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The integration of graphene into microelectronic devices
- Since 2004 the field of graphene research has attracted increasing interest worldwide. Especially the integration of graphene into microelectronic devices has the potential for numerous applications. Therefore, we summarize the current knowledge on this aspect. Surveys show that considerable progress was made in the field of graphene synthesis. However, the central issue consists of the availability of techniques suitable for production for the deposition of graphene on dielectric substrates. Besides, the encapsulation of graphene for further processing while maintaining its properties poses a challenge. Regarding the graphene/metal contact intensive research was done and recently substantial advancements were made towards contact resistances applicable for electronic devices. Generally speaking the crucial issues for graphene integration are identified today and the corresponding research tasks can be clearly defined.
Verfasserangaben: | Guenther Ruhl, Sebastian WittmannORCiD, Matthias Koenig, Daniel NeumaierORCiD |
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DOI: | https://doi.org/10.3762/bjnano.8.107 |
Titel des übergeordneten Werkes (Englisch): | Beilstein Journal of Nanotechnology |
Verlag: | Beilstein-Institut |
Dokumentart: | Artikel aus einer Zeitschrift/Zeitung |
Sprache der Veröffentlichung: | Englisch |
Jahr der Veröffentlichung: | 2017 |
Datum der Freischaltung: | 24.04.2022 |
Freies Schlagwort / Tag: | BORON-NITRIDE; CHEMICAL-VAPOR-DEPOSITION; CONTACT-RESISTANCE; COPPER FOILS; ELECTRODES; FILMS; GROWTH; LOW-TEMPERATURE; RAMAN-SPECTROSCOPY; SUBSTRATE; contacts; deposition; encapsulation; graphene; process integration |
Jahrgang: | 8 |
Erste Seite: | 1056 |
Letzte Seite: | 1064 |
Fakultäten / Institute / Einrichtungen: | Fakultät Angewandte Natur- und Kulturwissenschaften |
Forschungsschwerpunkt: | Produktion und Systeme |
OpenAccess Publikationsweg: | Diamond Open Access - OA-Veröffentlichung ohne Publikationskosten (Sponsoring) |
Lizenz (Deutsch): | Creative Commons - CC BY - Namensnennung 4.0 International |