@inproceedings{SeligerRammingerFrankeetal.2000, author = {Seliger, Norbert and Ramminger, S. and Franke, T. and Wachutka, G.}, title = {A study of heel crack failures in wire bonds under mechanical cycling}, series = {Proceedings of Micromat 2000}, booktitle = {Proceedings of Micromat 2000}, year = {2000}, language = {en} } @inproceedings{WeidnerKasparSeliger2012, author = {Weidner, Karl and Kaspar, Michael and Seliger, Norbert}, title = {Planar Interconnect Technology for Power Module System Integration}, series = {7th International Conference on Integrated Power Electronics Systems (CIPS)}, booktitle = {7th International Conference on Integrated Power Electronics Systems (CIPS)}, publisher = {VDE-VERLAG GMBH}, pages = {13.1}, year = {2012}, abstract = {The recent developments in power semiconductor devices and increasing demands on reliability as well as on operation performance require innovative package technologies. Such a novel package technique based on a Planar Interconnect Technology (SiPLIT®) for power modules is introduced in this work. This package features thick Cu interconnects on a high-reliable insulating film for power semiconductor chip top contacts. Due to the conductor structure and contact technology, on-resistance and stray inductances are very low compared to state-of-the-art Al wire bonds. In addition, large area contacting improves the power cycling capability and surge current robustness significantly. These remark-able properties have been verified on several prototype modules where the manufacturing process has also been optimised in terms of cost-effectiveness, system integration and maturity for series production.}, language = {en} } @article{PeterSchulenbergBuchananetal.2016, author = {Peter, C. and Schulenberg, S. E. and Buchanan, E. M. and Prodinger, Birgit and Geyh, S.}, title = {Rasch analysis of measurement instruments capturing psychological personal factors in persons with spinal cord injury}, series = {Journal of Rehabilitation Medicine}, volume = {48}, journal = {Journal of Rehabilitation Medicine}, number = {2}, pages = {175 -- 188}, year = {2016}, abstract = {Objective: To evaluate the metric properties of distinct measures of psychological personal factors comprising feelings, beliefs, motives, and patterns of experience and behaviour assessed in the Swiss Spinal Cord Injury Cohort Study (SwiSCI), using Rasch methodology. Methods: SwiSCI Pathway 2 is a community-based, nationwide, cross-sectional survey for persons with spinal cord injury (SCI) (n = 511). The Rasch partial credit model was used for each subscale of the Positive Affect Negative Affect Scale (PANAS), Appraisal of Life Events Scale (ALE), Purpose in Life test - Short Form (PIL-SF), and the Big Five Inventory-K (BFI-K). Results: The measures were unidimensional, with the exception of the positive affect items of the PANAS, where pairwise t-tests resulted in 10\% significant cases, indicating multidimensionality. The BFI-K subscale agreeableness revealed low reliability (0.53). Other reliability estimates ranged between 0.61 and 0.89. Ceiling and floor effects were found for most measures. SCI-related differential item functioning (DIF) was rarely found. Language DIF was identified for several items of the BFI-K, PANAS and the ALE, but not for the PIL-SF. Conclusion: A majority of the measures satisfy the assumptions of the Rasch model, including unidimensionality. Invariance across language versions still represents a major challenge.}, language = {en} }