@incollection{SeligerFuerboeckHabasetal.1997, author = {Seliger, Norbert and Fuerboeck, C. and Habas, P. and Pogany, D. and Gornik, E.}, title = {Backside-Laserprober Technique for Characterisation of Semiconductor Power Devices}, series = {Proceedings of the Seminar Basics and Technology of Electronic Devices}, booktitle = {Proceedings of the Seminar Basics and Technology of Electronic Devices}, publisher = {Technische Hochschule Rosenheim}, pages = {143 -- 147}, year = {1997}, language = {en} } @incollection{Versen2011, author = {Versen, Martin}, title = {DRAM Failure Analysis and Defect Localization Techniques, Microelectronics Failure Analysis}, series = {Desk Reference Sixth Edition}, booktitle = {Desk Reference Sixth Edition}, publisher = {ASM International}, address = {Ohio}, publisher = {Technische Hochschule Rosenheim}, year = {2011}, abstract = {Comprehensive guide to the process and test methods used for electronic device failure analysis. Contains dozens of articles—contributed by industry experts—covering a wide range of topics involving the failure analysis of microelectronics. It places the most important and up-to-date information on this subject at your fingertips.  Topic coverage includes:  Failure Analysis Process Flow Failure Verification  Failure Modes and Failure Classification  Special Devices (MEMS, Optoelectronics, Passives)  Fault Localization Techniques: Package Level (NDT)  Die Level (Depackaging, Photon Emission, Microthermography, Laser-Based Methods, Particle Beam Methods)  Deprocessing \& Imaging Techniques: Deprocessing  General Imaging Techniques  Local Deprocessing \& Imaging  Circuit Edit and Design Modification  Material Analysis Techniques  Reference Information: Important Topics for Semiconductor Devices  Failure Analysis Techniques Roadmap  Failure Analysis Operations and Management  Appendices: Failure Analysis Terms, Definitions, and Acronyms  Industry Standards}, language = {en} } @incollection{Versen2019, author = {Versen, Martin}, title = {DRAM Failure Analysis and Defect Localization Techniques}, series = {Microelectronics Failure Analysis, Desk Reference}, booktitle = {Microelectronics Failure Analysis, Desk Reference}, editor = {Gandhi, Tejinder}, edition = {Seventh Edition}, publisher = {ASM International}, address = {Ohio}, isbn = {978-1-62708-247-1}, publisher = {Technische Hochschule Rosenheim}, pages = {499 -- 505}, year = {2019}, language = {en} }