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  <doc>
    <id>2276</id>
    <completedYear>2003</completedYear>
    <publishedYear/>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst>425</pageFirst>
    <pageLast>430</pageLast>
    <pageNumber/>
    <edition/>
    <issue/>
    <volume/>
    <type>conferenceobject</type>
    <publisherName>IEEE</publisherName>
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    <contributingCorporation/>
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    <title language="eng">High temperature, high power density packaging for automotive applications</title>
    <abstract language="eng">The automotive industry is pushing power electronic packaging to higher operating and heatsink temperatures while still requiring very high power densities due to limited space. Currently, the power electronics that is implemented within the engine compartment of the vehicle must operate with heatsink temperatures of approximately 85/spl deg/C and this temperature can be expected to increase to 125/spl deg/C in the near future. The high temperature operation of the power electronic structure is fundamentally limited by the employed materials maximum temperatures. A packaging concept is introduced that describes a structure realisation that enables the materials to operate at high ambient temperatures without exceeding their individual maximum temperatures. This in turn allows the complete power electronic structure to operate at a higher system temperature. In this paper, the packaging concept that can be used to meet these difficult requirements of high temperature and high power-density is introduced, discussed and implemented. Two case studies are considered and implemented to illustrate the packaging concept.</abstract>
    <parentTitle language="eng">IEEE 34th Annual Conference on Power Electronics Specialist, 2003. PESC '03.</parentTitle>
    <identifier type="doi">10.1109/PESC.2003.1218329</identifier>
    <enrichment key="PeerReviewed">Ja</enrichment>
    <enrichment key="RS_Correlation">Nein</enrichment>
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    <author>M. Gerber</author>
    <author>J.A. Ferreira</author>
    <author>I.W. Hofsajer</author>
    <author>Norbert Seliger</author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>high temperature electronic packaging</value>
    </subject>
    <collection role="ddc" number="600">Technik, Technologie</collection>
    <collection role="institutes" number="">Fakultät für Ingenieurwissenschaften</collection>
    <thesisPublisher>Technische Hochschule Rosenheim</thesisPublisher>
  </doc>
  <doc>
    <id>2224</id>
    <completedYear>2002</completedYear>
    <publishedYear/>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst>761</pageFirst>
    <pageLast>767</pageLast>
    <pageNumber>7</pageNumber>
    <edition/>
    <issue/>
    <volume>2</volume>
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    <contributingCorporation/>
    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>2023-06-09</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">High density packaging of the passive components in an automotive DC/DC converter</title>
    <parentTitle language="eng">2002 IEEE 33rd Annual IEEE Power Electronics Specialists Conference. Proceedings (Cat. No.02CH37289)</parentTitle>
    <identifier type="doi">10.1109/PSEC.2002.1022545</identifier>
    <enrichment key="opus.import.data">@inproceedingsgerber_high_2002, title = High density packaging of the passive components in an automotive DC/DC converter, volume = 2, doi = 10.1109/PSEC.2002.1022545, abstract = In this paper a very high power density DC/DC converter module for automotive applications is investigated. The 14 V/42 V converter is specified to operate at a power level of 2.1 kW with a water cooled heatsink at 85/spl deg/C. The design and implementation of very high density passive components is discussed. Using the results of the passive component design, a prototype converter is built achieving a final power density of 170 W/in/sup 3/. The thermal performance of the passive components and converter module under different electrical and thermal excitations is investigated and recorded. Results are presented over the full excitation range., eventtitle = 2002 IEEE 33rd Annual IEEE Power Electronics Specialists Conference. Proceedings (Cat. No.02CH37289), pages = 761–767 vol.2, booktitle = 2002 IEEE 33rd Annual IEEE Power Electronics Specialists Conference. Proceedings (Cat. No.02CH37289), author = Gerber, M. and Ferreira, J.A. and Hofsajer, I.W. and Seligerg, N., date = 2002-06, keywords = Automotive engineering, Cooling, DC-DC power converters, Filters, Inductors, Packaging, Resistance heating, Temperature, Thermal conductivity, Thermal resistance,</enrichment>
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    <enrichment key="review.accepted_by">2</enrichment>
    <enrichment key="RS_Correlation">Nein</enrichment>
    <author>M. Gerber</author>
    <author>J.A. Ferreira</author>
    <author>I.W. Hofsajer</author>
    <author>Norbert Seliger</author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Automotive engineering</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Cooling</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>DC-DC power converters</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Filters</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Inductors</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Packaging</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Resistance heating</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Temperature</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Thermal conductivity</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Thermal resistance</value>
    </subject>
    <collection role="institutes" number="">Fakultät für Ingenieurwissenschaften</collection>
    <thesisPublisher>Technische Hochschule Rosenheim</thesisPublisher>
  </doc>
  <doc>
    <id>2225</id>
    <completedYear>2002</completedYear>
    <publishedYear/>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst>1432</pageFirst>
    <pageLast>1440</pageLast>
    <pageNumber>9</pageNumber>
    <edition/>
    <issue>5</issue>
    <volume>38</volume>
    <type>article</type>
    <publisherName/>
    <publisherPlace/>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>2023-06-09</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">A volumetric optimization of a low-pass filter</title>
    <parentTitle language="deu">IEEE Transactions on Industry Applications</parentTitle>
    <identifier type="issn">1939-9367</identifier>
    <identifier type="doi">10.1109/TIA.2002.802996</identifier>
    <enrichment key="opus.import.data">@articlegerber_volumetric_2002, title = A volumetric optimization of a low-pass filter, volume = 38, issn = 1939-9367, doi = 10.1109/TIA.2002.802996, abstract = The low-pass filter (LPF) is a fundamental component of many power electronic systems, for example, the output filters of DC-to-DC converters. The volume of the two components that constitute the LPF contribute a majority of the final system’s volume, thus affecting the overall power density of the system. To be able to reach the high power densities that are required nowadays, the packaging of these components needs to be addressed. A new packaging approach is considered where the main criteria is to increase the packaging density of the LPF. The filter is considered volumetrically, and the minimum possible volume is derived. The construction and losses of such a filter are also discussed., pages = 1432–1440, number = 5, journaltitle = IEEE Transactions on Industry Applications, author = Gerber, M. and Ferreira, J.A. and Hofsajer, I.W., date = 2002-09, note = Conference Name: IEEE Transactions on Industry Applications, keywords = DC-DC power converters, Electronic packaging thermal management, Industry Applications Society, Integrated circuit interconnections, Low pass filters, Magnetic separation, Manufacturing, Power electronics, Power system interconnection,</enrichment>
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    <enrichment key="review.accepted_by">2</enrichment>
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    <author>M. Gerber</author>
    <author>J.A. Ferreira</author>
    <author>I.W. Hofsajer</author>
    <author>Norbert Seliger</author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>DC-DC power converters</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Electronic packaging thermal management</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Industry Applications Society</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Integrated circuit interconnections</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Low pass filters</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Magnetic separation</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Manufacturing</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Power electronics</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Power system interconnection</value>
    </subject>
    <collection role="institutes" number="">Fakultät für Ingenieurwissenschaften</collection>
    <thesisPublisher>Technische Hochschule Rosenheim</thesisPublisher>
  </doc>
  <doc>
    <id>2262</id>
    <completedYear>2001</completedYear>
    <publishedYear/>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst>2224</pageFirst>
    <pageLast>2231</pageLast>
    <pageNumber/>
    <edition/>
    <issue/>
    <volume/>
    <type>conferenceobject</type>
    <publisherName>IEEE</publisherName>
    <publisherPlace/>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>2023-06-19</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">A volumetric optimization of a low pass filter</title>
    <parentTitle language="eng">Conference Record of the 2001 IEEE Industry Applications Conference. 36th IAS Annual Meeting (Cat. No.01CH37248)</parentTitle>
    <identifier type="doi">10.1109/IAS.2001.955934</identifier>
    <enrichment key="PeerReviewed">Ja</enrichment>
    <enrichment key="RS_Correlation">Nein</enrichment>
    <enrichment key="opus.source">publish</enrichment>
    <enrichment key="opus.doi.autoCreate">false</enrichment>
    <enrichment key="opus.urn.autoCreate">true</enrichment>
    <enrichment key="review.accepted_by">2</enrichment>
    <author>M. Gerber</author>
    <author>J.A. Ferreira</author>
    <author>I.W. Hofsajer</author>
    <author>Norbert Seliger</author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>low pass filter</value>
    </subject>
    <collection role="ddc" number="600">Technik, Technologie</collection>
    <collection role="institutes" number="">Fakultät für Ingenieurwissenschaften</collection>
    <thesisPublisher>Technische Hochschule Rosenheim</thesisPublisher>
  </doc>
  <doc>
    <id>2263</id>
    <completedYear>2002</completedYear>
    <publishedYear/>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst>948</pageFirst>
    <pageLast>954</pageLast>
    <pageNumber/>
    <edition/>
    <issue/>
    <volume/>
    <type>conferenceobject</type>
    <publisherName>IEEE</publisherName>
    <publisherPlace/>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>2023-06-19</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">A very high density, heatsink mounted inductor for automotive applications</title>
    <parentTitle language="eng">Conference Record of the 2002 IEEE Industry Applications Conference. 37th IAS Annual Meeting (Cat. No.02CH37344)</parentTitle>
    <identifier type="doi">10.1109/IAS.2002.1042672</identifier>
    <enrichment key="PeerReviewed">Ja</enrichment>
    <enrichment key="RS_Correlation">Nein</enrichment>
    <enrichment key="opus.source">publish</enrichment>
    <enrichment key="opus.doi.autoCreate">false</enrichment>
    <enrichment key="opus.urn.autoCreate">true</enrichment>
    <enrichment key="review.accepted_by">2</enrichment>
    <author>M. Gerber</author>
    <author>J.A. Ferreira</author>
    <author>I.W. Hofsajer</author>
    <author>Norbert Seliger</author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>inductor</value>
    </subject>
    <collection role="ddc" number="600">Technik, Technologie</collection>
    <collection role="institutes" number="">Fakultät für Ingenieurwissenschaften</collection>
    <thesisPublisher>Technische Hochschule Rosenheim</thesisPublisher>
  </doc>
  <doc>
    <id>2248</id>
    <completedYear>2005</completedYear>
    <publishedYear/>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst>566</pageFirst>
    <pageLast>575</pageLast>
    <pageNumber/>
    <edition/>
    <issue>3</issue>
    <volume>20</volume>
    <type>article</type>
    <publisherName>IEEE</publisherName>
    <publisherPlace/>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>2023-06-15</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">Integral 3-D thermal, electrical and mechanical design of an automotive DC/DC converter</title>
    <parentTitle language="eng">IEEE Transactions on Power Electronics</parentTitle>
    <enrichment key="PeerReviewed">Ja</enrichment>
    <enrichment key="RS_Correlation">Nein</enrichment>
    <enrichment key="opus.source">publish</enrichment>
    <enrichment key="review.accepted_by">2</enrichment>
    <author>M. Gerber</author>
    <author>J.A. Ferreira</author>
    <author>Norbert Seliger</author>
    <author>I.W. Hofsajer</author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>DC/DC converter</value>
    </subject>
    <collection role="ddc" number="600">Technik, Technologie</collection>
    <collection role="institutes" number="">Fakultät für Ingenieurwissenschaften</collection>
    <thesisPublisher>Technische Hochschule Rosenheim</thesisPublisher>
  </doc>
  <doc>
    <id>2250</id>
    <completedYear>2005</completedYear>
    <publishedYear/>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst>268</pageFirst>
    <pageLast>275</pageLast>
    <pageNumber/>
    <edition/>
    <issue>2</issue>
    <volume>20</volume>
    <type>article</type>
    <publisherName>IEEE</publisherName>
    <publisherPlace/>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>2023-06-15</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">High density packaging of the passive components in an automotive DC/DC converter</title>
    <parentTitle language="eng">IEEE Transactions on Power Electronics</parentTitle>
    <enrichment key="PeerReviewed">Ja</enrichment>
    <enrichment key="RS_Correlation">Nein</enrichment>
    <enrichment key="opus.source">publish</enrichment>
    <enrichment key="review.accepted_by">2</enrichment>
    <author>M. Gerber</author>
    <author>J.A. Ferreira</author>
    <author>Norbert Seliger</author>
    <author>I.W. Hofsajer</author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>DC/DC converter</value>
    </subject>
    <collection role="ddc" number="600">Technik, Technologie</collection>
    <collection role="institutes" number="">Fakultät für Ingenieurwissenschaften</collection>
    <thesisPublisher>Technische Hochschule Rosenheim</thesisPublisher>
  </doc>
  <doc>
    <id>2251</id>
    <completedYear>2005</completedYear>
    <publishedYear/>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst>1144</pageFirst>
    <pageLast>1151</pageLast>
    <pageNumber/>
    <edition/>
    <issue/>
    <volume/>
    <type>conferenceobject</type>
    <publisherName>IEEE</publisherName>
    <publisherPlace/>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>2023-06-15</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">Design and evaluation of an automotive integrated system module</title>
    <parentTitle language="eng">Conference Record of the 2005 Industry Applications Conference</parentTitle>
    <enrichment key="PeerReviewed">Ja</enrichment>
    <enrichment key="RS_Correlation">Nein</enrichment>
    <enrichment key="opus.source">publish</enrichment>
    <enrichment key="review.accepted_by">2</enrichment>
    <author>M. Gerber</author>
    <author>J.A. Ferreira</author>
    <author>Norbert Seliger</author>
    <author>I.W. Hofsajer</author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>power module</value>
    </subject>
    <collection role="ddc" number="600">Technik, Technologie</collection>
    <collection role="institutes" number="">Fakultät für Ingenieurwissenschaften</collection>
    <thesisPublisher>Technische Hochschule Rosenheim</thesisPublisher>
  </doc>
  <doc>
    <id>2252</id>
    <completedYear>2005</completedYear>
    <publishedYear/>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst/>
    <pageLast/>
    <pageNumber/>
    <edition/>
    <issue/>
    <volume/>
    <type>conferenceobject</type>
    <publisherName>IEEE</publisherName>
    <publisherPlace/>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>2023-06-15</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">Integral design of a high power density DC/DC converter for harsh environments</title>
    <parentTitle language="eng">European Conference on Power Electronics and Applications</parentTitle>
    <enrichment key="PeerReviewed">Ja</enrichment>
    <enrichment key="RS_Correlation">Nein</enrichment>
    <enrichment key="opus.source">publish</enrichment>
    <enrichment key="review.accepted_by">2</enrichment>
    <author>M. Gerber</author>
    <author>J.A. Ferreira</author>
    <author>I.W. Hofsajer</author>
    <author>Norbert Seliger</author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>DC/DC converter</value>
    </subject>
    <collection role="ddc" number="600">Technik, Technologie</collection>
    <collection role="institutes" number="">Fakultät für Ingenieurwissenschaften</collection>
    <thesisPublisher>Technische Hochschule Rosenheim</thesisPublisher>
  </doc>
  <doc>
    <id>2253</id>
    <completedYear>2004</completedYear>
    <publishedYear/>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst>4655</pageFirst>
    <pageLast>4661</pageLast>
    <pageNumber/>
    <edition/>
    <issue/>
    <volume/>
    <type>conferenceobject</type>
    <publisherName>IEEE</publisherName>
    <publisherPlace/>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>2023-06-15</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">Interleaving optimization in synchronous rectified DC/DC converters</title>
    <parentTitle language="eng">IEEE 35th Annual Power Electronics Specialists Conference (IEEE Cat. No.04CH37551)</parentTitle>
    <enrichment key="PeerReviewed">Ja</enrichment>
    <enrichment key="RS_Correlation">Nein</enrichment>
    <enrichment key="opus.source">publish</enrichment>
    <enrichment key="review.accepted_by">2</enrichment>
    <author>M. Gerber</author>
    <author>J.A. Ferreira</author>
    <author>I.W. Hofsajer</author>
    <author>Norbert Seliger</author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>DC/DC converter</value>
    </subject>
    <collection role="ddc" number="600">Technik, Technologie</collection>
    <collection role="institutes" number="">Fakultät für Ingenieurwissenschaften</collection>
    <thesisPublisher>Technische Hochschule Rosenheim</thesisPublisher>
  </doc>
  <doc>
    <id>2254</id>
    <completedYear>2004</completedYear>
    <publishedYear/>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst>2779</pageFirst>
    <pageLast>2785</pageLast>
    <pageNumber/>
    <edition/>
    <issue/>
    <volume/>
    <type>conferenceobject</type>
    <publisherName>IEEE</publisherName>
    <publisherPlace/>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>2023-06-15</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">An improved 3D integrated DC/DC converter for high temperature environments</title>
    <parentTitle language="eng">IEEE 35th Annual Power Electronics Specialists Conference (IEEE Cat. No.04CH37551)</parentTitle>
    <enrichment key="PeerReviewed">Ja</enrichment>
    <enrichment key="RS_Correlation">Nein</enrichment>
    <enrichment key="opus.source">publish</enrichment>
    <enrichment key="review.accepted_by">2</enrichment>
    <author>M. Gerber</author>
    <author>J.A. Ferreira</author>
    <author>I.W. Hofsajer</author>
    <author>Norbert Seliger</author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>DC/DC converter</value>
    </subject>
    <collection role="ddc" number="600">Technik, Technologie</collection>
    <collection role="institutes" number="">Fakultät für Ingenieurwissenschaften</collection>
    <thesisPublisher>Technische Hochschule Rosenheim</thesisPublisher>
  </doc>
  <doc>
    <id>2256</id>
    <completedYear>2004</completedYear>
    <publishedYear/>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst>1031</pageFirst>
    <pageLast>1038</pageLast>
    <pageNumber/>
    <edition/>
    <issue>4</issue>
    <volume>40</volume>
    <type>article</type>
    <publisherName>IEEE</publisherName>
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    <author>M. Gerber</author>
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