@inproceedings{Seliger2021, author = {Seliger, Norbert}, title = {A Free Oscillating Half-Bridge Converter for Capacitively Coupled Wireless Power Transfer}, series = {IEEE 6th International Forum on Research and Technology for Society and Industry (RTSI)}, booktitle = {IEEE 6th International Forum on Research and Technology for Society and Industry (RTSI)}, publisher = {IEEE}, pages = {6}, year = {2021}, abstract = {In this research we present a short distance capacitively coupled wireless power transfer (WPT) system with a self-oscillating half-bridge converter, which uses a positive feedback signal from the WPT system. By this novel implementation we find additional features of the system compared to linear amplifier based systems. With the DC bias voltage supplying the power converter, we achieve a controllable output power, tunable self-oscillation frequency and extension of the self-oscillation range. We present the analytical expressions for the converter waveforms. The theoretical analysis is confirmed by circuit simulation results and measurements on a prototype featuring a half-bridge converter with Gallium-Nitide (GaN) HEMTs. We achieve a system efficiency of 93\% at a load power of 83W and 150kHz switching frequency.}, language = {en} } @inproceedings{WeidnerKasparSeliger2011, author = {Weidner, Karl and Kaspar, Michael and Seliger, Norbert}, title = {Innovative Leistungsmodule}, series = {Produktion von Leiterplatten und Systemen (PLUS)}, booktitle = {Produktion von Leiterplatten und Systemen (PLUS)}, pages = {1408 -- 1412}, year = {2011}, language = {de} } @inproceedings{WeidnerKasparSeliger2012, author = {Weidner, Karl and Kaspar, Michael and Seliger, Norbert}, title = {Planar Interconnect Technology for Power Module System Integration}, series = {7th International Conference on Integrated Power Electronics Systems (CIPS)}, booktitle = {7th International Conference on Integrated Power Electronics Systems (CIPS)}, publisher = {VDE-VERLAG GMBH}, pages = {13.1}, year = {2012}, abstract = {The recent developments in power semiconductor devices and increasing demands on reliability as well as on operation performance require innovative package technologies. Such a novel package technique based on a Planar Interconnect Technology (SiPLIT®) for power modules is introduced in this work. This package features thick Cu interconnects on a high-reliable insulating film for power semiconductor chip top contacts. Due to the conductor structure and contact technology, on-resistance and stray inductances are very low compared to state-of-the-art Al wire bonds. In addition, large area contacting improves the power cycling capability and surge current robustness significantly. These remark-able properties have been verified on several prototype modules where the manufacturing process has also been optimised in terms of cost-effectiveness, system integration and maturity for series production.}, language = {en} } @inproceedings{Seliger2012, author = {Seliger, Norbert}, title = {Zuverl{\"a}ssigkeit mechatronischer Systeme: Bewertung der Lebensdauer der Leistungselektronik}, series = {Internationales Forum Mechatronik}, booktitle = {Internationales Forum Mechatronik}, pages = {11}, year = {2012}, language = {de} } @inproceedings{Seliger2014, author = {Seliger, Norbert}, title = {Probabilistic model based analysis of electrolytic capacitor ageing and failures in a single-phase power factor correction circuit}, series = {8th International Conference on Integrated Power Electronics Systems (CIPS)}, booktitle = {8th International Conference on Integrated Power Electronics Systems (CIPS)}, publisher = {VDE-VERLAG GMBH}, pages = {6}, year = {2014}, abstract = {Wear-out failures of electrolytic capacitors in single phase power factor correction circuits are investigated in this study. A probabilistic model based approach for temperature driven capacitor degradation is chosen to analyse the probability of failure of the output capacitor bank. Different design strategies are proposed and evaluated in terms of reliability. Parametric variation of capacitor bank designs provides influential effects on system volume, cost and reliability which is modeled for a sample size of 1000 power supply units.}, language = {en} } @inproceedings{StoettnerSeliger2018, author = {Stoettner, Julia and Seliger, Norbert}, title = {Ring resonator based signal and power transfer at UHF frequencies}, series = {6th International EURASIP Workshop on RFID Technology (EURFID)}, booktitle = {6th International EURASIP Workshop on RFID Technology (EURFID)}, publisher = {IEEE}, pages = {8}, year = {2018}, abstract = {We present low-cost, high-efficient electromagnetic coupling between open ring geometry and a so-called butterfly structure on standard printed circuit boards (FR4) for the purpose of short range wireless data and power transfer at an UHF resonance frequency of 868 MHz. The components of the transfer system are characterized by simulation and experiments in terms of associated scattering parameters. Characterizing the efficiency of the coupled resonators, RF signal power transmission is examined for high power transfer as well as for low power DC supply utilizing a voltage doubler rectifier. With an enhanced butterfly structure coupler, unmodulated RF power transmission of 17.3 W is achieved with an efficiency of more than 95\%. Furthermore, signal transmission of Pulse-Width-Modulated (PWM) signals with frequencies up to 5 MHz is demonstrated.}, language = {en} } @inproceedings{DechantSeligerKennel2020, author = {Dechant, Eduard and Seliger, Norbert and Kennel, Ralph}, title = {Design of a Low Multi-Loop Inductance Three Level Neutral Point Clamped Converter with GaN HEMTs}, series = {IEEE Energy Conversion Congress and Exposition (ECCE)}, booktitle = {IEEE Energy Conversion Congress and Exposition (ECCE)}, publisher = {IEEE}, pages = {6}, year = {2020}, abstract = {This work shows a numerical and experimental analysis of a Neutral-Point-Clamp (NPC) three level inverter featuring an ultra low inductance printed circuit board (PCB) design in consideration of the mutual inductive and capacitive couplings. The commutation loops in this design are found to be strongly dependent on the vertical thickness of the used prepregs and the core. For vertical thicknesses ≤ 100 μm capacitive coupling must be taken into account in the switching cell design. Experimental measurements of a test set-up with a total PCB thickness of 400 μm results in commutation loop inductances from 1.4 nH up to 3.1 nH. In this set-up, switching tests without external gate resistor showed only a maximum voltage overshoot of 7\% at 800 V. Based on a numerical analysis of the NPC cell we propose a further switching performance improvement with significant smaller parasitic inductance due to the application of novel printed circuit technologies such as the integration of bare dies into the printed circuit board or polyimide as an interlayer dielectric material.}, language = {en} } @inproceedings{Seliger2022, author = {Seliger, Norbert}, title = {A Differential Relaxation Oscillator for Inductive Power Transfer}, series = {2022 IEEE Industrial Electronics and Applications Conference (IEACon)}, booktitle = {2022 IEEE Industrial Electronics and Applications Conference (IEACon)}, publisher = {IEEE}, pages = {1 -- 6}, year = {2022}, abstract = {We present a novel differential relaxation oscillator for inductive power transfer. The proposed oscillator offers an automatic adaption of the oscillation period to a change in the power link impedance, which ensures a high efficient operation for variable loads and coupling factors. A detailed circuit model of the self-oscillation system is provided with analytical design equations. We find a large self-oscillation range for variable coupling factors and loads. The theoretical results are confirmed by circuit simulation and measurements carried out on a low-power demonstrator system. We demonstrate non-resonant and robust self-adaption of the relaxation oscillator to coupling factors ranging from k=0.6-0.9.}, language = {en} } @inproceedings{Seliger2022, author = {Seliger, Norbert}, title = {Self-Oscillating Capacitive Power Transfer with Multiple Receiver Capability and Coupling Path Adaption}, series = {Proceedings 24th European Conference on Power Electronics and Applications (EPE'22 ECCE Europe)}, booktitle = {Proceedings 24th European Conference on Power Electronics and Applications (EPE'22 ECCE Europe)}, publisher = {EPE}, organization = {Labor f{\"u}r Leistungselektronik und EMV, TH Rosenheim}, pages = {6}, year = {2022}, language = {en} } @inproceedings{SeligerDechantKennel2022, author = {Seliger, Norbert and Dechant, Eduard and Kennel, Ralph}, title = {EMI mitigation by substrate integrated common mode filter}, series = {Proceedings of 12th International Conference on Integrated Power Electronics Systems (CIPS 2022)}, booktitle = {Proceedings of 12th International Conference on Integrated Power Electronics Systems (CIPS 2022)}, publisher = {VDE}, address = {Berlin (Germany)}, organization = {Labor f{\"u}r Leistungselektronik und EMV, TH Rosenheim}, year = {2022}, language = {en} } @inproceedings{DechantSeligerKennel2022, author = {Dechant, Eduard and Seliger, Norbert and Kennel, Ralph}, title = {Common Mode DGS EMI Filter Integrated into a GaN Half Bridge Switching Cell}, series = {Procceedings International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management (PCIM 2022)}, booktitle = {Procceedings International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management (PCIM 2022)}, publisher = {Mesago}, organization = {Labor f{\"u}r Leistungselektronik und EMV, TH Rosenheim}, pages = {6}, year = {2022}, language = {en} } @inproceedings{SeligerFaltlhauser2022, author = {Seliger, Norbert and Faltlhauser, Georg}, title = {Active Expansion Sampling of Magnetic Near-Fields in Unbounded Regions}, series = {Proceedings 26th IEEE Workshop on Signal and Power Integrity (IEEE SPI-2022)}, booktitle = {Proceedings 26th IEEE Workshop on Signal and Power Integrity (IEEE SPI-2022)}, publisher = {IEEE}, organization = {Labor f{\"u}r Leistungselektronik und EMV, TH Rosenheim}, pages = {4}, year = {2022}, language = {en} } @inproceedings{ThalhammerFuerboeckSeligeretal.1998, author = {Thalhammer, R. and Fuerboeck, C. and Seliger, Norbert and Gornik, E. and Wachutka, G.}, title = {Validation and calibration of Electrothermal Device Models Using Infrared Laser Probing Techniques}, series = {Technical Proceedings of the 1998 International Conference on Modeling and Simulation of Microsystems (Proc. of MSM'98)}, booktitle = {Technical Proceedings of the 1998 International Conference on Modeling and Simulation of Microsystems (Proc. of MSM'98)}, pages = {213 -- 217}, year = {1998}, language = {en} }