• search hit 1 of 2
Back to Result List

An acoustic emission sensor system for thin layer crack detection

  • We present a new method for semiconductor layer characterization enabling simultaneous crack generation and detection based on the established acoustic emission testing. In this paper, we explain the test concept and failure mechanism of diamond tip indentation with acoustic wave measurement on oxide layers by analytical modeling and computer-aided simulations. For this purpose, an innovative design of a sensor-indenter system was developed and experimentally verified. In further tests, the new acoustic crack detection method is correlated with proven optical inspection methods and the good reproducibility of the measurement is demonstrated. The high sensitivity and resolution of this method offer new opportunities for thin layer characterization at lower time and cost. The new high-efficient method can be used especially for process qualification for semiconductor wafer test, where oxide cracks can be induced by sharp probes causing electrical failure of the chip.

Export metadata

Additional Services

Share in Twitter Search Google Scholar Statistics
Metadaten
Author:M. Unterreitmeier, O. Nagler, L. Pfitzner, R. Weigel, Rainer Holmer
DOI:https://doi.org/10.1016/j.microrel.2018.07.015
Parent Title (English):Microelectronics Reliability
Publisher:Pergamon-Elsevier
Document Type:Article
Language:English
Year of first Publication:2018
Release Date:2022/03/29
Tag:FLAT; INDENTATION
Volume:88-90
Issue:September
First Page:16
Last Page:21
Konferenzangabe:29th European Symposium on the Reliability of Electron Devices, Failure Physics and Analysis (ESREF), OCT 01-05, 2018, Aalborg, DENMARK
Institutes:Fakultät Elektro- und Informationstechnik
Begutachtungsstatus:peer-reviewed
research focus:Sensorik
Licence (German):Keine Lizenz - Es gilt das deutsche Urheberrecht: § 53 UrhG