Open Access

Horst Theuss, Klaus Elian, Markus Fink, M. Fries, Franz-Peter Kalz, B. Schwabe, M. Vaupel, C. Jaroschek, A. Schubert, H. Hummel, Oliver Steffens

• A semiconductor die typically undergoes a variety of assembly processes, each of them influencing the mechanical stress environment of the chip. We report on a stress-sensitive testchip and its application to measure and characterize the respective stress distributions across the die. Particularly in the field of MEMS and sensor devices, even low stresses might deteriorate the electricalA semiconductor die typically undergoes a variety of assembly processes, each of them influencing the mechanical stress environment of the chip. We report on a stress-sensitive testchip and its application to measure and characterize the respective stress distributions across the die. Particularly in the field of MEMS and sensor devices, even low stresses might deteriorate the electrical performance of a device significantly, while higher stress levels may even cause cracks and irreversible damage. This is why the present methodology has a high potential to develop into a useful tool in the field of sensor package development. After a brief introduction to the sensing principle, we investigate the stress distribution in various sample assemblies – all of them targeting pressure sensors. Typical low stress packages use silicone based soft elastic encapsulations. Changing to a harder material with a young’s modulus comparable to standard mold compounds, we demonstrate an increase of the average stress level by more than one order of magnitude.…