type>
    <publisherName>IEEE</publisherName>
    <publisherPlace/>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>2023-06-15</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">Integral 3-D thermal, electrical and mechanical design of an automotive DC/DC converter</title>
    <parentTitle language="eng">IEEE Transactions on Power Electronics</parentTitle>
    <enrichment key="PeerReviewed">Ja</enrichment>
    <enrichment key="RS_Correlation">Nein</enrichment>
    <enrichment key="opus.source">publish</enrichment>
    <enrichment key="review.accepted_by">2</enrichment>
    <author>M. Gerber</author>
    <author>J.A. Ferreira</author>
    <author>Norbert Seliger</author>
    <author>I.W. Hofsajer</author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>DC/DC converter</value>
    </subject>
    <collection role="ddc" number="600">Technik, Technologie</collection>
    <collection role="institutes" number="">Fakultät für Ingenieurwissenschaften</collection>
    <thesisPublisher>Technische Hochschule Rosenheim</thesisPublisher>
  </doc>
  <doc>
    <id>2250</id>
    <completedYear>2005</completedYear>
    <publishedYear/>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst>268</pageFirst>
    <pageLast>275</pageLast>
    <pageNumber/>
    <edition/>
    <issue>2</issue>
    <volume>20</volume>
    <type>article</type>
    <publisherName>IEEE</publisherName>
    <publisherPlace/>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>2023-06-15</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">High density packaging of the passive components in an automotive DC/DC converter</title>
    <parentTitle language="eng">IEEE Transactions on Power Electronics</parentTitle>
    <enrichment key="PeerReviewed">Ja</enrichment>
    <enrichment key="RS_Correlation">Nein</enrichment>
    <enrichment key="opus.source">publish</enrichment>
    <enrichment key="review.accepted_by">2</enrichment>
    <author>M. Gerber</author>
    <author>J.A. Ferreira</author>
    <author>Norbert Seliger</author>
    <author>I.W. Hofsajer</author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>DC/DC converter</value>
    </subject>
    <collection role="ddc" number="600">Technik, Technologie</collection>
    <collection role="institutes" number="">Fakultät für Ingenieurwissenschaften</collection>
    <thesisPublisher>Technische Hochschule Rosenheim</thesisPublisher>
  </doc>
  <doc>
    <id>2251</id>
    <completedYear>2005</completedYear>
    <publishedYear/>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst>1144</pageFirst>
    <pageLast>1151</pageLast>
    <pageNumber/>
    <edition/>
    <issue/>
    <volume/>
    <type>conferenceobject</type>
    <publisherName>IEEE</publisherName>
    <publisherPlace/>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>2023-06-15</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">Design and evaluation of an automotive integrated system module</title>
    <parentTitle language="eng">Conference Record of the 2005 Industry Applications Conference</parentTitle>
    <enrichment key="PeerReviewed">Ja</enrichment>
    <enrichment key="RS_Correlation">Nein</enrichment>
    <enrichment key="opus.source">publish</enrichment>
    <enrichment key="review.accepted_by">2</enrichment>
    <author>M. Gerber</author>
    <author>J.A. Ferreira</author>
    <author>Norbert Seliger</author>
    <author>I.W. Hofsajer</author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>power module</value>
    </subject>
    <collection role="ddc" number="600">Technik, Technologie</collection>
    <collection role="institutes" number="">Fakultät für Ingenieurwissenschaften</collection>
    <thesisPublisher>Technische Hochschule Rosenheim</thesisPublisher>
  </doc>
  <doc>
    <id>2252</id>
    <completedYear>2005</completedYear>
    <publishedYear/>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst/>
    <pageLast/>
    <pageNumber/>
    <edition/>
    <issue/>
    <volume/>
    <type>conferenceobject</type>
    <publisherName>IEEE</publisherName>
    <publisherPlace/>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>2023-06-15</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">Integral design of a high power density DC/DC converter for harsh environments</title>
    <parentTitle language="eng">European Conference on Power Electronics and Applications</parentTitle>
    <enrichment key="PeerReviewed">Ja</enrichment>
    <enrichment key="RS_Correlation">Nein</enrichment>
    <enrichment key="opus.source">publish</enrichment>
    <enrichment key="review.accepted_by">2</enrichment>
    <author>M. Gerber</author>
    <author>J.A. Ferreira</author>
    <author>I.W. Hofsajer</author>
    <author>Norbert Seliger</author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>DC/DC converter</value>
    </subject>
    <collection role="ddc" number="600">Technik, Technologie</collection>
    <collection role="institutes" number="">Fakultät für Ingenieurwissenschaften</collection>
    <thesisPublisher>Technische Hochschule Rosenheim</thesisPublisher>
  </doc>
  <doc>
    <id>2253</id>
    <completedYear>2004</completedYear>
    <publishedYear/>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst>4655</pageFirst>
    <pageLast>4661</pageLast>
    <pageNumber/>
    <edition/>
    <issue/>
    <volume/>
    <type>conferenceobject</type>
    <publisherName>IEEE</publisherName>
    <publisherPlace/>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>2023-06-15</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">Interleaving optimization in synchronous rectified DC/DC converters</title>
    <parentTitle language="eng">IEEE 35th Annual Power Electronics Specialists Conference (IEEE Cat. No.04CH37551)</parentTitle>
    <enrichment key="PeerReviewed">Ja</enrichment>
    <enrichment key="RS_Correlation">Nein</enrichment>
    <enrichment key="opus.source">publish</enrichment>
    <enrichment key="review.accepted_by">2</enrichment>
    <author>M. Gerber</author>
    <author>J.A. Ferreira</author>
    <author>I.W. Hofsajer</author>
    <author>Norbert Seliger</author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>DC/DC converter</value>
    </subject>
    <collection role="ddc" number="600">Technik, Technologie</collection>
    <collection role="institutes" number="">Fakultät für Ingenieurwissenschaften</collection>
    <thesisPublisher>Technische Hochschule Rosenheim</thesisPublisher>
  </doc>
  <doc>
    <id>2254</id>
    <completedYear>2004</completedYear>
    <publishedYear/>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst>2779</pageFirst>
    <pageLast>2785</pageLast>
    <pageNumber/>
    <edition/>
    <issue/>
    <volume/>
    <type>conferenceobject</type>
    <publisherName>IEEE</publisherName>
    <publisherPlace/>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>2023-06-15</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">An improved 3D integrated DC/DC converter for high temperature environments</title>
    <parentTitle language="eng">IEEE 35th Annual Power Electronics Specialists Conference (IEEE Cat. No.04CH37551)</parentTitle>
    <enrichment key="PeerReviewed">Ja</enrichment>
    <enrichment key="RS_Correlation">Nein</enrichment>
    <enrichment key="opus.source">publish</enrichment>
    <enrichment key="review.accepted_by">2</enrichment>
    <author>M. Gerber</author>
    <author>J.A. Ferreira</author>
    <author>I.W. Hofsajer</author>
    <author>Norbert Seliger</author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>DC/DC converter</value>
    </subject>
    <collection role="ddc" number="600">Technik, Technologie</collection>
    <collection role="institutes" number="">Fakultät für Ingenieurwissenschaften</collection>
    <thesisPublisher>Technische Hochschule Rosenheim</thesisPublisher>
  </doc>
  <doc>
    <id>2255</id>
    <completedYear>2004</completedYear>
    <publishedYear/>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst>82</pageFirst>
    <pageLast>85</pageLast>
    <pageNumber/>
    <edition/>
    <issue/>
    <volume/>
    <type>conferenceobject</type>
    <publisherName>IEEE</publisherName>
    <publisherPlace/>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>2023-06-15</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">EMC-optimised design of a converter power stage by reduction of surface currents</title>
    <parentTitle language="eng">IEEE 35th Annual Power Electronics Specialists Conference (IEEE Cat. No.04CH37551)</parentTitle>
    <enrichment key="PeerReviewed">Ja</enrichment>
    <enrichment key="RS_Correlation">Nein</enrichment>
    <enrichment key="opus.source">publish</enrichment>
    <enrichment key="review.accepted_by">2</enrichment>
    <author>A. Röhrich</author>
    <author>H. Hirsch</author>
    <author>Norbert Seliger</author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>EMC</value>
    </subject>
    <collection role="ddc" number="600">Technik, Technologie</collection>
    <collection role="institutes" number="">Fakultät für Ingenieurwissenschaften</collection>
    <thesisPublisher>Technische Hochschule Rosenheim</thesisPublisher>
  </doc>
  <doc>
    <id>2256</id>
    <completedYear>2004</completedYear>
    <publishedYear/>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst>1031</pageFirst>
    <pageLast>1038</pageLast>
    <pageNumber/>
    <edition/>
    <issue>4</issue>
    <volume>40</volume>
    <type>article</type>
    <publisherName>IEEE</publisherName>
    <publisherPlace/>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>2023-06-15</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">A high-density heat-sink-mounted inductor for automotive applications</title>
    <parentTitle language="eng">IEEE Transactions on Industry Applications</parentTitle>
    <enrichment key="PeerReviewed">Ja</enrichment>
    <enrichment key="RS_Correlation">Nein</enrichment>
    <enrichment key="opus.source">publish</enrichment>
    <enrichment key="review.accepted_by">2</enrichment>
    <author>M. Gerber</author>
    <author>J.A. Ferreira</author>
    <author>I.W. Hofsajer</author>
    <author>Norbert Seliger</author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>inductor</value>
    </subject>
    <collection role="ddc" number="600">Technik, Technologie</collection>
    <collection role="institutes" number="">Fakultät für Ingenieurwissenschaften</collection>
    <thesisPublisher>Technische Hochschule Rosenheim</thesisPublisher>
  </doc>
  <doc>
    <id>2257</id>
    <completedYear>2002</completedYear>
    <publishedYear/>
    <thesisYearAccepted/>
    <language>deu</language>
    <pageFirst/>
    <pageLast/>
    <pageNumber/>
    <edition/>
    <issue/>
    <volume/>
    <type>conferenceobject</type>
    <publisherName>ETG</publisherName>
    <publisherPlace>Bad Nauheim</publisherPlace>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>2023-06-19</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="deu">Zuverlässige Leistungselektronik für die Automobiltechnik</title>
    <parentTitle language="deu">ETG-Tagung Bauelemente der Leistungselektronik und ihre Anwendungen</parentTitle>
    <enrichment key="PeerReviewed">Nein</enrichment>
    <enrichment key="RS_Correlation">Nein</enrichment>
    <enrichment key="opus.source">publish</enrichment>
    <enrichment key="opus.doi.autoCreate">false</enrichment>
    <enrichment key="opus.urn.autoCreate">true</enrichment>
    <enrichment key="review.accepted_by">2</enrichment>
    <author>E. Wolfgang</author>
    <author>G. Lefranc</author>
    <author>Norbert Seliger</author>
    <author>H. Berg</author>
    <author>T. Licht</author>
    <subject>
      <language>deu</language>
      <type>uncontrolled</type>
      <value>Power electronics</value>
    </subject>
    <collection role="ddc" number="600">Technik, Technologie</collection>
    <collection role="institutes" number="">Fakultät für Ingenieurwissenschaften</collection>
    <thesisPublisher>Technische Hochschule Rosenheim</thesisPublisher>
  </doc>
  <doc>
    <id>2258</id>
    <completedYear>2002</completedYear>
    <publishedYear/>
    <thesisYearAccepted/>
    <language>deu</language>
    <pageFirst/>
    <pageLast/>
    <pageNumber/>
    <edition/>
    <issue/>
    <volume/>
    <type>conferenceobject</type>
    <publisherName/>
    <publisherPlace/>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>2023-06-19</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="deu">Built-in EMC in der Aufbau- und Verbindungstechnik am Beispiel des integrierten Startergenerators</title>
    <parentTitle language="deu">Proceedings Electronic &amp; Communications in Traffic Systems (ECT'02)</parentTitle>
    <enrichment key="PeerReviewed">Ja</enrichment>
    <enrichment key="RS_Correlation">Nein</enrichment>
    <enrichment key="opus.source">publish</enrichment>
    <enrichment key="review.accepted_by">2</enrichment>
    <author>A. Röhrich</author>
    <author>H. Hirsch</author>
    <author>Norbert Seliger</author>
    <subject>
      <language>deu</language>
      <type>uncontrolled</type>
      <value>EMC</value>
    </subject>
    <collection role="ddc" number="600">Technik, Technologie</collection>
    <collection role="institutes" number="">Fakultät für Ingenieurwissenschaften</collection>
    <thesisPublisher>Technische Hochschule Rosenheim</thesisPublisher>
  </doc>
  <doc>
    <id>2259</id>
    <completedYear>2002</completedYear>
    <publishedYear/>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst/>
    <pageLast/>
    <pageNumber/>
    <edition/>
    <issue/>
    <volume/>
    <type>conferenceobject</type>
    <publisherName/>
    <publisherPlace/>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>2023-06-19</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">EMC modeling of a compact packaging technology of a crankshaft starter generator</title>
    <parentTitle language="eng">International Conference of Electromagnetic Compatibility (ICEMC 2002)</parentTitle>
    <enrichment key="RS_Correlation">Nein</enrichment>
    <enrichment key="opus.source">publish</enrichment>
    <enrichment key="review.accepted_by">2</enrichment>
    <author>A. Röhrich</author>
    <author>H. Hirsch</author>
    <author>Norbert Seliger</author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>EMC modeling</value>
    </subject>
    <collection role="ddc" number="600">Technik, Technologie</collection>
    <collection role="institutes" number="">Fakultät für Ingenieurwissenschaften</collection>
    <thesisPublisher>Technische Hochschule Rosenheim</thesisPublisher>
  </doc>
  <doc>
    <id>2260</id>
    <completedYear>2004</completedYear>
    <publishedYear/>
    <thesisYearAccepted/>
    <language>deu</language>
    <pageFirst>689</pageFirst>
    <pageLast>696</pageLast>
    <pageNumber/>
    <edition/>
    <issue/>
    <volume/>
    <type>conferenceobject</type>
    <publisherName>VDE-Verlag GmbH</publisherName>
    <publisherPlace>Düsseldorf</publisherPlace>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>2023-06-19</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="deu">EMV-optimierter Entwurf durch gezielte Reduktion von Oberflächenströmen</title>
    <parentTitle language="deu">12. Internationale Fachmesse und Kongress für Elektromagnetische Verträglichkeit</parentTitle>
    <identifier type="isbn">3-8007-2810-9</identifier>
    <enrichment key="PeerReviewed">Ja</enrichment>
    <enrichment key="RS_Correlation">Nein</enrichment>
    <enrichment key="opus.source">publish</enrichment>
    <enrichment key="review.accepted_by">2</enrichment>
    <author>H. Hirsch</author>
    <author>A. Röhrich</author>
    <author>Norbert Seliger</author>
    <subject>
      <language>deu</language>
      <type>uncontrolled</type>
      <value>EMC</value>
    </subject>
    <collection role="ddc" number="600">Technik, Technologie</collection>
    <collection role="institutes" number="">Fakultät für Ingenieurwissenschaften</collection>
    <thesisPublisher>Technische Hochschule Rosenheim</thesisPublisher>
  </doc>
  <doc>
    <id>2261</id>
    <completedYear>2002</completedYear>
    <publishedYear/>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst/>
    <pageLast/>
    <pageNumber>6</pageNumber>
    <edition/>
    <issue/>
    <volume/>
    <type>conferenceobject</type>
    <publisherName>IEEE</publisherName>
    <publisherPlace/>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>2023-06-19</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">A high power density DC/DC converter for automotive applications</title>
    <parentTitle language="eng">SAUPEC 2002 Proceedings of the Eleventh Southern African Universities Power Engineering Conference</parentTitle>
    <enrichment key="PeerReviewed">Ja</enrichment>
    <enrichment key="RS_Correlation">Nein</enrichment>
    <enrichment key="opus.source">publish</enrichment>
    <enrichment key="review.accepted_by">2</enrichment>
    <author>M. Gerber</author>
    <author>J.A. Ferreira</author>
    <author>I.W. Hofsajer</author>
    <author>Norbert Seliger</author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>DC/DC converter</value>
    </subject>
    <collection role="ddc" number="600">Technik, Technologie</collection>
    <collection role="institutes" number="">Fakultät für Ingenieurwissenschaften</collection>
    <thesisPublisher>Technische Hochschule Rosenheim</thesisPublisher>
  </doc>
  <doc>
    <id>2363</id>
    <completedYear>2023</completedYear>
    <publishedYear/>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst/>
    <pageLast/>
    <pageNumber>5</pageNumber>
    <edition/>
    <issue/>
    <volume/>
    <type>conferenceobject</type>
    <publisherName>IEEE</publisherName>
    <publisherPlace>Bucharest, Romania</publisherPlace>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>2023-12-20</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">Time-variable Mutual Inductance for Enhanced Inductive Power Transmission</title>
    <abstract language="eng">Enhanced inductive power transmission (IPT) between coaxially arranged circular coils is introduced by time-modulation of the mutual inductance. This modulation is accomplished by coherent switching of the short circuit current induced in a third loop. An analytical circuit model supporting the design for future time-modulated IPT systems is derived. We demonstrate an increase in load rms-voltage by 13% (28% gain in power) compared to an unmodulated transfer on an experimental system operating at fundamental frequencies ranging from 40kHz to 500kHz.</abstract>
    <parentTitle language="eng">Proceedings International Symposium on Fundamentals of Electrical Engineering 2023 (ISFEE 2023)</parentTitle>
    <identifier type="doi">10.1109/ISFEE60884.2023.10637204</identifier>
    <identifier type="isbn">979-8-3503-0856-3</identifier>
    <enrichment key="PeerReviewed">Ja</enrichment>
    <enrichment key="RS_Correlation">Ja</enrichment>
    <enrichment key="opus.source">publish</enrichment>
    <enrichment key="review.accepted_by">2</enrichment>
    <author>Norbert Seliger</author>
    <author>Johannes Honsa</author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Mutual Inductance</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Inductive Power Transmission</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Time-variable Inductance</value>
    </subject>
    <collection role="ddc" number="600">Technik, Technologie</collection>
    <collection role="institutes" number="">Fakultät für Ingenieurwissenschaften</collection>
    <thesisPublisher>Technische Hochschule Rosenheim</thesisPublisher>
  </doc>
  <doc>
    <id>2386</id>
    <completedYear>2024</completedYear>
    <publishedYear/>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst>297</pageFirst>
    <pageLast>303</pageLast>
    <pageNumber>7</pageNumber>
    <edition/>
    <issue/>
    <volume/>
    <type>conferenceobject</type>
    <publisherName>VDE VERLAG GMBH</publisherName>
    <publisherPlace>Düsseldorf</publisherPlace>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">A high-frequency performance and degradation study of adhesive conductive EMI shielding tapes during High-Temperature Storage</title>
    <abstract language="eng">The variation of the contact impedance of adhesive conductive EMI shielding tapes under high temperature storage (HTS) of 110degC is investigated. The adhesive tapes under test are implemented as signal return paths in microstrip lines. Changes in the ground plane impedance by adhesive deterioration are analyzed by S-parameter measurements from 1MHz to 3GHz. A circuit model for contact impedance degradation is proposed and applied in simulation of board level shielding. Contact resistance and contact capacitance are found to increase significantly after 2400h, causing a declined magnetic field shielding effectiveness by 30 dB below 500 MHz.</abstract>
    <parentTitle language="eng">Proccedings CIPS 2024 - 13th International Conference on Integrated Power Electronics Systems</parentTitle>
    <identifier type="isbn">978-3-8007-6288-0</identifier>
    <identifier type="issn">0341-3934</identifier>
    <enrichment key="PeerReviewed">Ja</enrichment>
    <enrichment key="RS_Correlation">Ja</enrichment>
    <enrichment key="opus.source">publish</enrichment>
    <author>Norbert Seliger</author>
    <author>Cordula Helmbrecht</author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>EMI</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Shielding tape</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>High-Temperature Storage</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>adhesive conductive EMI shielding tape</value>
    </subject>
    <collection role="ddc" number="600">Technik, Technologie</collection>
    <collection role="institutes" number="">Fakultät für Ingenieurwissenschaften</collection>
    <thesisPublisher>Technische Hochschule Rosenheim</thesisPublisher>
  </doc>
  <doc>
    <id>2332</id>
    <completedYear>2022</completedYear>
    <publishedYear/>
    <thesisYearAccepted/>
    <language>deu</language>
    <pageFirst>36</pageFirst>
    <pageLast>41</pageLast>
    <pageNumber/>
    <edition/>
    <issue>4</issue>
    <volume>2022</volume>
    <type>contributiontoperiodical</type>
    <publisherName>Wiley</publisherName>
    <publisherPlace/>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="deu">Einfluss der Abwärme des Spritzgusswerkzeugs auf die Produktion unter Reinraumbedingungen</title>
    <abstract language="deu">Der Spritzguss unter Reinraumbedingungen spielt gerade in der heutigen Zeit eine immer wichtigere Rolle. Am Markt werden bereits unterschiedliche Lösungen angeboten, um die steigenden Anforderungen verschiedener Branchen und technischer Regelwerke zu erfüllen. In letzter Zeit wird unter anderem auch besonderes Augenmerk auf die Nutzung von technischen und Hochtemperatur-Kunststoffen gelegt. Gerade bei Kunststoffen mit hohen Werkzeugtemperaturen können die thermischen Effekte im Werkzeugbereich die Reinraumströmung negativ beeinflussen. Dadurch werden Partikel unkontrolliert verteilt und eine entsprechende Reinheit des Produkts kann nicht gewährleistet werden. Im Rahmen umfassender Untersuchungen wurden diese Effekte analysiert und Lösungsansätze erarbeitet.</abstract>
    <parentTitle language="deu">ReinRaumTechnik</parentTitle>
    <enrichment key="RS_Correlation">Ja</enrichment>
    <enrichment key="opus.source">publish</enrichment>
    <enrichment key="opus.doi.autoCreate">false</enrichment>
    <enrichment key="opus.urn.autoCreate">true</enrichment>
    <author>Stephan Puntigam</author>
    <author>Peter Karlinger</author>
    <subject>
      <language>deu</language>
      <type>uncontrolled</type>
      <value>Reinraum</value>
    </subject>
    <subject>
      <language>deu</language>
      <type>uncontrolled</type>
      <value>CFD</value>
    </subject>
    <collection role="ddc" number="600">Technik, Technologie</collection>
    <collection role="institutes" number="">Fakultät für Ingenieurwissenschaften</collection>
    <thesisPublisher>Technische Hochschule Rosenheim</thesisPublisher>
  </doc>
  <doc>
    <id>2334</id>
    <completedYear>2023</completedYear>
    <publishedYear/>
    <thesisYearAccepted/>
    <language>deu</language>
    <pageFirst>110</pageFirst>
    <pageLast>116</pageLast>
    <pageNumber/>
    <edition/>
    <issue>3</issue>
    <volume>2023</volume>
    <type>article</type>
    <publisherName>ECV Editio Cantor Verlag</publisherName>
    <publisherPlace>Aulendorf</publisherPlace>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="deu">Spritzgusswerkzeuge im Reinraum Eine Analyse des Kamineffekts in der Kunststoffverarbeitung</title>
    <abstract language="deu">Die Reinraumtechnik zielt darauf ab, mit gerichteten partikelfreien Luftströmungen die im Reinraum stattfindenden Prozesse vor Fremdeinflüssen zu schützen. Die Spritzgussproduktion stellt die Reinraumtechnik dabei vor besondere Herausforderungen. Im Bereich des Spritzgusswerkzeugs können aufgrund des relativ hohen Temperaturunterschieds zur Reinraumluft Kamineffekte auftreten, die der Reinraumströmung entgegen wirken. Im Folgenden wird deshalb der thermische Einfluss eines Spritzgusswerkzeugs exemplarisch bei unterschiedlichen Temperaturen untersucht. Dazu werden Strömungsvisualisierungen mittels Nebel und Schlierenfotografie sowie Strömungssimulationen genutzt. Bereits relativ&#13;
niedrige Werkzeugtemperaturen von 40 °C reichten aus, um einen Kamineffekt im&#13;
Werkzeugbereich entstehen zu lassen, der die Reinraumströmung ungünstig beeinflusst. Erst durch den Einsatz einer Filter-Fan-Unit über dem kritischen Werkzeugbereich konnte die Luftströmung auch bei höheren Werkzeugtemperaturen kontrolliert werden.</abstract>
    <parentTitle language="deu">cleanroom &amp; processes</parentTitle>
    <enrichment key="PeerReviewed">Ja</enrichment>
    <enrichment key="RS_Acronym">BauRein</enrichment>
    <enrichment key="RS_Correlation">Ja</enrichment>
    <enrichment key="RS_FundingAgency">BMWi</enrichment>
    <enrichment key="opus.source">publish</enrichment>
    <enrichment key="opus.doi.autoCreate">false</enrichment>
    <enrichment key="opus.urn.autoCreate">true</enrichment>
    <author>Stephan Puntigam</author>
    <author>Peter Karlinger</author>
    <subject>
      <language>deu</language>
      <type>uncontrolled</type>
      <value>Reinraum</value>
    </subject>
    <subject>
      <language>deu</language>
      <type>uncontrolled</type>
      <value>CFD</value>
    </subject>
    <collection role="ddc" number="600">Technik, Technologie</collection>
    <collection role="institutes" number="">Fakultät für Ingenieurwissenschaften</collection>
    <thesisPublisher>Technische Hochschule Rosenheim</thesisPublisher>
  </doc>
  <doc>
    <id>2340</id>
    <completedYear>2023</completedYear>
    <publishedYear/>
    <thesisYearAccepted/>
    <language>deu</language>
    <pageFirst>1</pageFirst>
    <pageLast>14</pageLast>
    <pageNumber>14</pageNumber>
    <edition/>
    <issue/>
    <volume/>
    <type>conferenceobject</type>
    <publisherName>Technische Universität Chemnitz</publisherName>
    <publisherPlace>Chemnitz</publisherPlace>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="deu">Cellulosefaserverstärktes Polypropylen – Eigenschaftsbeeinflussung durch die Schmelzeaufbereitung</title>
    <abstract language="deu">Verarbeitungstemperaturen, Verweilzeit und Scherkräfte sind entscheidend, um die strukturelle Integrität von cellulosebasierten Fasern zu gewährleisten.&#13;
In dieser Studie wurden die Einflüsse durch die Schmelzeaufbereitung eines cellulosefaserverstärkten Polypropylens auf die Faser und den Faserverbund untersucht. Die Schmelze wurde in einem Plastographen mit verschiedenen Rotordrehzahlen, Schmelzetemperaturen und Verweilzeiten aufbereitet. Um die Auswirkung der Einspeisungsmethode auf den Faserabbau zu analysieren, wurden die Fasern entweder direkt der thermoplastischen Schmelze oder zusammen mit dem Kunststoffgranulat dem Plastographen zugeführt. Die Zugabe der Fasern in die Schmelze geht mit einer erhöhten thermischen und verminderten mechanischen Belastung der Fasern einher.&#13;
Bei der Prüfung der mechanischen Eigenschaften der verschieden aufbereiteten Compounds zeigten sich signifikante Unterschiede. Wurden die Fasern direkt der Schmelze hinzugefügt, so führte dies zu einer deutlich reduzierten Zugfestigkeit. Optische Unterschiede in den Schliffbildern der spritzgegossenen Prüfstäbe sowie in den Faserlängen nach Compoundierung konnten nicht festgestellt werden. Die verminderte Festigkeit wird folglich auf die unterschiedliche thermische Belastung der Faser während der Verarbeitung zurückgeführt.</abstract>
    <parentTitle language="deu">Technomer 2023</parentTitle>
    <identifier type="isbn">978-3-939382-16-4</identifier>
    <enrichment key="PeerReviewed">Nein</enrichment>
    <enrichment key="RS_Acronym">Holzbasierte Bioökonomie</enrichment>
    <enrichment key="RS_Correlation">Ja</enrichment>
    <enrichment key="RS_ProjectTitle">Forschungsschwerpunkt Holzbasierte Bioökonomie</enrichment>
    <enrichment key="RS_FundingAgency">Bayerisches Ministerium für Wissenschaft und Kunst</enrichment>
    <enrichment key="opus.source">publish</enrichment>
    <enrichment key="opus.doi.autoCreate">false</enrichment>
    <enrichment key="opus.urn.autoCreate">true</enrichment>
    <author>Sebastian Wiedl</author>
    <author>Peter Karlinger</author>
    <author>Norbert Müller</author>
    <author>Holger Ruckdäschel</author>
    <subject>
      <language>deu</language>
      <type>uncontrolled</type>
      <value>Cellulosefaser</value>
    </subject>
    <subject>
      <language>deu</language>
      <type>uncontrolled</type>
      <value>Faserververstärkung</value>
    </subject>
    <subject>
      <language>deu</language>
      <type>uncontrolled</type>
      <value>Polypropylen</value>
    </subject>
    <subject>
      <language>deu</language>
      <type>uncontrolled</type>
      <value>Schmelzeaufbereitung</value>
    </subject>
    <subject>
      <language>deu</language>
      <type>uncontrolled</type>
      <value>Faserbeschickung</value>
    </subject>
    <collection role="ddc" number="600">Technik, Technologie</collection>
    <collection role="institutes" number="">Fakultät für Ingenieurwissenschaften</collection>
    <collection role="institutes" number="">Zentrum für Forschung, Entwicklung und Transfer</collection>
    <thesisPublisher>Technische Hochschule Rosenheim</thesisPublisher>
  </doc>
  <doc>
    <id>2350</id>
    <completedYear>2023</completedYear>
    <publishedYear/>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst>26</pageFirst>
    <pageLast>31</pageLast>
    <pageNumber>6</pageNumber>
    <edition/>
    <issue/>
    <volume/>
    <type>conferenceobject</type>
    <publisherName>IEEE</publisherName>
    <publisherPlace>Venice (Italy)</publisherPlace>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">A Planar Magneto-Inductive Device with Modulated Mutual Inductance for Wireless Power Transmission</title>
    <abstract language="eng">A Magneto-Inductive Wave (MIW) structure for wireless power transfer (WPT) is proposed with switchable mutual inductance between neighbored coupling coils. Orthogonally placed switchable short circuit loops are added in order to modulate the wave propagation properties of the MIW structure without changing the resonance frequency. We derive an analytical model based on lumped circuit analysis for the MIW waveguide and successfully evaluate the theoretical findings by circuit modeling and field simulation. We demonstrate switchable, i.e. addressable, guided wireless power transfer along an experimental MIW structure at a resonance frequency of 20.5 MHz.</abstract>
    <parentTitle language="eng">2023 IEEE-APS Topical Conference on Antennas and Propagation in Wireless Communications (APWC)</parentTitle>
    <identifier type="isbn">979-8-3503-2060-2</identifier>
    <identifier type="issn">2766-287X</identifier>
    <identifier type="doi">10.1109/APWC57320.2023.10297488</identifier>
    <enrichment key="PeerReviewed">Ja</enrichment>
    <enrichment key="RS_Correlation">Ja</enrichment>
    <enrichment key="opus.source">publish</enrichment>
    <enrichment key="opus.doi.autoCreate">false</enrichment>
    <enrichment key="opus.urn.autoCreate">true</enrichment>
    <author>Norbert Seliger</author>
    <author>Johannes Honsa</author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Magneto-Inductive Device, Wireless Power Transmission, Mutual Inductance</value>
    </subject>
    <collection role="ddc" number="600">Technik, Technologie</collection>
    <collection role="institutes" number="">Fakultät für Ingenieurwissenschaften</collection>
    <thesisPublisher>Technische Hochschule Rosenheim</thesisPublisher>
  </doc>
  <doc>
    <id>2589</id>
    <completedYear>2024</completedYear>
    <publishedYear/>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst>209</pageFirst>
    <pageLast>214</pageLast>
    <pageNumber>6</pageNumber>
    <edition/>
    <issue/>
    <volume/>
    <type>conferenceobject</type>
    <publisherName>IEEE, Warsaw University of Technology</publisherName>
    <publisherPlace>Wroclaw, Poland</publisherPlace>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">A Tunable Wire Loop Inductor based on Bistable Compliant Mechanism</title>
    <abstract language="eng">By axially loading of a cylindrical wire we utilize the first order buckling mode to form the shape of a segment of a wire loop inductor. The shape of the deformed wire is expressed in analytical form and provides the basis for a semi-empirical formulation of the loop inductance. Combining several buckling segments and taking advantage of the snap-through behavior of such a segment, the shape of the wire loop in air and hence the loop inductance can be varied mechanically on purpose. The analytical model for the tunable inductance enables a design methodology for bistable compliant inductors. We present two designs of mechanically tuned inductors in the range from 20nH to 50nH. Furthermore the electromagnetic properties of the proposed innovative components are confirmed by method of moments numerical modeling based on quasi-static magnetic fields and by experiment. We finally show that the design process is applicable to regular plane polygonal inductors representing multi-stable compliant stages.</abstract>
    <parentTitle language="eng">25th International Microwave and Radar Conference (MIKON)</parentTitle>
    <identifier type="isbn">978-83-969726-0-6</identifier>
    <identifier type="doi">10.23919/MIKON60251.2024.10633977</identifier>
    <enrichment key="PeerReviewed">Ja</enrichment>
    <enrichment key="RS_Correlation">Ja</enrichment>
    <enrichment key="opus.source">publish</enrichment>
    <author>Norbert Seliger</author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>tunable inductor</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>bistable compliant mechanism</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>buckling mode</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>loop inductance</value>
    </subject>
    <collection role="ddc" number="600">Technik, Technologie</collection>
    <collection role="institutes" number="">Fakultät für Ingenieurwissenschaften</collection>
    <thesisPublisher>Technische Hochschule Rosenheim</thesisPublisher>
  </doc>
  <doc>
    <id>2652</id>
    <completedYear>2024</completedYear>
    <publishedYear/>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst>X-243</pageFirst>
    <pageLast>X-245</pageLast>
    <pageNumber>3</pageNumber>
    <edition/>
    <issue/>
    <volume/>
    <type>conferenceobject</type>
    <publisherName>IEEE</publisherName>
    <publisherPlace>Crete</publisherPlace>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">Compliant Mechanism based Planar Inductors for Reconfigurable Magneto-Inductive Wave Devices</title>
    <abstract language="eng">A reconfigurable planar inductor based on bistable compliant mechanism is proposed. Flexible snapping of wire elements is used for modification of the loop area and self inductance as well as for the mutual coupling between laterally arranged multiple inductors in a magneto-inductive wave (MIW) device. A mechanical model is presented building the basis for an analytical inductance model. The bistable reconfigurability is demonstrated experimentally and confirmed by numerical simulation results.</abstract>
    <parentTitle language="eng">18th International Congress on Artificial Materials for Novel Wave Phenomena - Metamaterials 2024</parentTitle>
    <identifier type="isbn">979-8-3503-7349-3</identifier>
    <identifier type="doi">10.1109/Metamaterials62190.2024.10703322</identifier>
    <enrichment key="PeerReviewed">Ja</enrichment>
    <enrichment key="RS_Correlation">Ja</enrichment>
    <enrichment key="opus.source">publish</enrichment>
    <author>Norbert Seliger</author>
    <author>Nico Leirich</author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Magneto-Inductive-Wave Device</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Reconfigurable Inductor</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Compliant Mechanism</value>
    </subject>
    <collection role="ddc" number="600">Technik, Technologie</collection>
    <collection role="institutes" number="">Fakultät für Ingenieurwissenschaften</collection>
    <thesisPublisher>Technische Hochschule Rosenheim</thesisPublisher>
  </doc>
  <doc>
    <id>2756</id>
    <completedYear>2024</completedYear>
    <publishedYear/>
    <thesisYearAccepted/>
    <language>deu</language>
    <pageFirst>211</pageFirst>
    <pageLast>215</pageLast>
    <pageNumber>5</pageNumber>
    <edition/>
    <issue/>
    <volume/>
    <type>conferenceobject</type>
    <publisherName>IEEE</publisherName>
    <publisherPlace>Turin</publisherPlace>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="deu">Reconfigurable Board-to-Board Interconnect Utilizing Bistable Compliant Ribbon Wires</title>
    <abstract language="deu">We propose a printed circuit board (PCB) interconnection utilizing elastically deformed ribbon wires. The wire deflection is designed as a bistable snapping mechanism, which enables post-assembly tuning of the geometry. Hence, a reconfigurable inductance is obtained, easing impedance matching and supporting signal integrity. Analytical solutions for partial and mutual inductance of buckled wires are developed, which are successfully validated by magneto-quasistatic field simulations and by experiments on a test structure for frequencies ranging from 100kHz to 100MHz. We demonstrate a tunable loop inductance from 25nH to 50nH at 10MHz.</abstract>
    <parentTitle language="deu">14th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)</parentTitle>
    <identifier type="isbn">979-8-3315-0462-5</identifier>
    <identifier type="doi">10.1109/EMCCompo61192.2024.10742066</identifier>
    <enrichment key="PeerReviewed">Ja</enrichment>
    <enrichment key="RS_Correlation">Ja</enrichment>
    <enrichment key="opus.source">publish</enrichment>
    <author>Norbert Seliger</author>
    <author>Nico Leirich</author>
    <subject>
      <language>deu</language>
      <type>uncontrolled</type>
      <value>compliant mechanism</value>
    </subject>
    <subject>
      <language>deu</language>
      <type>uncontrolled</type>
      <value>reconfigurable interconnect</value>
    </subject>
    <subject>
      <language>deu</language>
      <type>uncontrolled</type>
      <value>partial inductance</value>
    </subject>
    <subject>
      <language>deu</language>
      <type>uncontrolled</type>
      <value>impedance matching</value>
    </subject>
    <collection role="ddc" number="600">Technik, Technologie</collection>
    <collection role="institutes" number="">Fakultät für Ingenieurwissenschaften</collection>
    <thesisPublisher>Technische Hochschule Rosenheim</thesisPublisher>
  </doc>
  <doc>
    <id>2998</id>
    <completedYear>2025</completedYear>
    <publishedYear/>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst>34</pageFirst>
    <pageLast>39</pageLast>
    <pageNumber>6</pageNumber>
    <edition/>
    <issue/>
    <volume/>
    <type>conferenceobject</type>
    <publisherName>IEEE</publisherName>
    <publisherPlace/>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>2025-04-28</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">Multiple-Frequency Three Coil Inductive Power Transmission with Non-Linear Relay Resonator</title>
    <abstract language="eng">We propose near-field inductive power transfer with three coils in the frequency range of a few MHz. The relay coil is part of a non-linear resonator having a diode connected in parallel to the resonant capacitor. We achieve power transfer at multiple frequencies which can be tuned by the input power level and mutual coupling between the coils. Higher harmonic generation is found dominant at lower input power, whereas subharmonic generation (period doubling and period quadrupling) is observed at high levels. Power transfer at subharmonics reveals robustness against level perturbations due to pronounced amplitude hysteresis effect. A circuit simulation based on standard non-linear diode SPICE models confirms the experimental results which are obtained on a demonstration prototype.</abstract>
    <parentTitle language="eng">Proceedings Southeastcon 2025</parentTitle>
    <identifier type="isbn">979-8-3315-0484-7</identifier>
    <identifier type="issn">1558-058X</identifier>
    <identifier type="doi">10.1109/SoutheastCon56624.2025.10971670</identifier>
    <enrichment key="PeerReviewed">Ja</enrichment>
    <enrichment key="RS_Correlation">Ja</enrichment>
    <enrichment key="conference_title">SoutheastCon 2025</enrichment>
    <enrichment key="conference_date">22-30 March 2025</enrichment>
    <enrichment key="conference_place">Concord, NC, USA</enrichment>
    <enrichment key="opus.source">publish</enrichment>
    <enrichment key="review.accepted_by">2</enrichment>
    <author>Maximilian Püschel</author>
    <author>Norbert Seliger</author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>wireless power transfer</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>inductive power transmission</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>nonlinear circuits</value>
    </subject>
    <collection role="ddc" number="600">Technik, Technologie</collection>
    <collection role="institutes" number="">Fakultät für Ingenieurwissenschaften</collection>
    <thesisPublisher>Technische Hochschule Rosenheim</thesisPublisher>
  </doc>
  <doc>
    <id>3011</id>
    <completedYear>2025</completedYear>
    <publishedYear/>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst>2562</pageFirst>
    <pageLast>2567</pageLast>
    <pageNumber>6</pageNumber>
    <edition/>
    <issue/>
    <volume/>
    <type>conferenceobject</type>
    <publisherName>VDE VERLAG GMBH</publisherName>
    <publisherPlace>Berlin</publisherPlace>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">AC Cycling Testing of SiC MOSFET Power Module</title>
    <abstract language="eng">This paper details the development of an accelerated AC cycling test bench for evaluating the aging mechanisms of SiC MOSFET power modules. Contrary to classical HTGS and DGS which only exercise gate source stresses the AC Cycler switched under high voltage and current. Operating for about 235 hours, the system maintained stable thermal conditions thanks to an integrated cooling system. Key precursors of aging, such as increases in threshold voltage and on-state resistance were identified using static characterization curve tracer before and after the test. Gate charge and Vdson were also measured on-line with specially developed gate drivers.</abstract>
    <parentTitle language="eng">Proccedings International exhibition and conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management (PCIM 2025)</parentTitle>
    <identifier type="isbn">978-3-8007-6541-6</identifier>
    <identifier type="doi">10.30420/566541341</identifier>
    <enrichment key="PeerReviewed">Ja</enrichment>
    <enrichment key="RS_Correlation">Ja</enrichment>
    <enrichment key="conference_title">International exhibition and conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, PCIM Conference 2025</enrichment>
    <enrichment key="conference_date">6.-8.May 2025</enrichment>
    <enrichment key="conference_place">Nuremberg</enrichment>
    <enrichment key="opus.source">publish</enrichment>
    <author>Tugce Yilmaz</author>
    <author>Jorge Mari</author>
    <author>Johann Asam</author>
    <author>Michael Kirner</author>
    <author>Andreas List</author>
    <author>Lucia Fantauzzo</author>
    <author>Norbert Seliger</author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>power module</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>SiC</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>power cycling testing</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>MOSFET</value>
    </subject>
    <collection role="ddc" number="600">Technik, Technologie</collection>
    <collection role="institutes" number="">Fakultät für Ingenieurwissenschaften</collection>
    <thesisPublisher>Technische Hochschule Rosenheim</thesisPublisher>
  </doc>
  <doc>
    <id>3000</id>
    <completedYear>2025</completedYear>
    <publishedYear/>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst/>
    <pageLast/>
    <pageNumber>9</pageNumber>
    <edition/>
    <issue/>
    <volume/>
    <type>conferenceobject</type>
    <publisherName>IEEE</publisherName>
    <publisherPlace/>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>2025-04-28</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">Introducing Environmental Sustainability in an RF and EMC Lab Course Utilizing Reusable, Recyclable and Biodegradable Circuits</title>
    <abstract language="eng">We propose to introduce environmental sustainability in a radio frequency (RF) and electromagnetic compatibility (EMC) laboratory course for an electrical engineering bachelor’s program utilizing reusable, easily recyclable and ecologically harmless (biodegradable) circuits. Our concept is based on the replacement of state-of-the-art printed circuit boards by substrates with mechanically structured adhesive Cu and Zinc films. Furthermore, organic based circuit carriers can be substituted by biodegradable paper substrates. As an example for the RF lab, we discuss the design, simulation and experimental characterization of a microwave low-pass&#13;
filter with 1.2GHz cut-off frequency. Secondly, for an EMC lab we suggest a prototype for power integrity (PI) studies based on the current imbalance method for reducing common mode radiated emission. As a novel feature during the lab course, the instructor in addition gives a&#13;
lecture highlighting the electronic waste challenge, which is accompanied by group discussions on sustainability and recycling. As a final lab course task students are asked to disassemble the boards or prepare them for reuse, followed by material sorting and submission to recycling&#13;
institutions.</abstract>
    <parentTitle language="eng">Proceedings IEEE educon 2025</parentTitle>
    <identifier type="doi">10.1109/EDUCON62633.2025.11016365</identifier>
    <enrichment key="PeerReviewed">Ja</enrichment>
    <enrichment key="RS_Correlation">Ja</enrichment>
    <enrichment key="conference_title">IEEE Global Engineering Education Conference (IEEE EDUCON 2025)</enrichment>
    <enrichment key="conference_date">April 22-25, 2025</enrichment>
    <enrichment key="conference_place">London, United Kingdom</enrichment>
    <enrichment key="opus.source">publish</enrichment>
    <enrichment key="review.accepted_by">2</enrichment>
    <author>Norbert Seliger</author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Microstrip Filters</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Electromagnetic Compatibility</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Printed Circuits</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Electronics Engineering Education</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Electromagnetic Engineering Education</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Biodegradable Electronics</value>
    </subject>
    <collection role="ddc" number="600">Technik, Technologie</collection>
    <collection role="institutes" number="">Fakultät für Ingenieurwissenschaften</collection>
    <thesisPublisher>Technische Hochschule Rosenheim</thesisPublisher>
  </doc>
  <doc>
    <id>2999</id>
    <completedYear>2025</completedYear>
    <publishedYear/>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst/>
    <pageLast/>
    <pageNumber>10</pageNumber>
    <edition/>
    <issue/>
    <volume/>
    <type>conferenceobject</type>
    <publisherName>EPE Association</publisherName>
    <publisherPlace/>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>2025-04-28</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">Reconfigurable single-layer air coil inductor with bistable compliant windings</title>
    <abstract language="eng">We present an air coil with bistable compliant single layer windings. Due to stable elastic snapping deformation of wire segments, the self-inductance of the air coil can be precisely varied in multiple steps. A numerical and analytical design methodology is proposed and successfully validated by magneto-quasi-static field simulations and experiments on prototypes.</abstract>
    <parentTitle language="eng">Proceedings EPE 25</parentTitle>
    <identifier type="doi">10.34746/epe2025-0012</identifier>
    <enrichment key="PeerReviewed">Ja</enrichment>
    <enrichment key="RS_Correlation">Ja</enrichment>
    <enrichment key="conference_title">26th European Conference on Power Electronics and Applications</enrichment>
    <enrichment key="conference_date">April 1-4, 2025</enrichment>
    <enrichment key="conference_place">Paris, France</enrichment>
    <enrichment key="opus.source">publish</enrichment>
    <enrichment key="review.accepted_by">2</enrichment>
    <author>Norbert Seliger</author>
    <author>Nico Leirich</author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Reconfigurable resonant network</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Passive component</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Magnetic device</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Winding topology</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>S- Parameters</value>
    </subject>
    <collection role="ddc" number="600">Technik, Technologie</collection>
    <collection role="institutes" number="">Fakultät für Ingenieurwissenschaften</collection>
    <thesisPublisher>Technische Hochschule Rosenheim</thesisPublisher>
  </doc>
</export-example>
