TY - JOUR A1 - Ramminger, S. A1 - Seliger, Norbert A1 - Wachutka, G. T1 - Reliability model for Al wire bonds subjected to heel crack failures T2 - Microelectronics Reliability Y1 - 2023 UR - https://opus4.kobv.de/opus4-rosenheim/frontdoor/index/index/docId/2230 SN - 0026-2714 VL - 40 IS - 8 SP - 1521 EP - 1525 ER -