TY - CHAP A1 - Theuss, Horst A1 - Elian, Klaus A1 - Fink, Markus A1 - Fries, M. A1 - Kalz, Franz-Peter A1 - Schwabe, B. A1 - Vaupel, M. A1 - Jaroschek, C. A1 - Schubert, A. A1 - Hummel, H. A1 - Steffens, Oliver T1 - Mechanical Stress Impact of Assembly Processes onto a Stress-sensitive Testchip T2 - 44th International Symposium on Microelectronics (IMAPS 2011), October 9 - 13, 2011, Long Beach, California, USA N2 - A semiconductor die typically undergoes a variety of assembly processes, each of them influencing the mechanical stress environment of the chip. We report on a stress-sensitive testchip and its application to measure and characterize the respective stress distributions across the die. Particularly in the field of MEMS and sensor devices, even low stresses might deteriorate the electrical performance of a device significantly, while higher stress levels may even cause cracks and irreversible damage. This is why the present methodology has a high potential to develop into a useful tool in the field of sensor package development. After a brief introduction to the sensing principle, we investigate the stress distribution in various sample assemblies – all of them targeting pressure sensors. Typical low stress packages use silicone based soft elastic encapsulations. Changing to a harder material with a young’s modulus comparable to standard mold compounds, we demonstrate an increase of the average stress level by more than one order of magnitude. Y1 - 2011 SN - 978-1-61839-850-5 U6 - https://doi.org/10.4071/isom-2011-WA5-Paper3 IS - 1 SP - 619 EP - 626 PB - International Microelectronics & Packaging CY - Washington ER - TY - CHAP A1 - Heckner, T. A1 - Straka, M. A1 - Schubert, A. A1 - Petchartee, Somrak A1 - Monkman, Gareth J. T1 - Entwicklung eines Navigationssystems für autonome mobile Robotersysteme T2 - International Mechatronik Forum, Linz Y1 - 2006 SP - 520 EP - 527 ER - TY - JOUR A1 - Beimler, Josef A1 - Leißl, Caroline A1 - Ebner, Lena A1 - Elsner, Michael A1 - Mühlbauer, Gerhard A1 - Kohlert, Dieter A1 - Schubert, Martin J. W. A1 - Weiß, Andreas P. A1 - Sterner, Michael A1 - Raith, Thomas A1 - Afranseder, Martin A1 - Krapf, Tobias A1 - Mottok, Jürgen A1 - Siemers, Christian A1 - Großmann, Benjamin A1 - Höcherl, Johannes A1 - Schlegl, Thomas A1 - Schneider, Ralph A1 - Milaev, Johannes A1 - Rampelt, Christina A1 - Roduner, Christian A1 - Glowa, Christoph A1 - Bachl, Christoph A1 - Schliekmann, Claus A1 - Gnan, Alfons A1 - Grill, Martin A1 - Ruhland, Karl A1 - Piehler, Thomas A1 - Friers, Daniel A1 - Wels, Harald A1 - Pflug, Kenny A1 - Kucera, Markus A1 - Waas, Thomas A1 - Schlachetzki, Felix A1 - Boy, Sandra A1 - Pemmerl, Josef A1 - Leis, Alexander A1 - Welsch, Andreas F.X. A1 - Graf, Franz A1 - Zenger, Gerhard A1 - Volbert, Klaus A1 - Waas, Thomas A1 - Scherzinger, Stefanie A1 - Klettke, Meike A1 - Störl, Uta A1 - Heyl, C. A1 - Boldenko, A. A1 - Monkman, Gareth J. A1 - Kujat, Richard A1 - Briem, Ulrich A1 - Hierl, Stefan A1 - Talbot, Sebastian A1 - Schmailzl, Anton A1 - Ławrowski, Robert Damian A1 - Prommesberger, Christian A1 - Langer, Christoph A1 - Dams, Florian A1 - Schreiner, Rupert A1 - Valentino, Piergiorgio A1 - Romano, Marco A1 - Ehrlich, Ingo A1 - Furgiuele, Franco A1 - Gebbeken, Norbert A1 - Eisenried, Michael A1 - Jungbauer, Bastian A1 - Hutterer, Albert A1 - Bauhuber, Michael A1 - Mikrievskij, Andreas A1 - Argauer, Monika A1 - Hummel, Helmut A1 - Lechner, Alfred A1 - Liebetruth, Thomas A1 - Schumm, Michael A1 - Joseph, Saskia A1 - Reschke, Michael A1 - Soska, Alexander A1 - Schroll-Decker, Irmgard A1 - Putzer, Michael A1 - Rasmussen, John A1 - Dendorfer, Sebastian A1 - Weber, Tim A1 - Al-Munajjed, Amir Andreas A1 - Verkerke, Gijsbertus Jacob A1 - Renkawitz, Tobias A1 - Haug, Sonja A1 - Rudolph, Clarissa A1 - Zeitler, Annika A1 - Schaubeck, Simon A1 - Steffens, Oliver A1 - Rechenauer, Christian A1 - Schulz-Brize, Thekla A1 - Fleischmann, Florian A1 - Kusterle, Wolfgang A1 - Beer, Anne A1 - Wagner, Bernd A1 - Neidhart, Thomas ED - Baier, Wolfgang T1 - Forschungsbericht 2013 T3 - Forschungsberichte der OTH Regensburg - 2013 Y1 - 2014 U6 - http://nbn-resolving.de/urn/resolver.pl?urn:nbn:de:bvb:898-opus4-7990 CY - Regensburg ER -