<?xml version="1.0" encoding="utf-8"?>
<export-example>
  <doc>
    <id>2224</id>
    <completedYear>2002</completedYear>
    <publishedYear/>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst>761</pageFirst>
    <pageLast>767</pageLast>
    <pageNumber>7</pageNumber>
    <edition/>
    <issue/>
    <volume>2</volume>
    <type>conferenceobject</type>
    <publisherName/>
    <publisherPlace/>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>2023-06-09</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">High density packaging of the passive components in an automotive DC/DC converter</title>
    <parentTitle language="eng">2002 IEEE 33rd Annual IEEE Power Electronics Specialists Conference. Proceedings (Cat. No.02CH37289)</parentTitle>
    <identifier type="doi">10.1109/PSEC.2002.1022545</identifier>
    <enrichment key="opus.import.data">@inproceedingsgerber_high_2002, title = High density packaging of the passive components in an automotive DC/DC converter, volume = 2, doi = 10.1109/PSEC.2002.1022545, abstract = In this paper a very high power density DC/DC converter module for automotive applications is investigated. The 14 V/42 V converter is specified to operate at a power level of 2.1 kW with a water cooled heatsink at 85/spl deg/C. The design and implementation of very high density passive components is discussed. Using the results of the passive component design, a prototype converter is built achieving a final power density of 170 W/in/sup 3/. The thermal performance of the passive components and converter module under different electrical and thermal excitations is investigated and recorded. Results are presented over the full excitation range., eventtitle = 2002 IEEE 33rd Annual IEEE Power Electronics Specialists Conference. Proceedings (Cat. No.02CH37289), pages = 761–767 vol.2, booktitle = 2002 IEEE 33rd Annual IEEE Power Electronics Specialists Conference. Proceedings (Cat. No.02CH37289), author = Gerber, M. and Ferreira, J.A. and Hofsajer, I.W. and Seligerg, N., date = 2002-06, keywords = Automotive engineering, Cooling, DC-DC power converters, Filters, Inductors, Packaging, Resistance heating, Temperature, Thermal conductivity, Thermal resistance,</enrichment>
    <enrichment key="opus.import.dataHash">md5:8ce747df995b2ec2d0cab82227feb294</enrichment>
    <enrichment key="opus.import.date">2023-06-09T07:22:10+00:00</enrichment>
    <enrichment key="opus.import.file">/tmp/phpyseIo7</enrichment>
    <enrichment key="opus.import.format">bibtex</enrichment>
    <enrichment key="opus.import.id">6482d3224b71a5.54058441</enrichment>
    <enrichment key="review.accepted_by">2</enrichment>
    <enrichment key="RS_Correlation">Nein</enrichment>
    <author>M. Gerber</author>
    <author>J.A. Ferreira</author>
    <author>I.W. Hofsajer</author>
    <author>Norbert Seliger</author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Automotive engineering</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Cooling</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>DC-DC power converters</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Filters</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Inductors</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Packaging</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Resistance heating</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Temperature</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Thermal conductivity</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Thermal resistance</value>
    </subject>
    <collection role="institutes" number="">Fakultät für Ingenieurwissenschaften</collection>
    <thesisPublisher>Technische Hochschule Rosenheim</thesisPublisher>
  </doc>
  <doc>
    <id>2225</id>
    <completedYear>2002</completedYear>
    <publishedYear/>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst>1432</pageFirst>
    <pageLast>1440</pageLast>
    <pageNumber>9</pageNumber>
    <edition/>
    <issue>5</issue>
    <volume>38</volume>
    <type>article</type>
    <publisherName/>
    <publisherPlace/>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>2023-06-09</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">A volumetric optimization of a low-pass filter</title>
    <parentTitle language="deu">IEEE Transactions on Industry Applications</parentTitle>
    <identifier type="issn">1939-9367</identifier>
    <identifier type="doi">10.1109/TIA.2002.802996</identifier>
    <enrichment key="opus.import.data">@articlegerber_volumetric_2002, title = A volumetric optimization of a low-pass filter, volume = 38, issn = 1939-9367, doi = 10.1109/TIA.2002.802996, abstract = The low-pass filter (LPF) is a fundamental component of many power electronic systems, for example, the output filters of DC-to-DC converters. The volume of the two components that constitute the LPF contribute a majority of the final system’s volume, thus affecting the overall power density of the system. To be able to reach the high power densities that are required nowadays, the packaging of these components needs to be addressed. A new packaging approach is considered where the main criteria is to increase the packaging density of the LPF. The filter is considered volumetrically, and the minimum possible volume is derived. The construction and losses of such a filter are also discussed., pages = 1432–1440, number = 5, journaltitle = IEEE Transactions on Industry Applications, author = Gerber, M. and Ferreira, J.A. and Hofsajer, I.W., date = 2002-09, note = Conference Name: IEEE Transactions on Industry Applications, keywords = DC-DC power converters, Electronic packaging thermal management, Industry Applications Society, Integrated circuit interconnections, Low pass filters, Magnetic separation, Manufacturing, Power electronics, Power system interconnection,</enrichment>
    <enrichment key="opus.import.dataHash">md5:a3e98c72a0b3ca536dadfe6a08046042</enrichment>
    <enrichment key="opus.import.date">2023-06-09T07:22:10+00:00</enrichment>
    <enrichment key="opus.import.file">/tmp/phpyseIo7</enrichment>
    <enrichment key="opus.import.format">bibtex</enrichment>
    <enrichment key="opus.import.id">6482d3224b71a5.54058441</enrichment>
    <enrichment key="review.accepted_by">2</enrichment>
    <enrichment key="RS_Correlation">Nein</enrichment>
    <author>M. Gerber</author>
    <author>J.A. Ferreira</author>
    <author>I.W. Hofsajer</author>
    <author>Norbert Seliger</author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>DC-DC power converters</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Electronic packaging thermal management</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Industry Applications Society</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Integrated circuit interconnections</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Low pass filters</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Magnetic separation</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Manufacturing</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Power electronics</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Power system interconnection</value>
    </subject>
    <collection role="institutes" number="">Fakultät für Ingenieurwissenschaften</collection>
    <thesisPublisher>Technische Hochschule Rosenheim</thesisPublisher>
  </doc>
</export-example>
