<?xml version="1.0" encoding="utf-8"?>
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    <id>2244</id>
    <completedYear>1999</completedYear>
    <publishedYear/>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst>241</pageFirst>
    <pageLast>250</pageLast>
    <pageNumber/>
    <edition/>
    <issue/>
    <volume/>
    <type>conferenceobject</type>
    <publisherName>IEEE</publisherName>
    <publisherPlace/>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>2023-06-15</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">Interferometric temperature mapping during ESD stress and failure analysis of smart power technology ESD protection devices</title>
    <parentTitle language="eng">Electrical Overstress/Electrostatic Discharge Symposium Proceedings</parentTitle>
    <identifier type="doi">10.1109/EOSESD.1999.819067</identifier>
    <enrichment key="PeerReviewed">Ja</enrichment>
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    <author>C. Fürböck</author>
    <author>D. Pogany</author>
    <author>M. Litzenberger</author>
    <author>E. Gornik</author>
    <author>Norbert Seliger</author>
    <author>H. Gossner</author>
    <author>T. Müller-Lynch</author>
    <author>M. Stecher</author>
    <author>W. Werner</author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>ESD</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>smart power device</value>
    </subject>
    <collection role="ddc" number="600">Technik, Technologie</collection>
    <collection role="institutes" number="">Fakultät für Ingenieurwissenschaften</collection>
    <thesisPublisher>Technische Hochschule Rosenheim</thesisPublisher>
  </doc>
  <doc>
    <id>2245</id>
    <completedYear>2000</completedYear>
    <publishedYear/>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst>195</pageFirst>
    <pageLast>213</pageLast>
    <pageNumber/>
    <edition/>
    <issue/>
    <volume>49</volume>
    <type>article</type>
    <publisherName/>
    <publisherPlace/>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>2023-06-15</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">Interferometric temperature mapping during ESD stress and failure analysis of smart power technology ESD protection devices</title>
    <parentTitle language="eng">Journal of Electrostatics</parentTitle>
    <enrichment key="PeerReviewed">Ja</enrichment>
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    <author>C. Fürböck</author>
    <author>D. Pogany</author>
    <author>M. Litzenberger</author>
    <author>E. Gornik</author>
    <author>Norbert Seliger</author>
    <author>H. Gossner</author>
    <author>T. Müller-Lynch</author>
    <author>M. Stecher</author>
    <author>W. Werner</author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>ESD</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>smart power device</value>
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    <collection role="ddc" number="600">Technik, Technologie</collection>
    <collection role="institutes" number="">Fakultät für Ingenieurwissenschaften</collection>
    <thesisPublisher>Technische Hochschule Rosenheim</thesisPublisher>
  </doc>
</export-example>
