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Heat staking of polymer parts generated by fused layer modeling

  • Heat staking is a joining technology by which thermoplastic pins are formed by force and temperature to create a form- and force-fitting connection between components. This paper examines the characteristics of 3D printed pins in comparison to conventionally turned pins for heat staking applications. The 3D printed pins are created using fused layer modeling, with variations in horizontal and vertical building directions, as well as different layer thicknesses. The study investigates the impact of significant factors on the heat staking process, including the forming force and temperature. Tensile tests, micrographs, and micro-CT measurements were conducted to determine the properties of the heat-staked joints. Additionally, a stage plan was developed to enhance the understanding of the forming process of both printed and conventionally turned materials. The findings suggest that, under specific process parameters, 3D printed pins exhibit comparable strength to conventionally manufactured pins. The research also demonstrates that the anisotropy resulting from the layer-by-layer construction of the pins significantly influences the strength of the connection. Furthermore, the study reveals that 3D printed pins exhibit good forming accuracy during the heat staking process, and the cavities formed during printing can be substantially reduced.

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Metadaten
Author:Andreas Kuettner, Max Raths, Samuel Fischer, Tobias LaumerORCiDGND
DOI:https://doi.org/10.1007/s00170-023-11850-y
Parent Title (English):The International Journal of Advanced Manufacturing Technology
Publisher:Springer Nature
Document Type:Article
Language:English
Year of first Publication:2023
Release Date:2023/08/04
Tag:3D printing; Additive manufacturing; Fused layer modeling (FLM); Heat staking; Material qualification; Polycarbonate (PC)
Institutes:Fakultät Maschinenbau
Fakultät Maschinenbau / Labor Additive and Intelligent Manufacturing for Sustainability (AIMS)
research focus:Produktion und Systeme
Licence (German):Keine Lizenz - Es gilt das deutsche Urheberrecht: § 53 UrhG