@article{GerberFerreiraHofsajeretal.2004, author = {Gerber, M. and Ferreira, J.A. and Hofsajer, I.W. and Seliger, Norbert}, title = {A high-density heat-sink-mounted inductor for automotive applications}, series = {IEEE Transactions on Industry Applications}, volume = {40}, journal = {IEEE Transactions on Industry Applications}, number = {4}, publisher = {IEEE}, pages = {1031 -- 1038}, year = {2004}, language = {en} } @article{GerberFerreiraSeligeretal.2005, author = {Gerber, M. and Ferreira, J.A. and Seliger, Norbert and Hofsajer, I.W.}, title = {High density packaging of the passive components in an automotive DC/DC converter}, series = {IEEE Transactions on Power Electronics}, volume = {20}, journal = {IEEE Transactions on Power Electronics}, number = {2}, publisher = {IEEE}, pages = {268 -- 275}, year = {2005}, language = {en} } @article{GerberFerreiraSeligeretal.2005, author = {Gerber, M. and Ferreira, J.A. and Seliger, Norbert and Hofsajer, I.W.}, title = {Integral 3-D thermal, electrical and mechanical design of an automotive DC/DC converter}, series = {IEEE Transactions on Power Electronics}, volume = {20}, journal = {IEEE Transactions on Power Electronics}, number = {3}, publisher = {IEEE}, pages = {566 -- 575}, year = {2005}, language = {en} } @article{FuerboeckPoganyLitzenbergeretal.2000, author = {F{\"u}rb{\"o}ck, C. and Pogany, D. and Litzenberger, M. and Gornik, E. and Seliger, Norbert and Gossner, H. and M{\"u}ller-Lynch, T. and Stecher, M. and Werner, W.}, title = {Interferometric temperature mapping during ESD stress and failure analysis of smart power technology ESD protection devices}, series = {Journal of Electrostatics}, volume = {49}, journal = {Journal of Electrostatics}, pages = {195 -- 213}, year = {2000}, language = {en} } @article{SeligerFaltlhauser2023, author = {Seliger, Norbert and Faltlhauser, Georg}, title = {Progressive Expansion Sampling of Quasi-Static Magnetic Fields in Unconfined Regions}, series = {IEEE Transactions on Components, Packaging and Manufacturing Technology}, journal = {IEEE Transactions on Components, Packaging and Manufacturing Technology}, doi = {10.1109/TCPMT.2023.3283285}, pages = {9}, year = {2023}, abstract = {We present a fast and accurate measurement technique for quasi-static magnetic fields by employing a progressive sampling method in an unconfined input space. The proposed machine learning algorithm is tested against uniform sampling on printed circuit board test structures and a buck converter. We prove allocation of multiple, separated regions with predefined lateral field limits at MHz frequencies. The feasibility of equivalent magnetic dipole source modeling based on a small number of samples is demonstrated. Compared to uniform testing, progressive expansion sampling identifies contours of given field limits in less than 3\% of the reference measurement time.}, language = {en} } @article{PoganySeligerLitzenbergeretal.1999, author = {Pogany, D. and Seliger, Norbert and Litzenberger, M. and Gossner, H. and Stecher, M. and M{\"u}ller-Lynch, T. and Werner, W. and Gornik, E.}, title = {Damage analysis in smart-power technology electrostatic discharge (ESD) protection devices}, series = {Microelectronics Reliability}, volume = {39}, journal = {Microelectronics Reliability}, number = {6}, issn = {0026-2714}, doi = {10.1016/S0026-2714(99)00162-6}, pages = {1143 -- 1148}, year = {1999}, language = {en} } @article{SeligerWolfgangLefrancetal.2002, author = {Seliger, Norbert and Wolfgang, E. and Lefranc, G. and Berg, H. and Licht, T.}, title = {Reliable power electronics for automotive applications}, series = {Microelectronics Reliability}, volume = {42}, journal = {Microelectronics Reliability}, number = {9-11}, issn = {0026-2714}, doi = {10.1016/S0026-2714(02)00197-X}, pages = {1597 -- 1604}, year = {2002}, language = {en} } @article{FuerboeckLitzenbergerPoganyetal.1999, author = {F{\"u}rb{\"o}ck, C. and Litzenberger, M. and Pogany, D. and Gornik, E. and Seliger, Norbert and M{\"u}ller-Lynch, T. and Stecher, M. and Goßner, H. and Werner, W.}, title = {Laser interferometric method for ns-time scale thermal mapping of Smart Power ESD protection devices during ESD stress}, series = {Microelectronics Reliability}, volume = {39}, journal = {Microelectronics Reliability}, number = {6}, issn = {0026-2714}, doi = {10.1016/S0026-2714(99)00124-9}, pages = {925 -- 930}, year = {1999}, language = {en} } @article{RammingerSeligerWachutka2000, author = {Ramminger, S. and Seliger, Norbert and Wachutka, G.}, title = {Reliability model for Al wire bonds subjected to heel crack failures}, series = {Microelectronics Reliability}, volume = {40}, journal = {Microelectronics Reliability}, number = {8}, issn = {0026-2714}, doi = {10.1016/S0026-2714(00)00139-6}, pages = {1521 -- 1525}, year = {2000}, language = {en} } @article{CastellazziKrausSeligeretal.2002, author = {Castellazzi, A. and Kraus, R. and Seliger, Norbert and Schmitt-Landsiedel, D.}, title = {Reliability analysis of power MOSFET's with the help of compact models and circuit simulation}, series = {Microelectronics Reliability}, volume = {42}, journal = {Microelectronics Reliability}, number = {9}, issn = {0026-2714}, doi = {10.1016/S0026-2714(02)00198-1}, pages = {1605 -- 1610}, year = {2002}, language = {en} }