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Thermally stimulated depolarization current - characterization of a multi-layer dielectric stack for semiconductor packages

  • In this paper, the results of Thermally Stimulated Depolarization Currents (TSDC)-measurements of a complex system of stacked dielectric layers, like typically appearing in semiconductor packages, is presented. Characteristics of the individual isolation layers are presented solely and the results are compared to the stack. The investigated layers are comprising polyimide film, alkali-free glass, polyolefin film and epoxy based mold compound. Measurements have been carried out in the temperature range from 19 - 195°C at varying polarization fields for every material. Various relaxation peaks, originated by different polarization mechanisms within the materials could be observed. A comparison between the TSDC-peaks of the layer stack and the individual materials is shown. Our results demonstrate, that the super positioned spectrum is getting dominated by a single portion, the mold compound.

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Metadaten
Author:R. Schaller, F. Maier, Roland Mandl
DOI:https://doi.org/10.1109/ASDAM55965.2022.9966799
ISBN:978-1-6654-6977-7
Parent Title (English):2022 14th International Conference on Advanced Semiconductor Devices and Microsystems (ASDAM), 23-26 October 2022, Smolenice Castle, Slovakia
Publisher:IEEE
Document Type:conference proceeding (article)
Language:English
Year of first Publication:2022
Release Date:2023/10/13
Tag:Glass; Micromechanical devices; Polyimides; Semiconductor device measurement; Semiconductor devices; Temperature distribution; Temperature measurement
First Page:1
Last Page:5
Institutes:Fakultät Elektro- und Informationstechnik
Fakultät Elektro- und Informationstechnik / Labor Smart Embedded Systems
Begutachtungsstatus:peer-reviewed
research focus:Produktion und Systeme
Licence (German):Keine Lizenz - Es gilt das deutsche Urheberrecht: § 53 UrhG