Transient junction-to-case thermal resistance measurement methodology of high accuracy and high repeatability
- High-power packages show a characteristic three-dimensional heat flow resulting in large lateral changes in chip and case surface temperature. This paper proposes an unambiguous definition for the R/sub thJC/ junction-to-case thermal resistance as a key parameter of such packages based on a transient measurement technique ensuring high repeatability even at very low R/sub th/ values. The techniqueHigh-power packages show a characteristic three-dimensional heat flow resulting in large lateral changes in chip and case surface temperature. This paper proposes an unambiguous definition for the R/sub thJC/ junction-to-case thermal resistance as a key parameter of such packages based on a transient measurement technique ensuring high repeatability even at very low R/sub th/ values. The technique is illustrated on thermal transient measurements of high-power MOSFET devices. It is also presented how the same measurement results can be used for die attach quality analysis. Finally, a comparative method is shown for measuring the differences of R/sub th/ values among samples with many times higher resolution compared with a direct R/sub thJC/ measurement.…
| Author: | Peter Szabó, Oliver SteffensOTHORCiDGND, Michael Lenz, Gábor Farkas |
|---|---|
| DOI: | https://doi.org/10.1109/TCAPT.2005.859768 |
| ISSN: | 1521-3331 |
| Parent Title (English): | IEEE Transactions on Components and Packaging Technologies |
| Document Type: | Article |
| Language: | English |
| Year of first Publication: | 2005 |
| Release Date: | 2021/09/15 |
| Tag: | Cold plates; Electrical resistance measurement; MOSFET circuits; Microassembly; Packaging; Semiconductor device measurement; Surface resistance; Temperature; Thermal conductivity; Thermal resistance |
| Volume: | 28 |
| Issue: | 4 |
| First Page: | 630 |
| Last Page: | 636 |
| Konferenzangabe: | Therminic 2004 Conference, Sophia Antipolis, France, 2004 |
| Institutes: | Fakultät Angewandte Natur- und Kulturwissenschaften |
| Fakultät Angewandte Natur- und Kulturwissenschaften / Labor Bauphysik | |
| Begutachtungsstatus: | peer-reviewed |
| Publication: | Externe Publikationen |
| research focus: | Materialien und Produktion |
| Frontdoor-URL: | https://opus4.kobv.de/opus4-oth-regensburg/2048 |
