TY - JOUR A1 - Remskar, Maja A1 - Hüttel, Andreas K. A1 - Shubina, Tatiana V. A1 - Seabaugh, Alan A1 - Fathipour, Sara A1 - Ławrowski, Robert Damian A1 - Schreiner, Rupert T1 - Confinement Related Phenomena in MoS2 Tubular Structures Grown from Vapour Phase JF - Israel Journal of Chemistry N2 - We review recently discovered phenomena observed in the MoS2 tubular structures, which were synthesized by a lasting chemical transport reaction nearly at chemical equilibrium. Such MoS2 nanotubes are distinguished by low density of structural defects, thin walls and a high aspect ratio, which intrinsically provide a confined, edge-free geometry. Quantum confinement with single electron conductance was recorded and a bright exciton photoluminescence with appearance of whispering gallery modes was observed. In addition, the field-effect transistors and field emitters based on single MoS2 nanotubes were demonstrated. These discoveries revitalize research of MoS2 curved structures grown from vapour phase, which were reported several decades ago. Y1 - 2021 U6 - https://doi.org/10.1002/ijch.202100100 SN - 1869-5868 VL - 62 IS - 3-4 SP - 1 EP - 11 PB - Wiley ER - TY - CHAP A1 - Ławrowski, Robert Damian A1 - Bachmann, Michael A1 - Schreiner, Rupert T1 - Field Emission Arrays from Graphite Fabricated by Laser Micromachining T2 - 34th International Vacuum Nanoelectronics Conference (IVNC): 7/5/2021 - 7/9/2021, Lyon, France N2 - Arrays of 4x4 conical shaped emitters were directly structured by laser micromaching. Assembled as an electron source with a spacer and Si-grid, they were investigated by means of IV-measurement in ultra-high vacuum. The IV-measurements of the sample show integral emission currents up to 10 µA at a voltage of 1000 V (11 MV/m). Initially, an ideal FN-behaviour is noticeable. The deviation for higher voltage values in the FN-plot is caused by the change of the work function, which was proven by numerical calculations. KW - field emission array KW - graphite KW - laser micromachining Y1 - 2021 SN - 978-1-6654-2589-6 U6 - https://doi.org/10.1109/IVNC52431.2021.9600736 SP - 1 EP - 2 PB - IEEE ER - TY - CHAP A1 - Lindner, Matthias A1 - Berndt, Dominik A1 - Jungbauer, Bastian A1 - Ehrlich, Ingo A1 - Schreiner, Rupert A1 - Pipa, Andrei V. A1 - Hink, Rüdiger A1 - Foest, Rüdiger A1 - Brandenburg, Ronny A1 - Max, Alexander A1 - Caspari, Ralf T1 - Fabrication, surface integration and testing of miniaturized dielectric barrier discharge plasma actuators for active flow control applications T2 - AIAA Aviation 2019 Forum, 17-21 June 2019, Dallas, Texas Y1 - 2019 U6 - https://doi.org/10.2514/6.2019-2998 ER - TY - CHAP A1 - Langer, Christoph A1 - Ławrowski, Robert Damian A1 - Prommesberger, Christian A1 - Dams, Florian A1 - Serbun, Pavel A1 - Bachmann, Michael A1 - Müller, Günter A1 - Schreiner, Rupert T1 - High aspect ratio silicon tip cathodes for application in field emission electron sources T2 - 2014 27th International Vacuum Nanoelectronics Conference (IVNC), 6-10 July 2014, Engelberg, Switzerland N2 - Precisely aligned arrays of sharp tip structures on top of elongated pillars were realized by using an improved fabrication process including an additional inductively-coupled-plasma reactive-ion etching step. Arrays of n-type and p-type silicon with 271 tips have been fabricated and investigated. Those structures have a total height of 5–6 µm and apex radii less than 20nm. Integral field emission measurements of the arrays yielded low onset-fields in the range of 8–12V=µm and field enhancement factors between 300 and 700. The I-E curves of n-type structures showed the usual Fowler-Nordheim behaviour, whereas p-type structures revealed a significant saturation region due to the limited number of electrons in the conduction band and a further carrier depletion effect caused by the pillar. The maximum integral current in the saturation region was 150 nA at fields above 30V=µm. An excellent stability of the emission current of less than ± 2% fluctuation was observed in the saturation region. For n-type Si a maximum integral current of 10 µA at 24V=µm and an average current stability with a fluctuation of ± 50% were measured. KW - Current measurement KW - Etching KW - FABRICATION KW - field emission KW - field emitter array KW - GEOMETRY KW - Iron KW - Sensor arrays KW - silicon KW - silicon tip Y1 - 2014 U6 - https://doi.org/10.1109/IVNC.2014.6894824 SP - 222 EP - 223 PB - IEEE ER - TY - JOUR A1 - Bachmann, Michael A1 - Düsberg, Felix A1 - Langer, Christoph A1 - Herdl, Florian A1 - Bergbreiter, Lukas A1 - Dams, Florian A1 - Miyakawa, Natuski A1 - Eggert, Tobias A1 - Pahlke, Andreas A1 - Edler, Simon A1 - Prommesberger, Christian A1 - Ławrowski, Robert Damian A1 - Hausladen, Matthias A1 - Schreiner, Rupert T1 - Vacuum-sealed field emission electron gun JF - Journal of Vacuum Science & Technology B N2 - A compact vacuum-sealed field emission electron gun with an operation voltage below 5 kV is presented. With a 150 nm thick pyrolytic carbon membrane, a transmission of 40% at 5 kV is obtained. For more than 2500 h of continuous operation at an emission current of 100 nA, no significant increase (<50V ) and almost no degradation were found. From this measurement, a lifetime of more than 10 000 h at continuous operation with approximately a linear increase of the extraction voltage from about 545 V to about 730 V is predicted. This electron source enables application of field emitter arrays in poor vacuum or even ambient pressure. ACKNOWLEDGMENT This work was supported by the German Federal Ministry for Economic Affairs and Energy under Project No. ZF4081502GM8. C.P., R.L., M.H., and R.S. were supported by Grant No. ZF4562901GM8. Y1 - 2020 U6 - https://doi.org/10.1116/1.5139316 VL - 38 IS - 2 PB - AIP Publishing ER - TY - JOUR A1 - Langer, Christoph A1 - Prommesberger, Christian A1 - Ławrowski, Robert Damian A1 - Dams, Florian A1 - Schreiner, Rupert T1 - Simulation and Fabrication of Silicon Field Emission Cathodes for Cold Electron Sources JF - Advanced Materials Research N2 - We report on the simulation and fabrication of nanostructured silicon surfaces for field emission (FE) applications, e.g. ionization sensors and x-ray tubes. For the design and optimization of field-emitting silicon structures, the influence of the geometric parameters like tip height, apex radius, aperture angle and curvature shape on the field enhancement factor was investigated by simulation using finite element method. A universal geometric model which describes the real geometry of our silicon structures sufficiently accurate was taken for modeling a variety of different silicon tip structures as well as ridge structures. While a high dependency of the field enhancement on the aspect ratio and the aperture angle was found, the simulations show that the elliptic curvature affects the field enhancement only marginally. Finally, an improved process for fabrication of such silicon structures on n-type as well as p-type substrate is described, using reactive ion etching with adjustable anisotropy, wet thermal oxidation and wet etching. KW - field emission cathodes KW - field enhancement factor KW - silicon field emitter Y1 - 2014 U6 - https://doi.org/10.4028/www.scientific.net/amr.1024.48 VL - 1024 SP - 48 EP - 51 ER - TY - JOUR A1 - Ławrowski, Robert Damian A1 - Bachmann, Michael A1 - Schreiner, Rupert T1 - Field emission arrays from graphite fabricated by laser micromachining JF - Journal of Vacuum Science & Technology B N2 - Laser micro structuring allows the manufacturing of conical shaped emitters on a graphitized carbon substrate without any additional treatment. Integral field emission measurements were performed in a diode configuration with a 50 µm mica spacer and a metalized Si-grid in a vacuum chamber at pressures of about 10-9 mbar. Emission currents up to 10 µA at a voltage of 1000 V (11 MV/m) with a positive current drift were observed for an array of 16 emitters. A strong modification of the emitter tip is noticeable after individual measurements. A comparable alteration of the surface is also achieved by an electrochemical treatment of the samples with a potassium hydroxide solution. However, the IV-measurements of such samples show higher onset voltages, but also higher integral emission currents. For all arrays an ideal FN behaviour is only noticeable at applied voltages below 625 V (7 MV/m). Numerical calculations indicate that the deviation in the FN-plot for higher voltage values is caused by the change of the effective work function. Y1 - 2022 U6 - https://doi.org/10.1116/6.0001547 VL - 40 IS - 2 PB - AIP Publishing ER - TY - JOUR A1 - Ławrowski, Robert Damian A1 - Prommesberger, Christian A1 - Langer, Christoph A1 - Dams, Florian A1 - Schreiner, Rupert T1 - Improvement of Homogenity and Aspect Ratio of Silicon Tips for Field Emission by Reactive-Ion Etching JF - Advances in materials science and engineering N2 - The homogeneity of emitters is very important for the performance of field emission (FE) devices. Reactive-ion etching (RIE) and oxidation have significant influences on the geometry of silicon tips. The RIE influences mainly the anisotropy of the emitters. Pressure has a strong impact on the anisotropic factor. Reducing the pressure results in a higher anisotropy, but the etch rate is also lower. A longer time of etching compensates this effect. Furthermore an improvement of homogeneity was observed. The impact of uprating is quite low for the anisotropic factor, but significant for the homogeneity. At low power the height and undercut of the emitters are more constant over the whole wafer. The oxidation itself is very homogeneous and has no observable effect on further variation of the homogeneity. This modified fabrication process allows solving the problem of inhomogeneity of previous field emission arrays. Y1 - 2014 U6 - https://doi.org/10.1155/2014/948708 VL - 2014 PB - Hindawi ER - TY - GEN A1 - Bieker, Johannes A1 - Schlaak, Helmut F. A1 - Wilfert, Stefan A1 - Ławrowski, Robert Damian A1 - Hausladen, Matthias A1 - Schreiner, Rupert T1 - Development of FE-based electron sources for XHVion gauges in cryogenic vacuum environments T2 - 32nd International Vacuum Nanoelectronics Conference (IVNC 2019), 22.-26.07.2019, Cincinnati, USA Y1 - 2019 ER - TY - GEN A1 - Ławrowski, Robert Damian A1 - Hausladen, Matthias A1 - Schreiner, Rupert T1 - Individually Addressable Silicon Field Emission Cathodes Fabricated by Laser Micromachining T2 - 7th ITG International Vacuum Electronics Workshop (IVEW) 2020 and 13th International Vacuum Electron Sources Conference (IVeSC) 2020, 26. - 29.5.2020, Bad Honnef Y1 - 2020 ER - TY - GEN A1 - Hausladen, Matthias A1 - Ławrowski, Robert Damian A1 - Schreiner, Rupert T1 - Fast Pulse Source for Field Emission Applications T2 - 7th ITG International Vacuum Electronics Workshop (IVEW) 2020 and 13th International Vacuum Electron Sources Conference (IVeSC) 2020, 26. - 29.5.2020, Bad Honnef Y1 - 2020 ER - TY - CHAP A1 - Prommesberger, Christian A1 - Langer, Christoph A1 - Ławrowski, Robert Damian A1 - Muller, F. A1 - Dams, Florian A1 - Schreiner, Rupert A1 - Serbun, Pavel A1 - Müller, Günter T1 - Comparison of integral and local field-emission properties of Mo-coated p-Si tip arrays T2 - 2015 28th International Vacuum Nanoelectronics Conference (IVNC), 13-17 July 2015, Guangzhou, China N2 - Silicon tip arrays were fabricated by means of reactive ion etching followed by oxidation for final sharpening and molybdenum thin film coating. The field-emission (FE) properties of these Mo-coated p-Si tip arrays were systemically investigated by different measurement techniques. Integral measurements in diode configuration yielded a turn-on field (for 1 nA) of 22 V/μm and nearly stable FE currents up to 6.6 μA at 38 V/μm. The effective field enhancements factor extracted from the FN plots is about 180. Detailed investigations of these FE arrays were also performed by means of field emission scanning microscopy combined with electron microscopy. A rather limited efficiency of the tips (50% at 1500 V) and FE homogeneity (180 nA at 700 V) might be correlated with the varying morphology of the tips and the presence of oxides. Local I-V measurements of selected single tips revealed both activation and deactivation effects, which finally resulted in nearly reproducible I-V curves. Current stability measurements at a constant voltage showed rather large fluctuations (0.1-1 μA) of the FE current, which could be reduced up to 1.7% by using of a PID-regulated voltage source. SEM images showed unchanged tip shape after the current processing. KW - CATHODES KW - Coatings KW - Current measurement KW - field emission KW - Iron KW - Mo-coated KW - p-Si tip KW - Scanning electron microscopy KW - silicon KW - tip arrays KW - Vacuum technology Y1 - 2015 U6 - https://doi.org/10.1109/IVNC.2015.7225579 SP - 192 EP - 193 PB - IEEE ER - TY - CHAP A1 - Ławrowski, Robert Damian A1 - Langer, Christoph A1 - Prommesberger, Christian A1 - Dams, Florian A1 - Bachmann, Michael A1 - Schreiner, Rupert T1 - Fabrication and simulation of silicon structures with high aspect ratio for field emission devices T2 - 2014 27th International Vacuum Nanoelectronics Conference (IVNC), 6-10 July 2014, Engelberg, Switzerland N2 - To obtain higher field enhancement factors of Si-tip structures, we present an improved fabrication process utilizing reactive-ion etching (RIE) with an inductively coupled plasma (ICP). In our design, a pillar under the tips is realized by a combination of RIE with ICP. With adjusted power settings (≈ 240 W) and step times (<; 5 s), vertical slopes with a low roughness of approximately 10 nm to 20 nm are possible. The remaining silicon is oxidized thermally to sharpen the emitters. A final tip radius of R <; 20 nm is obtained for the tips of the emitters. The pillar height HP can be mainly adjusted by the duration of the ICP-etching step. A total emitter height of H ≈ 6 μm with a pillar height of HP ≈ 5 μm is achieved. Simulations with COMSOL Multiphysics® are applied to calculate the field enhancement factor β. A two-dimensional model is used in rotational symmetry. In addition to the previous model, a pillar with a varying diameter ØP and height HP is added. A conventional emitter (H = 1 μm and R = 20 nm) placed on a pillar of the height HP ≈ 5 μm approximately results in a three times higher β-factor (β≈ 105). By decreasing the diameter ØP a slight increase of the β-factor is observed. However, the aspect ratio of the emitter mainly influences on the β-factor. KW - Anodes KW - CATHODES KW - FABRICATION KW - field emission KW - field emitter array KW - field enhancement factor KW - Iterative closest point algorithm KW - Lead KW - silicon tips Y1 - 2014 U6 - https://doi.org/10.1109/IVNC.2014.6894805 SP - 193 EP - 194 PB - IEEE ER - TY - CHAP A1 - Prommesberger, Christian A1 - Langer, Christoph A1 - Ławrowski, Robert Damian A1 - Dams, Florian A1 - Schreiner, Rupert A1 - Ławrowski, Robert Damian T1 - Gated p-Si field emitter arrays for sensor applications T2 - 2015 28th International Vacuum Nanoelectronics Conference (IVNC) N2 - We report on gated p-type Si-tip array cathodes for implementation into field emission electron sources for sensor applications. Arrays of 16 and 100 tips with tip heights of 3 μm and tip radii below 30 nm with integrated gate electrodes concentrically positioned 2 μm below the tip apexes were fabricated using an improved process, which leads to an enhanced isolation layer quality with sufficient breakdown field strengths and low leakage currents. Integral measurements with a fixed grid potential of 400 V showed emission currents up to 35 μA for 100 tips at a cathode voltage of 150 V and an almost negligible parasitic gate current. The array with 16 p-type Si-tips showed a significant stabilization of the emission current in the range of 0.3 - 0.4 μA, for cathode voltages between 90 V and 150 V. The current fluctuation in this saturation regime was measured for 10 minutes and a value of less than ± 1% was observed. No degradation of the cathode was found after 6 hours of operation at a constant cathode voltage of 100 V and a constant grid voltage of 400 V. KW - CATHODES KW - Current measurement KW - Current stabilization KW - field emission KW - integrated gate-electrode KW - Iron KW - Logic gates KW - semiconductor KW - Semiconductor device measurement KW - silicon KW - silicon tip array Y1 - 2015 U6 - https://doi.org/10.1109/IVNC.2015.7225567 SP - 164 EP - 165 PB - IEEE ER - TY - CHAP A1 - Langer, Christoph A1 - Prommesberger, Christian A1 - Ławrowski, Robert Damian A1 - Müller, F. A1 - Schreiner, Rupert A1 - Serbun, Pavel A1 - Müller, Günter T1 - Enhanced field emission from p-doped black silicon on pillar structures T2 - 2015 28th International Vacuum Nanoelectronics Conference (IVNC), 13-17 July 2015, Guangzhou, China N2 - Aligned square arrays of black silicon (b-Si) on top of pillars were fabricated on p-type silicon substrate by a deep-etching step combined with a b-Si process. Two 10×10 arrays with pillar heights of 8 μm and 20 μm and one b-Si reference sample without pillars were investigated. Integral field emission (FE) measurements of the arrays yielded rather low onset-fields between 6.4 V/μm and 13.5 V/μm and field enhancement factors between 430 and 800. The I-V curves showed typical Fowler-Nordheim behavior for low fields, whereas a saturation region was observed at higher fields. The maximum integral current in the saturation region was 8 μA at a field of 20 V/μm. The stability of the emission current was investigated over 3 hours and revealed moderate fluctuations of ± 8% in the saturation region. Voltage scans showed well-aligned FE from nearly all pillars. KW - black silicon KW - CATHODES KW - Current measurement KW - Etching KW - FABRICATION KW - field emission KW - field emitter array KW - Iron KW - silicon KW - Vacuum technology Y1 - 2015 U6 - https://doi.org/10.1109/IVNC.2015.7225547 SP - 104 EP - 105 PB - IEEE ER - TY - CHAP A1 - Prommesberger, Christian A1 - Ławrowski, Robert Damian A1 - Langer, Christoph A1 - Dams, Florian A1 - Schreiner, Rupert T1 - Realisierung von Siliziumspitzenarrays mit integrierter Gate-Elektrode für Anwendungen in der Vakuumsensorik T2 - 4. Landshuter Symposium Mikrosystemtechnik, Mikrosystemtechnik als Schlüsseltechnologie der Systemintegration, Tagungsband zum Symposium 12./13. März 2014, Hochschule Landshut N2 - Bei der Feldemission (kalte Emission) können Elektronen durch ein starkes elektrisches Feld eine glatte und leitende Oberfläche verlassen. Die Elektronen tunneln dabei durch eine Potentialbarriere, deren Breite durch ein äußeres elektrisches Feld verkleinert wird. Durch das Hinzufügen einer integrierten Gate-Elektrode um eine Siliziumspitze kann die notwendige Einsatzspannung für Feldemission deutlich gesenkt werden. Zwischen Si-Kathode und Gate-Elektrode befindet sich dabei eine Isolationsschicht, die höchste Anforderungen bezüglich der elektrischen Durchbruchsfestigkeit erfüllen muss. Mit einer Kombination aus Trocken- (Schichtdicke 50 nm) und Feuchtoxid (Schichtdicke 950 nm) konnte eine Isolationsschicht entwickelt werden, die im integrierten Aufbau eine minimale Durchbruchsfeldstärke von 3,2 MV/cm aufweist. Für die Realisierung von Siliziumkathoden mit integrierter Gate-Elektrode wurde ein bereits bestehender Herstellungsprozess um zusätzliche Prozessschritte erweitert. Die Übertragung der lateralen Position der Spitze erfolgt durch Strukturierung des Umkehrlacks AZ5214 und einer RIE-Ätzung der zuvor hergestellten SiO2-Schicht. Nach dem Entfernen der Lackschicht wird die vertikale Struktur der Siliziumspitzen durch einen RIE-Ätzprozess mit den Prozessgasen SF6 und O)2 realisiert. Aus einer thermischen Oxidation bei 940 °C resultiert anschließend die Isolationsschicht zwischen Si-Kathode und Gate-Elektrode . Gleichzeitig wird diese Anschärfeoxidation auch zur Realisierung der endgültigen Spitzengeometrie verwendet. Durch die lithographische Strukturierung des Photolacks AZ5214 kann dabei die Fläche der aufgedampften Gate-Elektrode festgelegt werden. Die Gate-Elektrode wird in einem selbstjustierenden Prozessschritt exakt konzentrisch um die Si-Spitze aufgedampft. Der gerichtete Aufdampfprozess bewirkt eine Abschattung, so dass das Oxidplättchen nicht komplett von Metall ummantelt wird. Die Opferschicht aus Photolack wird mit den nicht benötigten Metallflächen in einem Lift-off-Prozess entfernt. KW - elektrischer Durchbruch KW - Feldelektronenemission KW - Halbleiterschicht KW - Isolierschicht KW - Kathode KW - Silicium KW - Vakuumsensor Y1 - 2014 SN - 978-3-9812696-5-9 SP - 36 EP - 41 CY - Landshut ER - TY - CHAP A1 - Ławrowski, Robert Damian A1 - Langer, Christoph A1 - Prommesberger, Christian A1 - Dams, Florian A1 - Serbun, Pavel A1 - Müller, Günter A1 - Schreiner, Rupert T1 - Spitzen- und Kantenemitter aus Silizium mit einem hohen Aspektverhältnis für Ionisationsgassensoren T2 - Mikrosystemtechnik als Schlüsseltechnologie der Systemintegration : 4. Landshuter Symposium Mikrosystemtechnik ; Tagungsband zum Symposium ; 12./13. März 2014, Hochschule Landshut N2 - Durch die Optimierung von reaktivem Ionenätzen mit induktiv gekoppeltem Plasma ist die Herstellung von verschiedenen Siliziumkathoden mit hoher Anisotropie und hohem Aspektverhältnis für Feldemissionsanwendungen möglich. Simulationen mit COMSOL Multiphysics untermauern das Potential von solchen Spitzen- und Kantenfeldemittern. Die Ergebnisse der Simulation zeigen einen zwei- bis sechsfach höheren Feldüberhöhungsfaktor der tiefgeätzten Strukturen im Vergleich zu identischen Emittern ohne zusätzliche Tiefenätzung. Feldemissionsmessungen bestätigen die Simulationsergebnisse. Der modifizierte Herstellungsprozess der Feldemitter ermöglicht somit einen zuverlässigen Betrieb von Feldemissionselektronenquellen bei kleineren makroskopischen Feldstärken. Außerdem weisen die Messungen des Emissionsstroms im Sättigungsbereich eine weitgehende Unabhängigkeit vom elektrischen Feld auf. Lokale Feldemissionsmessungen ergeben dadurch eine deutliche Stromstabilisierung, welche über große Feldstärkenbereiche konstant bleibt. Die Nutzung der HAR-Emitter (high aspect ratio) ist damit eine gute Voraussetzung für einen zuverlässigen Betrieb der Emissionskathoden bei kleinen Feldstärken für die Anwendung in Ionisationsgassensoren. KW - Emitter KW - Feldelektronenemission KW - Gassensor KW - Herstellung KW - Ionenemission KW - Silicium Y1 - 2014 SN - 978-3-9812696-5-9 SP - 28 EP - 35 PB - Cluster Mikrosystemtechnik CY - Landshut ER - TY - JOUR A1 - Ławrowski, Robert Damian A1 - Prommesberger, Christian A1 - Langer, Christoph A1 - Dams, Florian A1 - Schreiner, Rupert T1 - Improvement of Homogeneity and Aspect Ratio of Silicon Tips for Field Emission by Reactive-Ion Etching JF - Advances in Materials Science and Engineering. Special issue: Advances in Smart Materials and Applications N2 - The homogeneity of emitters is very important for the performance of field emission (FE) devices. Reactive-ion etching (RIE) and oxidation have significant influences on the geometry of silicon tips. The RIE influences mainly the anisotropy of the emitters. Pressure has a strong impact on the anisotropic factor. Reducing the pressure results in a higher anisotropy, but the etch rate is also lower. A longer time of etching compensates this effect. Furthermore an improvement of homogeneity was observed. The impact of uprating is quite low for the anisotropic factor, but significant for the homogeneity. At low power the height and undercut of the emitters are more constant over the whole wafer. The oxidation itself is very homogeneous and has no observable effect on further variation of the homogeneity. This modified fabrication process allows solving the problem of inhomogeneity of previous field emission arrays. Y1 - 2014 U6 - https://doi.org/10.1155/2014/948708 SN - 1687-8442 SN - 1687-8434 VL - 2014 SP - 1 EP - 6 PB - Hindawi ER - TY - CHAP A1 - Ławrowski, Robert Damian A1 - Prommesberger, Christian A1 - Langer, Christoph A1 - Dams, Florian A1 - Schreiner, Rupert T1 - Influence of reactive ion etching parameters on the geometry of silicon tip cathodes for field emission T2 - Applied Research Conference 2013, ARC 2013 : 17th and 18th October 2013, Deggendorf Y1 - 2013 SN - 978-3-8440-2274-2 SP - 67 EP - 69 PB - Shaker CY - Aachen ER - TY - CHAP A1 - Ławrowski, Robert Damian A1 - Prommesberger, Christian A1 - Langer, Christoph A1 - Dams, Florian A1 - Schreiner, Rupert T1 - Feldemissionselektronenquellen basierend auf Siliziumemittern mit hohen Aspektverhältnis T2 - Forschungsbericht der OTH Regensburg 2013 Y1 - 2013 UR - https://doi.org/10.35096/othr/pub-799 SP - 47 EP - 48 CY - Regensburg ER -