TY - CHAP A1 - Prommesberger, Christian A1 - Ławrowski, Robert Damian A1 - Langer, Christoph A1 - Mecani, Mirgen A1 - Huang, Yifeng A1 - She, Juncong A1 - Schreiner, Rupert ED - Tiginyanu (Ed.), Ion M. T1 - Field emission properties of ring-shaped Si ridges with DLC coating T2 - Proc. SPIE 10248, Nanotechnology VIII, 102480H (30 May 2017) N2 - We report on the fabrication and the emission characterization of single ring-shaped Si ridges with a coating of diamond-like carbon (DLC). The reactive ion etching and the subsequent inductively coupled plasma step were adjusted to realize ring-shaped Si ridges with a height of 7.5 μm respectively 15 μm and an apex radius of 20 – 25 nm. The samples were coated with a DLC layer (thickness ≈ 2 – 5 nm) by a filtered cathodic vacuum arc deposition system in order to lower the work function of the emitter and to improve the field emission characteristics. The field emission characterizations were done in diode configuration with cathode and anode separated by a 50 μm thick mica spacer. A higher emission current was carried out for the ring-shaped Si ridge in comparison to the point-shaped Si tips due to the increased emission area. The highest emission current of 0.22 μA at 1000 V was measured on a DLC-coated sample with the highest aspect ratio. No degradation of the emission current was observed in the plateau regime during a measurement period of 6 h. Finally, no decreasing performance of the field emission properties was found due to changes in the geometry or destructions. KW - Etching KW - Scanning electron microscopy KW - Silicon carbide KW - Carbon KW - Mica KW - Oxides Y1 - 2017 U6 - https://doi.org/10.1117/12.2265627 VL - 102480H PB - Society of Photo-Optical Instrumentation Engineers (SPIE) ER - TY - CHAP A1 - Ławrowski, Robert Damian A1 - Langer, Christoph A1 - Prommesberger, Christian A1 - Schreiner, Rupert T1 - Field emission from three-dimensional epitaxial grown GaN-microrods T2 - 29th International Vacuum Nanoelectronics Conference (IVNC), 2016, 11-15 July, Vancouver, BC, Canada N2 - A novel three-dimensional epitaxial technique allows on patterned substrates the realization of gallium nitride pillars, also known as nano- and microrods. The typical dimensions of the microrods are in the range of one micron for the radius of the hexagonal footprint and about 10 μm in height. The microrods consist of a semiconductor heterostructure with an n GaN core, a n-GaN shell, a p GaN shell and an intermediate quantum well layer. The field emission properties were investigated in diode configuration by integral field emission measurements in a vacuum chamber at pressures around 10 -9 mbar. The spacer was mica with a thickness of 50 μm. A metallized fine-meshed nitride grid (or a metallized Si-grid) was used as anode. A current of about 1 μA at a voltage of 1250 V (1750 V) was measured. An onset field of about 12.5 MV/m (20 MV/m) and field enhancement factors in the range of 200 to 500 (150 to 300) were found. The investigation with the fine-meshed grid showed an expected pronounced saturation region. KW - field emission KW - GaN KW - LED Y1 - 2016 U6 - https://doi.org/10.1109/IVNC.2016.7551477 SN - 2380-6311 SP - 87 EP - 88 PB - IEEE ER - TY - CHAP A1 - Prommesberger, Christian A1 - Langer, Christoph A1 - Ławrowski, Robert Damian A1 - Schreiner, Rupert T1 - Field emission from black silicon structures with integrated gate electrode T2 - 29th International Vacuum Nanoelectronics Conference (IVNC), 2016, 11-15 July, Vancouver, BC, Canada N2 - Black silicon structures with integrated gate electrode were realized by using an improved fabrication process. An enhanced insulation layer was achieved by a combination of dry and wet oxidation, and a gold layer was evaporated as gate electrode. The black silicon structures were prepared with a RIE/ICP etching process at room temperature. Arrays of 16 and 100 apertures with buried p-doped black silicon whiskers have been fabricated. These structures have an emitter height of approximately 1.5 μm with tip radii between 5 nm and 30 nm. The whiskers are surrounded by the gate electrode in a distance of 1.5 μm. Integral field emission measurements yielded an onset voltage of 92 V for 16 apertures and 60 V for 100 apertures for an emission current of 1 nA. Maximum emission currents up to 0.2 μA were observed for the array with 100 apertures at a cathode voltage of 200 V. Stability measurements showed a current fluctuation of ± 21% at a mean value of the emission current of 12 nA over a period of 30 minutes for 16 apertures with b-Si whiskers. KW - field emission KW - black silicon KW - integrated gate electrode Y1 - 2016 U6 - https://doi.org/10.1109/IVNC.2016.7551532 SN - 2380-6311 SP - 219 EP - 220 PB - IEEE ER - TY - CHAP A1 - Ławrowski, Robert Damian A1 - Langer, Christoph A1 - Prommesberger, Christian A1 - Schreiner, Rupert T1 - Microrods and microlines by three-dimensional epitaxially grown GaN for field emission cathodes T2 - International Vacuum Nanoelectronics Conference (IVNC), 30th, 2017, Regensburg N2 - The three-dimensional epitaxial technique allows the realization of gallium nitride lines in addition to the rods. To optimize the properties of GaN-based field emission cathodes further investigations and an improvement of the epitaxial process were performed. The microrods and microlines consist of a one-order higher n-doped gallium nitride in comparison to the gallium nitride layer on the sapphire substrate. The typical height of the microrods and -lines is about 5 μm. The field emission properties of these structures were investigated in diode configuration by integral field emission measurements at pressures below 10 -9 mbar. For the microrods (microlines) a voltage of 1100 V (2000 V) was measured for a field emission current of about 0.5 μA with an onset field of about 12 MV/m (24 MV/m). Furthermore, the field enhancement factors for microrods and -lines are in the range of 300 and 200, respectively. KW - field emission KW - GaN KW - LED KW - Gallium nitride KW - Epitaxial growth Y1 - 2017 U6 - https://doi.org/10.1109/IVNC.2017.8051576 SP - 130 EP - 131 PB - IEEE ER - TY - CHAP A1 - Bachmann, Michael A1 - Dams, Florian A1 - Düsberg, Felix A1 - Hofmann, Martin A1 - Pahlke, Andreas A1 - Langer, Christoph A1 - Ławrowski, Robert Damian A1 - Prommesberger, Christian A1 - Schreiner, Rupert T1 - Extraction of the characteristics of limiting elements from field emission measurement data T2 - 29th International Vacuum Nanoelectronics Conference (IVNC), 2016, 11-15 July, Vancouver, BC, Canada N2 - In this contribution we will present an algorithm to extract the characteristics of non-Fowler-Nordheim (FN) circuit elements from saturation limited field emission (FE) measurement data. The method for calculating the voltage drop on limiting circuit elements is based on circuit theory as well as Newton's method. Since no assumption on the limiting circuit is made, this method is applicable to any FE data showing saturation. To be able to determine the significance of any parameter output, the uncertainties of data and extracted parameters are fully taken into account throughout the algorithm. External serial resistors and a limiting p-doped substrate are analyzed, where the latter shows a diode-like behavior. Y1 - 2016 U6 - https://doi.org/10.1109/IVNC.2016.7551474 SN - 2380-6311 SP - 81 EP - 82 PB - IEEE ER - TY - CHAP A1 - Langer, Christoph A1 - Prommesberger, Christian A1 - Ławrowski, Robert Damian A1 - Schreiner, Rupert A1 - Huang, Yifeng A1 - She, Juncong T1 - Gated p-Si field emission cathode applied in an ionization vacuum gauge T2 - 29th International Vacuum Nanoelectronics Conference (IVNC), 2016, 11-15 July, Vancouver, BC, Canada N2 - A commercial Bayard-Alpert ionization vacuum gauge was equipped with a field emission electron source based on a cathode consisting of an array of 16 gated, p-doped, and DLC-coated Si-tips and characterized. An anode current of about 1.3 μA led to an ion current of 7 fA at 3×10 -7 mbar and 0.8 pA at 4×10 -5 mbar. Whereas at pressures higher than 4×10 -5 mbar the emission current of the electron source decreased, the ratio of ion and anode current remained linear. A nearly constant sensitivity of ~ 17 mbar -1 of the ionization vacuum gauge within the investigated pressure range was depicted. KW - field emission KW - field emitter array KW - Si KW - DLC KW - electron source KW - ionization vacuum gauge Y1 - 2016 U6 - https://doi.org/10.1109/IVNC.2016.7551500 SN - 2380-6311 SP - 145 EP - 146 PB - IEEE ER - TY - CHAP A1 - Bachmann, Michael A1 - Dams, Florian A1 - Düsberg, Felix A1 - Hofmann, Martin A1 - Pahlke, Andreas A1 - Langer, Christoph A1 - Ławrowski, Robert Damian A1 - Prommesberger, Christian A1 - Schreiner, Rupert T1 - Control of the electron source current T2 - International Vacuum Nanoelectronics Conference (IVNC), 30th, 2017, Regensburg N2 - A control circuit to stabilize the flux of electrons transmitted through an extractor electrode is presented. By controlling the emission current a fluctuation with a standard deviation of 0.015% is observed. However, the achievable stability of the transmitted electron current is limited due to a variation of the extraction grid current ratio showing a standard deviation of 4.33%. By regulating the difference of the emission current and the extraction grid current an improved stability of the transmitted electron current down to a standard deviation of 0.280% is observed. Even with operation at 2 × 10 -5 mbar a standard deviation of 0.558% is achieved. KW - Standards KW - Circuit stability KW - Power system stability KW - Current measurement KW - Voltage measurement KW - Electron sources KW - Stability analysis Y1 - 2017 U6 - https://doi.org/10.1109/IVNC.2017.8051550 SP - 66 EP - 67 PB - IEEE ER - TY - CHAP A1 - Ławrowski, Robert Damian A1 - Schreiner, Rupert A1 - Linghu, Shuangyi A1 - Gu, Fuxing T1 - Field Emission Behaviour of Single-Crystal Pd Nanowires T2 - 33rd International Vacuum Nanoelectronics Conference (IVNC): 6-10 July 2020, Lyon, France N2 - Single-crystal Pd nanowires with typically 100 nm diameters and lengths from several micrometers to tens of micrometers were grown on Al 2 O 3 substrates in a furnace with Ar atmosphere. Integral field emission measurements of such samples after Pd coating (~10 nm) were performed in a diode configuration with a 50 μm mica spacer in a vacuum chamber at pressures of about 10 -9 mbar. The IV measurement of the sample shows an integral emission current up to 2 μA at a voltage of 500 V (10 MV/m) and an onset voltage for a current of 1 nA of about 275 V. The corresponding Fowler-Nordheim plot show a linear behavior, like expected for a metal needle. Y1 - 2020 SN - 978-1-7281-9454-7 U6 - https://doi.org/10.1109/IVNC49440.2020.9203510 SP - 1 EP - 2 PB - IEEE ER - TY - CHAP A1 - Prommesberger, Christian A1 - Langer, Christoph A1 - Ławrowski, Robert Damian A1 - Schreiner, Rupert T1 - Benzocyclobutene as a novel integrated spacer material in a field emission electron source T2 - International Vacuum Nanoelectronics Conference (IVNC), 30th, 2017, Regensburg N2 - For the realization of a miniaturized field emission electron source we tested benzocyclobutene (BCB) as a new spacer material between cathode and anode. We fabricated black silicon emitters and characterized the emission behavior with an integrated 5 μm thin and large-area spacer of BCB. The integrated BCB layer allows the realization of a compact electron source with only two components consisting of a cathode with BCB and a grid. The comparison with other spacer materials like polyimide (25 μm thickness) or mica (50 μm thickness) revealed for the cathode with BCB a significantly reduced operational voltage of 240 V for a field emission current of 1 μA. KW - field emission KW - benzocyclobutene KW - integrated spacer KW - electron source KW - black silicon Y1 - 2017 U6 - https://doi.org/10.1109/IVNC.2017.8051605 SP - 192 EP - 193 PB - IEEE ER - TY - CHAP A1 - Ławrowski, Robert Damian A1 - Langer, Christoph A1 - Prommesberger, Christian A1 - Schreiner, Rupert T1 - Light emitting diodes based on three-dimensional epitaxial grown crystalline GaN rods T2 - 7. MikroSystemTechnik Kongress "MEMS, Mikroelektronik, Systeme", 23.-25. Oktober 2017, München Y1 - 2017 SN - 978-3-8007-4491-6 SP - 131 EP - 134 PB - VDE-Verlag CY - München ER - TY - CHAP A1 - Lindner, Matthias A1 - Berndt, Dominik A1 - Tschurtschenthal, Karl A1 - Ehrlich, Ingo A1 - Jungbauer, Bastian A1 - Schreiner, Rupert A1 - Pipa, Andrei V. A1 - Hink, Rüdiger A1 - Foest, Rüdiger A1 - Brandenburg, Ronny A1 - Neuwirth, Daniel A1 - Karpen, Norbert A1 - Bonaccurso, Elmar A1 - Weichwald, Robert A1 - Max, Alexander A1 - Caspari, Ralf T1 - Aircraft Icing Mitigation by DBD-based Micro Plasma Actuators T2 - AIAA AVIATION 2020 FORUM: June 15-19, 2020 N2 - We present the application of plasma actuators as a technology for ice prevention at airfoils. The miniaturized dielectric barrier discharge (DBD) plasma actuators (PA) were fabricated by means of microelectromechanical systems (MEMS). We elucidate how to make the actuator samples scalable and applicable to any desired shape by the use of flexible inorganic zirconia substrates. For this purpose, we applied our developed embedding method to integrate the micro actuators in modern carbon/glass fiber reinforced polymer (CFRP/GFRP) materials. Next, the embedded actuator samples were mounted on a mechanical air profile-like fixture and placed in the icing wind tunnel iCORE. The samples were tested in rime ice conditions at temperatures of -15 to -20° C and air speeds up to 30 m/s. Unlike other groups we used a thin film zirconia substrate as dielectric for the plasma actuator. Due to the low substrate thickness of just 150 µm, an operating voltage of 2 kVRMS is already sufficient enough for a stable plasma formation. The experiments show that the operated actuator was able to prevent the ice formation and first indications of a De-icing function were also found. Hence, we show that it is feasible to realize an anti-icing system with zirconia-based plasma actuators operated at lower voltages compared to conventional ones. Y1 - 2020 U6 - https://doi.org/10.2514/6.2020-3243 ER - TY - JOUR A1 - Ławrowski, Robert Damian A1 - Hausladen, Matthias A1 - Buchner, Philipp A1 - Schreiner, Rupert T1 - Silicon Field Emission Electron Source With Individually Controllable Single Emitters JF - IEEE Transactions on Electron Devices N2 - An electron source with an array of individually controllable single tips allows the observation of each emitter current simultaneously as well as the measurement of the integral current. Furthermore, the initial activation process of the individual tips and current distribution of the source can be examined. The Si cathode consists of an array of 2 x 2 conically shaped emitter structures on a borosilicate glass substrate. The emitters were fabricated by laser micromachining and wet etching. Integral field emission (FE) measurements were performed in a diode configuration in a vacuum chamber at pressures of about 10(-9) mbar with a self-aligned Si extraction grid, due to adjustment pins. The total emission current was regulated to a predefined value (4.0, 10, 20, 40, and 50 mu A) by an external regulating circuit and recorded individually during the measurement. The onset voltage for a current of 1 nA varied between 320 and 430 V. The voltage conversion factor is in the range of 7.6 x 10(4) cm(-1) to 1.3 x 10(5) cm(-1). Constant currentmeasurementsover a longer periodof time (1800 values with a sample rate of 0.5 Hz) were performed and show a total current fluctuation less than 0.6% due to the regulation circuit. Despite the stable total current in regulated operation, it was observed that the individual emitters fluctuate up to 75% for low (similar to 10(-8) A) and 5% for high (similar to 10(-5) A) currents. KW - Current distribution KW - current limiters KW - electron emission KW - electron sources KW - silicon-on-insulator Y1 - 2021 U6 - https://doi.org/10.1109/TED.2021.3093374 VL - 68 IS - 8 SP - 4116 EP - 4122 PB - IEEE ER - TY - JOUR A1 - Bachmann, Michael A1 - Düsberg, Felix A1 - Pahlke, Andreas A1 - Edler, Simon A1 - Schels, Andreas A1 - Herdl, Florian A1 - Ławrowski, Robert Damian A1 - Schreiner, Rupert T1 - High current silicon nanowire field emitter arrays JF - Journal of Vacuum Science & Technology B N2 - Arrays of n-doped silicon nanowire field emitters with a high aspect ratio are realized by a novel dry etching technique. Compared to the high current silicon emitters in the literature, the manufacturing process is much simpler and requires only a single photolithography step and two dry etching steps. The cathodes realized with this method exhibit a total current of 20 mA from an active area of 4×4 mm2, which is significantly higher than that for most known structures made from silicon and also represents good performance in comparison with other emitter types, e.g., carbon nanotubes. In addition to characterization in ultrahigh vacuum, measurements at 10−5 mbar are performed and compared with our recent silicon emitters. Compared to these cathodes, the structures with the nanowires exhibit at least two orders of magnitude higher current-carrying capability. Y1 - 2022 U6 - https://doi.org/10.1116/6.0001639 VL - 40 IS - 1 PB - AIP Publishing ER - TY - JOUR A1 - Remskar, Maja A1 - Hüttel, Andreas K. A1 - Shubina, Tatiana V. A1 - Seabaugh, Alan A1 - Fathipour, Sara A1 - Ławrowski, Robert Damian A1 - Schreiner, Rupert T1 - Confinement Related Phenomena in MoS2 Tubular Structures Grown from Vapour Phase JF - Israel Journal of Chemistry N2 - We review recently discovered phenomena observed in the MoS2 tubular structures, which were synthesized by a lasting chemical transport reaction nearly at chemical equilibrium. Such MoS2 nanotubes are distinguished by low density of structural defects, thin walls and a high aspect ratio, which intrinsically provide a confined, edge-free geometry. Quantum confinement with single electron conductance was recorded and a bright exciton photoluminescence with appearance of whispering gallery modes was observed. In addition, the field-effect transistors and field emitters based on single MoS2 nanotubes were demonstrated. These discoveries revitalize research of MoS2 curved structures grown from vapour phase, which were reported several decades ago. Y1 - 2021 U6 - https://doi.org/10.1002/ijch.202100100 SN - 1869-5868 VL - 62 IS - 3-4 SP - 1 EP - 11 PB - Wiley ER - TY - CHAP A1 - Ławrowski, Robert Damian A1 - Bachmann, Michael A1 - Schreiner, Rupert T1 - Field Emission Arrays from Graphite Fabricated by Laser Micromachining T2 - 34th International Vacuum Nanoelectronics Conference (IVNC): 7/5/2021 - 7/9/2021, Lyon, France N2 - Arrays of 4x4 conical shaped emitters were directly structured by laser micromaching. Assembled as an electron source with a spacer and Si-grid, they were investigated by means of IV-measurement in ultra-high vacuum. The IV-measurements of the sample show integral emission currents up to 10 µA at a voltage of 1000 V (11 MV/m). Initially, an ideal FN-behaviour is noticeable. The deviation for higher voltage values in the FN-plot is caused by the change of the work function, which was proven by numerical calculations. KW - field emission array KW - graphite KW - laser micromachining Y1 - 2021 SN - 978-1-6654-2589-6 U6 - https://doi.org/10.1109/IVNC52431.2021.9600736 SP - 1 EP - 2 PB - IEEE ER - TY - CHAP A1 - Lindner, Matthias A1 - Berndt, Dominik A1 - Jungbauer, Bastian A1 - Ehrlich, Ingo A1 - Schreiner, Rupert A1 - Pipa, Andrei V. A1 - Hink, Rüdiger A1 - Foest, Rüdiger A1 - Brandenburg, Ronny A1 - Max, Alexander A1 - Caspari, Ralf T1 - Fabrication, surface integration and testing of miniaturized dielectric barrier discharge plasma actuators for active flow control applications T2 - AIAA Aviation 2019 Forum, 17-21 June 2019, Dallas, Texas Y1 - 2019 U6 - https://doi.org/10.2514/6.2019-2998 ER - TY - CHAP A1 - Langer, Christoph A1 - Ławrowski, Robert Damian A1 - Prommesberger, Christian A1 - Dams, Florian A1 - Serbun, Pavel A1 - Bachmann, Michael A1 - Müller, Günter A1 - Schreiner, Rupert T1 - High aspect ratio silicon tip cathodes for application in field emission electron sources T2 - 2014 27th International Vacuum Nanoelectronics Conference (IVNC), 6-10 July 2014, Engelberg, Switzerland N2 - Precisely aligned arrays of sharp tip structures on top of elongated pillars were realized by using an improved fabrication process including an additional inductively-coupled-plasma reactive-ion etching step. Arrays of n-type and p-type silicon with 271 tips have been fabricated and investigated. Those structures have a total height of 5–6 µm and apex radii less than 20nm. Integral field emission measurements of the arrays yielded low onset-fields in the range of 8–12V=µm and field enhancement factors between 300 and 700. The I-E curves of n-type structures showed the usual Fowler-Nordheim behaviour, whereas p-type structures revealed a significant saturation region due to the limited number of electrons in the conduction band and a further carrier depletion effect caused by the pillar. The maximum integral current in the saturation region was 150 nA at fields above 30V=µm. An excellent stability of the emission current of less than ± 2% fluctuation was observed in the saturation region. For n-type Si a maximum integral current of 10 µA at 24V=µm and an average current stability with a fluctuation of ± 50% were measured. KW - Current measurement KW - Etching KW - FABRICATION KW - field emission KW - field emitter array KW - GEOMETRY KW - Iron KW - Sensor arrays KW - silicon KW - silicon tip Y1 - 2014 U6 - https://doi.org/10.1109/IVNC.2014.6894824 SP - 222 EP - 223 PB - IEEE ER - TY - JOUR A1 - Bachmann, Michael A1 - Düsberg, Felix A1 - Langer, Christoph A1 - Herdl, Florian A1 - Bergbreiter, Lukas A1 - Dams, Florian A1 - Miyakawa, Natuski A1 - Eggert, Tobias A1 - Pahlke, Andreas A1 - Edler, Simon A1 - Prommesberger, Christian A1 - Ławrowski, Robert Damian A1 - Hausladen, Matthias A1 - Schreiner, Rupert T1 - Vacuum-sealed field emission electron gun JF - Journal of Vacuum Science & Technology B N2 - A compact vacuum-sealed field emission electron gun with an operation voltage below 5 kV is presented. With a 150 nm thick pyrolytic carbon membrane, a transmission of 40% at 5 kV is obtained. For more than 2500 h of continuous operation at an emission current of 100 nA, no significant increase (<50V ) and almost no degradation were found. From this measurement, a lifetime of more than 10 000 h at continuous operation with approximately a linear increase of the extraction voltage from about 545 V to about 730 V is predicted. This electron source enables application of field emitter arrays in poor vacuum or even ambient pressure. ACKNOWLEDGMENT This work was supported by the German Federal Ministry for Economic Affairs and Energy under Project No. ZF4081502GM8. C.P., R.L., M.H., and R.S. were supported by Grant No. ZF4562901GM8. Y1 - 2020 U6 - https://doi.org/10.1116/1.5139316 VL - 38 IS - 2 PB - AIP Publishing ER - TY - JOUR A1 - Langer, Christoph A1 - Prommesberger, Christian A1 - Ławrowski, Robert Damian A1 - Dams, Florian A1 - Schreiner, Rupert T1 - Simulation and Fabrication of Silicon Field Emission Cathodes for Cold Electron Sources JF - Advanced Materials Research N2 - We report on the simulation and fabrication of nanostructured silicon surfaces for field emission (FE) applications, e.g. ionization sensors and x-ray tubes. For the design and optimization of field-emitting silicon structures, the influence of the geometric parameters like tip height, apex radius, aperture angle and curvature shape on the field enhancement factor was investigated by simulation using finite element method. A universal geometric model which describes the real geometry of our silicon structures sufficiently accurate was taken for modeling a variety of different silicon tip structures as well as ridge structures. While a high dependency of the field enhancement on the aspect ratio and the aperture angle was found, the simulations show that the elliptic curvature affects the field enhancement only marginally. Finally, an improved process for fabrication of such silicon structures on n-type as well as p-type substrate is described, using reactive ion etching with adjustable anisotropy, wet thermal oxidation and wet etching. KW - field emission cathodes KW - field enhancement factor KW - silicon field emitter Y1 - 2014 U6 - https://doi.org/10.4028/www.scientific.net/amr.1024.48 VL - 1024 SP - 48 EP - 51 ER - TY - JOUR A1 - Ławrowski, Robert Damian A1 - Bachmann, Michael A1 - Schreiner, Rupert T1 - Field emission arrays from graphite fabricated by laser micromachining JF - Journal of Vacuum Science & Technology B N2 - Laser micro structuring allows the manufacturing of conical shaped emitters on a graphitized carbon substrate without any additional treatment. Integral field emission measurements were performed in a diode configuration with a 50 µm mica spacer and a metalized Si-grid in a vacuum chamber at pressures of about 10-9 mbar. Emission currents up to 10 µA at a voltage of 1000 V (11 MV/m) with a positive current drift were observed for an array of 16 emitters. A strong modification of the emitter tip is noticeable after individual measurements. A comparable alteration of the surface is also achieved by an electrochemical treatment of the samples with a potassium hydroxide solution. However, the IV-measurements of such samples show higher onset voltages, but also higher integral emission currents. For all arrays an ideal FN behaviour is only noticeable at applied voltages below 625 V (7 MV/m). Numerical calculations indicate that the deviation in the FN-plot for higher voltage values is caused by the change of the effective work function. Y1 - 2022 U6 - https://doi.org/10.1116/6.0001547 VL - 40 IS - 2 PB - AIP Publishing ER - TY - JOUR A1 - Ławrowski, Robert Damian A1 - Prommesberger, Christian A1 - Langer, Christoph A1 - Dams, Florian A1 - Schreiner, Rupert T1 - Improvement of Homogenity and Aspect Ratio of Silicon Tips for Field Emission by Reactive-Ion Etching JF - Advances in materials science and engineering N2 - The homogeneity of emitters is very important for the performance of field emission (FE) devices. Reactive-ion etching (RIE) and oxidation have significant influences on the geometry of silicon tips. The RIE influences mainly the anisotropy of the emitters. Pressure has a strong impact on the anisotropic factor. Reducing the pressure results in a higher anisotropy, but the etch rate is also lower. A longer time of etching compensates this effect. Furthermore an improvement of homogeneity was observed. The impact of uprating is quite low for the anisotropic factor, but significant for the homogeneity. At low power the height and undercut of the emitters are more constant over the whole wafer. The oxidation itself is very homogeneous and has no observable effect on further variation of the homogeneity. This modified fabrication process allows solving the problem of inhomogeneity of previous field emission arrays. Y1 - 2014 U6 - https://doi.org/10.1155/2014/948708 VL - 2014 PB - Hindawi ER - TY - GEN A1 - Bieker, Johannes A1 - Schlaak, Helmut F. A1 - Wilfert, Stefan A1 - Ławrowski, Robert Damian A1 - Hausladen, Matthias A1 - Schreiner, Rupert T1 - Development of FE-based electron sources for XHVion gauges in cryogenic vacuum environments T2 - 32nd International Vacuum Nanoelectronics Conference (IVNC 2019), 22.-26.07.2019, Cincinnati, USA Y1 - 2019 ER - TY - GEN A1 - Ławrowski, Robert Damian A1 - Hausladen, Matthias A1 - Schreiner, Rupert T1 - Individually Addressable Silicon Field Emission Cathodes Fabricated by Laser Micromachining T2 - 7th ITG International Vacuum Electronics Workshop (IVEW) 2020 and 13th International Vacuum Electron Sources Conference (IVeSC) 2020, 26. - 29.5.2020, Bad Honnef Y1 - 2020 ER - TY - GEN A1 - Hausladen, Matthias A1 - Ławrowski, Robert Damian A1 - Schreiner, Rupert T1 - Fast Pulse Source for Field Emission Applications T2 - 7th ITG International Vacuum Electronics Workshop (IVEW) 2020 and 13th International Vacuum Electron Sources Conference (IVeSC) 2020, 26. - 29.5.2020, Bad Honnef Y1 - 2020 ER - TY - CHAP A1 - Prommesberger, Christian A1 - Langer, Christoph A1 - Ławrowski, Robert Damian A1 - Muller, F. A1 - Dams, Florian A1 - Schreiner, Rupert A1 - Serbun, Pavel A1 - Müller, Günter T1 - Comparison of integral and local field-emission properties of Mo-coated p-Si tip arrays T2 - 2015 28th International Vacuum Nanoelectronics Conference (IVNC), 13-17 July 2015, Guangzhou, China N2 - Silicon tip arrays were fabricated by means of reactive ion etching followed by oxidation for final sharpening and molybdenum thin film coating. The field-emission (FE) properties of these Mo-coated p-Si tip arrays were systemically investigated by different measurement techniques. Integral measurements in diode configuration yielded a turn-on field (for 1 nA) of 22 V/μm and nearly stable FE currents up to 6.6 μA at 38 V/μm. The effective field enhancements factor extracted from the FN plots is about 180. Detailed investigations of these FE arrays were also performed by means of field emission scanning microscopy combined with electron microscopy. A rather limited efficiency of the tips (50% at 1500 V) and FE homogeneity (180 nA at 700 V) might be correlated with the varying morphology of the tips and the presence of oxides. Local I-V measurements of selected single tips revealed both activation and deactivation effects, which finally resulted in nearly reproducible I-V curves. Current stability measurements at a constant voltage showed rather large fluctuations (0.1-1 μA) of the FE current, which could be reduced up to 1.7% by using of a PID-regulated voltage source. SEM images showed unchanged tip shape after the current processing. KW - CATHODES KW - Coatings KW - Current measurement KW - field emission KW - Iron KW - Mo-coated KW - p-Si tip KW - Scanning electron microscopy KW - silicon KW - tip arrays KW - Vacuum technology Y1 - 2015 U6 - https://doi.org/10.1109/IVNC.2015.7225579 SP - 192 EP - 193 PB - IEEE ER - TY - CHAP A1 - Ławrowski, Robert Damian A1 - Langer, Christoph A1 - Prommesberger, Christian A1 - Dams, Florian A1 - Bachmann, Michael A1 - Schreiner, Rupert T1 - Fabrication and simulation of silicon structures with high aspect ratio for field emission devices T2 - 2014 27th International Vacuum Nanoelectronics Conference (IVNC), 6-10 July 2014, Engelberg, Switzerland N2 - To obtain higher field enhancement factors of Si-tip structures, we present an improved fabrication process utilizing reactive-ion etching (RIE) with an inductively coupled plasma (ICP). In our design, a pillar under the tips is realized by a combination of RIE with ICP. With adjusted power settings (≈ 240 W) and step times (<; 5 s), vertical slopes with a low roughness of approximately 10 nm to 20 nm are possible. The remaining silicon is oxidized thermally to sharpen the emitters. A final tip radius of R <; 20 nm is obtained for the tips of the emitters. The pillar height HP can be mainly adjusted by the duration of the ICP-etching step. A total emitter height of H ≈ 6 μm with a pillar height of HP ≈ 5 μm is achieved. Simulations with COMSOL Multiphysics® are applied to calculate the field enhancement factor β. A two-dimensional model is used in rotational symmetry. In addition to the previous model, a pillar with a varying diameter ØP and height HP is added. A conventional emitter (H = 1 μm and R = 20 nm) placed on a pillar of the height HP ≈ 5 μm approximately results in a three times higher β-factor (β≈ 105). By decreasing the diameter ØP a slight increase of the β-factor is observed. However, the aspect ratio of the emitter mainly influences on the β-factor. KW - Anodes KW - CATHODES KW - FABRICATION KW - field emission KW - field emitter array KW - field enhancement factor KW - Iterative closest point algorithm KW - Lead KW - silicon tips Y1 - 2014 U6 - https://doi.org/10.1109/IVNC.2014.6894805 SP - 193 EP - 194 PB - IEEE ER - TY - CHAP A1 - Prommesberger, Christian A1 - Langer, Christoph A1 - Ławrowski, Robert Damian A1 - Dams, Florian A1 - Schreiner, Rupert A1 - Ławrowski, Robert Damian T1 - Gated p-Si field emitter arrays for sensor applications T2 - 2015 28th International Vacuum Nanoelectronics Conference (IVNC) N2 - We report on gated p-type Si-tip array cathodes for implementation into field emission electron sources for sensor applications. Arrays of 16 and 100 tips with tip heights of 3 μm and tip radii below 30 nm with integrated gate electrodes concentrically positioned 2 μm below the tip apexes were fabricated using an improved process, which leads to an enhanced isolation layer quality with sufficient breakdown field strengths and low leakage currents. Integral measurements with a fixed grid potential of 400 V showed emission currents up to 35 μA for 100 tips at a cathode voltage of 150 V and an almost negligible parasitic gate current. The array with 16 p-type Si-tips showed a significant stabilization of the emission current in the range of 0.3 - 0.4 μA, for cathode voltages between 90 V and 150 V. The current fluctuation in this saturation regime was measured for 10 minutes and a value of less than ± 1% was observed. No degradation of the cathode was found after 6 hours of operation at a constant cathode voltage of 100 V and a constant grid voltage of 400 V. KW - CATHODES KW - Current measurement KW - Current stabilization KW - field emission KW - integrated gate-electrode KW - Iron KW - Logic gates KW - semiconductor KW - Semiconductor device measurement KW - silicon KW - silicon tip array Y1 - 2015 U6 - https://doi.org/10.1109/IVNC.2015.7225567 SP - 164 EP - 165 PB - IEEE ER - TY - CHAP A1 - Langer, Christoph A1 - Prommesberger, Christian A1 - Ławrowski, Robert Damian A1 - Müller, F. A1 - Schreiner, Rupert A1 - Serbun, Pavel A1 - Müller, Günter T1 - Enhanced field emission from p-doped black silicon on pillar structures T2 - 2015 28th International Vacuum Nanoelectronics Conference (IVNC), 13-17 July 2015, Guangzhou, China N2 - Aligned square arrays of black silicon (b-Si) on top of pillars were fabricated on p-type silicon substrate by a deep-etching step combined with a b-Si process. Two 10×10 arrays with pillar heights of 8 μm and 20 μm and one b-Si reference sample without pillars were investigated. Integral field emission (FE) measurements of the arrays yielded rather low onset-fields between 6.4 V/μm and 13.5 V/μm and field enhancement factors between 430 and 800. The I-V curves showed typical Fowler-Nordheim behavior for low fields, whereas a saturation region was observed at higher fields. The maximum integral current in the saturation region was 8 μA at a field of 20 V/μm. The stability of the emission current was investigated over 3 hours and revealed moderate fluctuations of ± 8% in the saturation region. Voltage scans showed well-aligned FE from nearly all pillars. KW - black silicon KW - CATHODES KW - Current measurement KW - Etching KW - FABRICATION KW - field emission KW - field emitter array KW - Iron KW - silicon KW - Vacuum technology Y1 - 2015 U6 - https://doi.org/10.1109/IVNC.2015.7225547 SP - 104 EP - 105 PB - IEEE ER - TY - CHAP A1 - Prommesberger, Christian A1 - Ławrowski, Robert Damian A1 - Langer, Christoph A1 - Dams, Florian A1 - Schreiner, Rupert T1 - Realisierung von Siliziumspitzenarrays mit integrierter Gate-Elektrode für Anwendungen in der Vakuumsensorik T2 - 4. Landshuter Symposium Mikrosystemtechnik, Mikrosystemtechnik als Schlüsseltechnologie der Systemintegration, Tagungsband zum Symposium 12./13. März 2014, Hochschule Landshut N2 - Bei der Feldemission (kalte Emission) können Elektronen durch ein starkes elektrisches Feld eine glatte und leitende Oberfläche verlassen. Die Elektronen tunneln dabei durch eine Potentialbarriere, deren Breite durch ein äußeres elektrisches Feld verkleinert wird. Durch das Hinzufügen einer integrierten Gate-Elektrode um eine Siliziumspitze kann die notwendige Einsatzspannung für Feldemission deutlich gesenkt werden. Zwischen Si-Kathode und Gate-Elektrode befindet sich dabei eine Isolationsschicht, die höchste Anforderungen bezüglich der elektrischen Durchbruchsfestigkeit erfüllen muss. Mit einer Kombination aus Trocken- (Schichtdicke 50 nm) und Feuchtoxid (Schichtdicke 950 nm) konnte eine Isolationsschicht entwickelt werden, die im integrierten Aufbau eine minimale Durchbruchsfeldstärke von 3,2 MV/cm aufweist. Für die Realisierung von Siliziumkathoden mit integrierter Gate-Elektrode wurde ein bereits bestehender Herstellungsprozess um zusätzliche Prozessschritte erweitert. Die Übertragung der lateralen Position der Spitze erfolgt durch Strukturierung des Umkehrlacks AZ5214 und einer RIE-Ätzung der zuvor hergestellten SiO2-Schicht. Nach dem Entfernen der Lackschicht wird die vertikale Struktur der Siliziumspitzen durch einen RIE-Ätzprozess mit den Prozessgasen SF6 und O)2 realisiert. Aus einer thermischen Oxidation bei 940 °C resultiert anschließend die Isolationsschicht zwischen Si-Kathode und Gate-Elektrode . Gleichzeitig wird diese Anschärfeoxidation auch zur Realisierung der endgültigen Spitzengeometrie verwendet. Durch die lithographische Strukturierung des Photolacks AZ5214 kann dabei die Fläche der aufgedampften Gate-Elektrode festgelegt werden. Die Gate-Elektrode wird in einem selbstjustierenden Prozessschritt exakt konzentrisch um die Si-Spitze aufgedampft. Der gerichtete Aufdampfprozess bewirkt eine Abschattung, so dass das Oxidplättchen nicht komplett von Metall ummantelt wird. Die Opferschicht aus Photolack wird mit den nicht benötigten Metallflächen in einem Lift-off-Prozess entfernt. KW - elektrischer Durchbruch KW - Feldelektronenemission KW - Halbleiterschicht KW - Isolierschicht KW - Kathode KW - Silicium KW - Vakuumsensor Y1 - 2014 SN - 978-3-9812696-5-9 SP - 36 EP - 41 CY - Landshut ER -