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    <completedYear>2003</completedYear>
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    <language>eng</language>
    <pageFirst>1839</pageFirst>
    <pageLast>1846</pageLast>
    <pageNumber>8</pageNumber>
    <edition/>
    <issue>9</issue>
    <volume>43</volume>
    <type>article</type>
    <publisherName/>
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    <publishedDate>2023-06-09</publishedDate>
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    <title language="eng">Reliability aspects of semiconductor devices in high temperature applications</title>
    <parentTitle language="deu">Microelectronics Reliability</parentTitle>
    <identifier type="issn">0026-2714</identifier>
    <identifier type="doi">10.1016/S0026-2714(03)00313-5</identifier>
    <enrichment key="opus.import.data">@articlekanert_reliability_2003, title = Reliability aspects of semiconductor devices in high temperature applications, volume = 43, issn = 0026-2714, url = https://www.sciencedirect.com/science/article/pii/S0026271403003135, doi = 10.1016/S0026-2714(03)00313-5, series = 14th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, pages = 1839–1846, number = 9, journaltitle = Microelectronics Reliability, shortjournal = Microelectronics Reliability, author = Kanert, W. and Dettmer, H. and Plikat, B. and Seliger, N., urldate = 2023-06-06, date = 2003-09-01, langid = english,</enrichment>
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    <author>W. Kanert</author>
    <author>H. Dettmer</author>
    <author>B. Plikat</author>
    <author>Norbert Seliger</author>
    <collection role="institutes" number="">Fakultät für Ingenieurwissenschaften</collection>
    <thesisPublisher>Technische Hochschule Rosenheim</thesisPublisher>
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