@inproceedings{WohlschlaegerVersenHolstetal.2019, author = {Wohlschl{\"a}ger, Maximilian and Versen, Martin and Holst, Gerhard and Franke, Robert}, title = {An Approach of Identifying Polymers With Fluorescence Lifetime Imaging}, series = {2019 IEEE International Conference on Electrical Engineering and Photonics (EExPolytech)}, booktitle = {2019 IEEE International Conference on Electrical Engineering and Photonics (EExPolytech)}, pages = {186 -- 189}, year = {2019}, abstract = {Nowadays, fluorescence lifetime measurements and the method of fluorescence lifetime imaging are already state of the art in biomedical research. Also first investigations show that polymers could be identified due to their endogenous fluorescent lifetime. Thus an approach of identifying polymers with fluorescence lifetime imaging is done in this contribution. Therefore, four different polymers are examined and evaluated with statistical methods in order to determine their specific fluorescence lifetimes.}, language = {en} } @inproceedings{DahlbergVersen2019, author = {Dahlberg, B. and Versen, Martin}, title = {Loop transformation algorithm for test vector accessing at high speed}, series = {ISTFA 2019: Proceedings from the 45th International Symposium for Testing and Failure Analysis}, booktitle = {ISTFA 2019: Proceedings from the 45th International Symposium for Testing and Failure Analysis}, pages = {434 -- 439}, year = {2019}, language = {en} } @inproceedings{WohlschlaegerVersenLanghals2019, author = {Wohlschl{\"a}ger, Maximilian and Versen, Martin and Langhals, H.}, title = {A method for sorting of plastics with an apparatus specific quantum efficiency approach}, series = {2019 IEEE Sensors Applications Symposium (SAS)}, booktitle = {2019 IEEE Sensors Applications Symposium (SAS)}, year = {2019}, abstract = {Today, the automatic separation of polymers from each other in an industrial scale is an unsolved problem. In laboratory environments, two methods are known whereby plastic is sorted either by color or by fluorescence decay time measurements that require fast synchronization and thus expensive equipment. A simple and pragmatic process is proposed to separate plastics from each other: all fluorescent photons are counted in relation to the absorbed photons. A theoretical model and an experimental setup are built in order to determine an apparatus specific quantum efficiency.}, language = {en} } @inproceedings{VersenKipfelsberger2014, author = {Versen, Martin and Kipfelsberger, S.}, title = {Introduction to microcomputer technology with the MSP430 Launch Pad in remote labs}, series = {Global Engineering Education Conference (EDUCON), 2014 IEEE}, booktitle = {Global Engineering Education Conference (EDUCON), 2014 IEEE}, year = {2014}, abstract = {Texas Instruments' MSP430 Launch Pad is used as a key component for remote labs that complement an introduction course to microcomputer technology in the bachelor program Mechatronic at the University of Applied Sciences in Rosenheim. The remote labs use breakout boards and include a timer experiment with generation of pulse width modulation signals, I2C communication and analog to digital conversion.}, language = {en} } @inproceedings{VersenBernhardtHeigletal.2012, author = {Versen, Martin and Bernhardt, and Heigl, M. and Viehhauser, P. and Zentgraf, P.}, title = {System for real-time data acquisition and processing on a hail-fighter aeroplane}, series = {Proceedings of the 5th European DSP Education and Research Conference}, booktitle = {Proceedings of the 5th European DSP Education and Research Conference}, year = {2012}, abstract = {The System HAILsens implements a device for Real-Time sensor data processing, running on a Texas Instruments Concerto M3 core. An I2C interface is used for sensor communications. Ethernet with UDP on a custom developed three layered frame organisation of sensor data serves as a link to the main system on board of an aeroplane. For backing up the acquired data, all frames are locally stored on an SD Card. To have the possibility of easily checking the current system status, an LCD module and a push-button provide a minimal user interface.}, language = {en} } @incollection{Versen2011, author = {Versen, Martin}, title = {DRAM Failure Analysis and Defect Localization Techniques, Microelectronics Failure Analysis}, series = {Desk Reference Sixth Edition}, booktitle = {Desk Reference Sixth Edition}, publisher = {ASM International}, address = {Ohio}, publisher = {Technische Hochschule Rosenheim}, year = {2011}, abstract = {Comprehensive guide to the process and test methods used for electronic device failure analysis. Contains dozens of articles—contributed by industry experts—covering a wide range of topics involving the failure analysis of microelectronics. It places the most important and up-to-date information on this subject at your fingertips.  Topic coverage includes:  Failure Analysis Process Flow Failure Verification  Failure Modes and Failure Classification  Special Devices (MEMS, Optoelectronics, Passives)  Fault Localization Techniques: Package Level (NDT)  Die Level (Depackaging, Photon Emission, Microthermography, Laser-Based Methods, Particle Beam Methods)  Deprocessing \& Imaging Techniques: Deprocessing  General Imaging Techniques  Local Deprocessing \& Imaging  Circuit Edit and Design Modification  Material Analysis Techniques  Reference Information: Important Topics for Semiconductor Devices  Failure Analysis Techniques Roadmap  Failure Analysis Operations and Management  Appendices: Failure Analysis Terms, Definitions, and Acronyms  Industry Standards}, language = {en} } @inproceedings{VersenShankarEnimidisettyetal.2011, author = {Versen, Martin and Shankar, S. and Enimidisetty, S. and Bernhardt, A. and Srinivasan, B.}, title = {Setup for Locating PV-Cell Surface Defects Through ISC Measurements}, series = {Proceedings of the 37th ISTFA 2011}, booktitle = {Proceedings of the 37th ISTFA 2011}, year = {2011}, language = {en} } @inproceedings{Versen2011, author = {Versen, Martin}, title = {Worst Case Test Conditions for Defect Localization in DRAM Devices}, series = {Microelectronics Seminar of the ISTFA 2011}, booktitle = {Microelectronics Seminar of the ISTFA 2011}, year = {2011}, language = {en} } @inproceedings{VersenTreichlKalteneckeretal.2018, author = {Versen, Martin and Treichl, R. and Kaltenecker, M. and El Shahawy, H. and Thomas, T. T.}, title = {Differentielle LVDS Schnittstelle f{\"u}r modellbasierte Entw{\"u}rfe mit MathWorks HDL Coder}, series = {15. AALE Konferenz zu Cyberphysischen Produktionssystemen, 2018}, booktitle = {15. AALE Konferenz zu Cyberphysischen Produktionssystemen, 2018}, publisher = {VDE-Verlag}, address = {Berlin}, isbn = {978-3-8007-4522-7}, year = {2018}, language = {de} } @article{VersenErnstGulati2017, author = {Versen, Martin and Ernst, W. and Gulati, P.}, title = {A row hammer pattern analysis of DDR2 SDRAM}, series = {Microelectronics Reliability}, volume = {76-77}, journal = {Microelectronics Reliability}, pages = {64 -- 67}, year = {2017}, abstract = {A DDR2 SDRAM test setup implemented on the Griffin III ATE test system from HILEVEL Technologies is used to analyse the row hammer bug. Row hammer pattern experiments are compared to standard retention tests. The analysis confirms that the row hammer effect is caused by a charge excitation process depending on the number of stress activation cycles. The stress has to occur in the local neighborhood of the cells under test. Shallow impurity levels support the responsible charge carrier transport process in the used DDR2 SDRAM technology}, language = {en} } @inproceedings{VersenKipfelsbergerSoekmen2016, author = {Versen, Martin and Kipfelsberger, F. and Soekmen, F.}, title = {Model-Based Reference Design Projects with MathWorks' HDL Workflow Advisor for Custom-Specific Electronics with the Zedboard}, series = {ANALOG 2016; 15. ITG/GMM-Symposium, Bremen, Germany}, booktitle = {ANALOG 2016; 15. ITG/GMM-Symposium, Bremen, Germany}, year = {2016}, abstract = {Reference design projects are implemented to the Xilinx Zynq on the Zedboard which is extended by user defined electronic hardware connected through the Zedboard's FMC (FPGA Mezzanine Card) connector. The implementation method with HDL Workflow Advisor includes constraint definitions for modified reference design projects for use with digital input and outputs and Zynq's XADC (Analog-Digital converter) which is characterized and compared to its data sheet. The bandwidth of the Zynq's internal AXI (Advanced eXtensible Interface) bus connected to the Simulink host PC is determined.}, language = {en} }