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Field emitter arrays (FEAs) are a promising component for novel vacuum micro- and nanoelectronic devices, such as microwave power amplifiers or fast-switching X-ray sources. However, the interrelated mechanisms responsible for FEA degradation and failure are not fully understood. Therefore, we present a measurement method for quantitative observation of individual emission sites during integral operation using a low-cost, commercially available CMOS imaging sensor. The emission and degradation behavior of three differently doped FEAs is investigated in current-regulated operation. The measurements reveal that the limited current of the p-doped emitters leads to an activation of up to 55% of the individual tips in the array, while the activation of the n-type FEA stopped at around 30%. This enhanced activation results in a more continuous and uniform current distribution for the p-type FEA. An analysis of the individual emitter characteristics before and after a constant current measurement provides novel perspectives on degradation behavior. A burn-in process that trims the emitting tips to an integral current-specific ideal field enhancement factor is observed. In this process, blunt tips are sharpened while sharp tips are dulled, resulting in homogenization within the FEA. The methodology is described in detail, making it easily adaptable for other groups to apply in the further development of promising FEAs.
This is one of a series of special issues published in Advances in Materials Science and Engineering, focusing on the latest advances of smart materials and their applications.
Evolution of engineering materials is strongly depending on the growing transformation of complexity in engineering products. New materials being designed are required to provide specific properties and demonstrate certain functional characteristics by manipulating their dimension, chemistry, and structure through various advanced technologies. Therefore, “smartness” of a material has become the topic of interest. Properties of smart materials may change accordingly to the applied external stimuli.
Under the direction of the editorial team, we showcase advances of organic and inorganic based smart materials and their applications in areas of specific interest such as energy, environment, and health. A total of 9 articles are published in this special issue. Six articles are focused on production, synthesis, and optimization of smart materials; and the remaining are dedicated to application of smart materials.
The homogeneity of emitters is very important for the performance of field emission (FE) devices. Reactive-ion etching (RIE) and oxidation have significant influences on the geometry of silicon tips. The RIE influences mainly the anisotropy of the emitters. Pressure has a strong impact on the anisotropic factor. Reducing the pressure results in a higher anisotropy, but the etch rate is also lower. A longer time of etching compensates this effect. Furthermore an improvement of homogeneity was observed. The impact of uprating is quite low for the anisotropic factor, but significant for the homogeneity. At low power the height and undercut of the emitters are more constant over the whole wafer. The oxidation itself is very homogeneous and has no observable effect on further variation of the homogeneity. This modified fabrication process allows solving the problem of inhomogeneity of previous field emission arrays.
Avoiding ice accumulation on aerodynamic components is of enormous importance to flight safety. Novel approaches utilizing surface dielectric barrier discharges (SDBDs) are expected to be more efficient and effective than conventional solutions for preventing ice accretion on aerodynamic components. In this work, the realization of SDBDs based on thin-film substrates by means of micro-electro-mechanical-systems (MEMS) technology is presented. The anti-icing performance of the MEMS SDBDs is presented and compared to SDBDs manufactured by printed circuit board (PCB) technology. It was observed that the 35 mu m thick electrodes of the PCB SDBDs favor surface icing with an initial accumulation of supercooled water droplets at the electrode impact edges. This effect was not observed for 0.3 mu m thick MEMS-fabricated electrodes indicating a clear advantage for MEMS-technology SDBDs for anti-icing applications. Titanium was identified as the most suitable material for MEMS electrodes. In addition, an optimization of the MEMS-SDBDs with respect to the dielectric materials as well as SDBD design is discussed.
Gas concentration monitoring is essential in industrial or life science areas in order to address safety-relevant or process-related questions. Many of the sensors used in this context are based on the principle of thermal conductivity. The 3ω-method is a very accurate method to determine the thermal properties of materials. It has its origin in the thermal characterization of thin solid films. To date, there have been very few scientific investigations using this method to determine the thermal properties of gases and to apply it to gas measurement technology. In this article, we use two exemplary gases (H2 and CO2) for a systematical investigation of this method in the context of gas analysis. To perform our experiments, we use a robust, reliable sensing element that is already well established in vacuum measurement technology. This helix-shaped thin wire of tungsten exhibits high robustness against chemical and mechanical influences. Our setup features a compact measurement environment, where sensor operation and data acquisition are integrated into a single device. The experimental results show a good agreement with a simplified analytical model and FEM simulations. The sensor exhibits a lower detection limit of 0.62% in the case of CO2, and only 0.062% in case the of H2 at an excitation frequency of 1 Hz. This is one of the lowest values reported in literature for thermal conductivity H2 sensors.
The gasflow created by a minaturized dielectric barrier discharge (DBD) plasma actuator is measured by a MEMS-based thermal conductivity gas sensor giving an indication of flow velocity and flow direction. The possiblity of several sensors in a small area gives a far better accuracy of local flow phenomena compared to conventional sensors. This is important for a better understanding of plasma- induced flow characteristics.