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Distinct electron and hole quasi-Fermi potentials, øf,n and øf,p, are included into a one-dimensional SOI MOSFET model that accounts for finite inversion and depletion layer thicknesses. The inclusion of øf,n, øf,p in the nonlinear analytical model is demonstrated to describe phenomena like kink effect and the multistable-charge-controlled-memory effect (MCCM) in SOI MOSFETs. The calculation of øf,p(t) depends on the device history and generation/recombination rates.
A family of CMOS low- to high-voltage output interface circuits based on a standard, unmodified low-voltage CMOS technology is described. Using only thin-oxide high-voltage (HV) devices with reduced V/sub GS/ (gate-to-source voltage) swing, it makes use of level-shift techniques to meet the constraints on the gate control signals. These static circuits permit the full output voltage swing of V/sub DDH/, while keeping the V/sub GS/ swing of the output devices within the safety limits, including during HV supply transients. Using a standard 2- mu m n-well CMOS technology, reliable, reproducible V/sub DS/ breakdown voltages as high as 120 V and 80 V have been obtained for HV-nMOS and HV-pMOS devices, respectively.< >
An analytical model for the spatial distribution of potential, electric field and carrier densities is presented, assuming uniform doping density and constant quasi-Fermi potentials in the direction of modeling. Starting from the current relations a differential equation respecting two-dimensional effects is developed and solved approximately by decomposition in three regions with different preconditions: (a) flatband region, (b) constant spacecharge density and (c) strong inversion or accumulation. Inaccuracies arise mainly from violated preconditions at the interfaces between the different regions. Two-dimensional effects are respected in the analytical model of (b) only but they influence region (c) by means of boundary conditions at the interface of (b) and (c).
The investigations of this paper are focused to region (c). This part of our model is identical to the model of Hauser and Littlejohn[1]. They integrated a simplified form of the semiconductor-Poisson equation twice but were restricted to one-dimensional applications and thermal equilibrium. Our derivation allows for large electric fields and current densities perpendicular to the direction of modeling. From analytical considerations confirmed by numerical experiments we suggest preference to the gradual channel condition, with x and y defined according to Fig. 1. This definition allows the potentials to vary significantly with respect to y. We found that this holds for the quasi-Fermi potentials also. Furthermore an empirical model for the maximum width of strong-inversion layers in uniformly doped silicon films is presented in eqn (46).
Design and Optimization of High-Voltage CMOS Devices Compatible wih a Standard 5V CMOS Technology
(1993)
High-voltage n- and p-MOSFETs fully compatible with a standard 5 V CMOS technology have been designed, optimized, and fabricated. No process changes are required. By modifying the logical equations generating one of the physical masks from the design masks, a p-type buffer region for the high-voltage p-MOS was easily implemented. This modification does not affect the low-voltage part of the circuits. These high-voltage devices have been used successfully as output drivers in semicustom arrays, and as building blocks for custom low- to high-voltage output interfaces. Aspects of reliability, device protection, and circuit design techniques are addressed.
A one-dimensional analytical model for dual-gate-controlled SOI MOSFETs is presented and applied to a stacked p-channel MOSFET fabricated by epitaxial lateral overgrowth (ELO). The authors found and modeled a nonlinear dependence of front-gate threshold voltage on back-gate voltage if threshold is defined by a constant current instead of a constant silicon-surface potential. It is demonstrated by comparison of subthreshold slopes that surface potentials are not pinned to the onset of strong inversion or accumulation. Accurate one-dimensional modeling is a necessity for device characterization and a precondition for general SOI models for circuit simulation.< >
An analytical model for dual-gate-controlled SOI MOSFETs is presented, assuming uniformly doped p-silicon films. It is restricted to electron inversion layers and depletion regions, neglecting hole densities. It allows to account for the spatial description of electronic quantities in the silicon film. Due to the non-linearities of the semiconductor equations the model parameters must be extracted iteratively. Some applications are presented to demonstrate the usefulness of the model.
HE MODERN LONGITUDINALLY WELDED pipes with new generation of steel materials exhibit excellent mechanical properties due to the continuous improvements in thermomechanical controlled processing of plates (TMCP) and pipe (UOE) production processes. While the adjustment of process parameters allows for optimized design of microstructure, safe installation and operation of these pipes for long distance, gas transmission pipelines require a detailed knowledge and characterization of their deformation and fracture performance for specific application. Although the influence of texture on the material properties can be qualitatively estimated, a quantitative link between the microstructural constituents and mechanical behavior is still missing.
This paper aims to present the procedure for the development of microstructure-based model to quantitatively describe the mechanical behavior of bainitic X80 pipeline steel. In the first step, the metallographic analysis is conducted to identify the microstructural characteristics, such as volume fractions of microstructure constituents (granular and lower bainite, M-A phase) and their distributions. The strength properties in terms of flow curves are determined by tensile tests on mini-flat and round bar specimens with different sizes. Subsequently, a 2D three-phase model is developed based on the results from the quantitative analyses of microstructure with each phase modeled using the von-Mises plasticity theory. The flow curves of single phases are estimated by considering experimental findings, the chemical composition and microstructural description of each phase. This 2D FE model is then applied to predict ielding and hardening behavior. In addition to the 2D three-phase model, a 3D two-phase model is developed for the purposes of exploring the viability of using a spectral solver to analyze X80 synthetic microstructures. Here, the FFT-based approach is compared against the crystal-plastic finite-element method.
The results contribute to a better understanding of the mechanical behavior and allow a more precise microstructure design of the bainitic steels.