TY - JOUR A1 - Hausladen, Matthias A1 - Buchner, Philipp A1 - Bartl, Mathias A1 - Bachmann, Michael A1 - Schreiner, Rupert T1 - Integrated multichip field emission electron source fabricated by laser-micromachining and MEMS technology JF - Journal of Vacuum Science & Technology B N2 - In this work, high-current field emission electron source chips were fabricated using laser-micromachining and MEMS technology. The resulting chips were combined with commercially available printed circuit boards (PCBs) to obtain a multichip electron source. By controlling the separate electron sources using an external current control circuit, we were able to divide the desired total current evenly across the individual chips deployed in the PCB-carrier. In consequence, we were able to show a decreased degradation due to the reduced current load per chip. First, a single electron source chip was measured without current regulation. A steady-state emission current of 1 mA with a high stability of ±1.3% at an extraction voltage of 250 V was observed. At this current level, a mean degradation slope of −0.7 μA/min with a nearly perfect transmission ratio of 99% ± 0.4% was determined. The measurements of a fully assembled multichip PCB-carrier electron source, using a current control circuit for regulation, showed that an even distribution of the desired total current led to a decreased degradation. This was determined by the increase in the required extraction voltage over time. For this purpose, two current levels were applied to the electron source chips of the PCB-carrier using an external current control circuit. First, 300 μA total current was evenly distributed among the individual electron source chips followed by the emission of 300 μA per electron source chip. This allows the observation of the influence of a distributed and nondistributed total current, carried by the electron source chips. Thereby, we obtained an increase in the mean degradation slope from +0.011 V/min (300 μA distributed) to +0.239 V/min (300 μA per chip), which is approximately 21 times higher. Moreover, our current control circuit improved the current stability to under 0.1% for both current levels, 300 μA distributed and 300 μA per chip. KW - MEMS technology KW - Field emitter arrays KW - Electron sources KW - Laser micromachining Y1 - 2024 U6 - https://doi.org/10.1116/6.0003233 VL - 42 IS - 1 PB - AIP Publishing ER - TY - JOUR A1 - Langer, Christoph A1 - Bomke, Vitali A1 - Hausladen, Matthias A1 - Ławrowski, Robert Damian A1 - Prommesberger, Christian A1 - Bachmann, Michael A1 - Schreiner, Rupert T1 - Silicon Chip Field Emission Electron Source Fabricated by Laser Micromachining JF - Journal of Vacuum Science & Technology B N2 - The components for a silicon chip electron source were fabricated by laser micromachining using pulsed laser ablation and wet chemical cleaning and etching dips. The field emission electron source consists of a silicon field emission cathode with 4 × 4 conical shaped emitters with a height of 250 μm and a tip radius of about 50 nm, a 50 μm thick laser-structured mica spacer, and a silicon grid electrode with a grid periodicity of 200 μm and a bar width of 50 μm. These three components are combined to a single chip with the size of 14 × 10 mm2 and the thickness of 1 mm to form the electron source. Several of these devices were characterized in ultrahigh vacuum. Onset voltages of about 165 V and cathode currents of about 15 μA for voltages lower than 350 V were observed. Operating the electron source with an anode voltage of 500 V and an extraction grid voltage of 300 V yielded a cathode current of 4.5 μA ± 8.9%, an anode current of 4.0 μA ± 9.6%, and a corresponding grid transmittance of 89%. Regulating the anode current by the extraction grid voltage, an extremely stable anode current of 5.0 μA ± 0.017% was observed. A long-term measurement over 120 h was performed, and no significant degradation or failure was observed. KW - Ultra-high vacuum KW - Field emitter arrays KW - Etching KW - Electrical properties and parameters KW - Electron sources KW - Laser ablation KW - Laser micromachining KW - Silicon chip KW - Triodes Y1 - 2020 U6 - https://doi.org/10.1116/1.5134872 VL - 38 IS - 1 PB - AIP Publishing ER - TY - JOUR A1 - Hausladen, Matthias A1 - Schels, Andreas A1 - Buchner, Philipp A1 - Bartl, Mathias A1 - Asgharzade, Ali A1 - Edler, Simon A1 - Wohlfartsstätter, Dominik A1 - Bachmann, Michael A1 - Schreiner, Rupert T1 - Measurement of field emission array current distributions by metal-coated CMOS image sensors JF - Journal of Vacuum Science & Technology B N2 - A CMOS image sensor is utilized to determine the time- and spatially resolved distribution of the total electron emission current of a silicon field emission array. The sensor measures electron emission without the need for phosphorus screens or scintillators as converters. However, in initial experiments, rather low field emission currents of several hundreds of nanoamperes per emitter already damaged the sensor surface, which altered the systems’ signal response over the measurement time. In consequence, we coated the CMOS sensor surface with a Cu layer for surface protection. In contrast to the original insulating surface, Cu is an excellent current- and heat-conductor, which avoids lens charging by providing a conductive path for incident electrons and has an improved heat dissipation capability. Measurements using a segmented field emission cathode with four individually addressable tips demonstrate a consistent correlation between the emission current and the sensor signal of the metal-coated image sensor. Furthermore, the characterization of a field emission array showed that single tip emission currents of up to 12 μA per tip are measurable without discernible damage effects of the sensor’s surface. KW - Bremsstrahlung KW - Laser micromachining KW - Image sensors KW - Field emitter arrays Y1 - 2024 U6 - https://doi.org/10.1116/6.0004074 VL - 42 IS - 6 PB - AIP Publishing ER - TY - JOUR A1 - Buchner, Philipp A1 - Hausladen, Matthias A1 - Bartl, Mathias A1 - Bachmann, Michael A1 - Schreiner, Rupert T1 - High current field emission from Si nanowires on pillar structures JF - Journal of Vacuum Science and Technology B: Nanotechnology and Microelectronics N2 - We investigate the influence of the geometry and doping level on the performance of n-type silicon nanowire field emitters on silicon pillar structures. Therefore, multiple cathodes with 50 by 50 pillar arrays (diameter: 5 μm, height: 30 μm, spacing: 50 μm) were fabricated and measured in diode configuration. In the first experiment, we compared two geometry types using the same material. Geometry 1 is black silicon, which is a highly dense surface covering a forest of tightly spaced silicon needles resulting from self-masking during a plasma etching process of single crystal silicon. Geometry 2 are silicon nanowires, which are individual spaced-out nanowires in a crownlike shape resulting from a plasma etching process of single crystal silicon. In the second experiment, we compared two different silicon doping levels [n-type (P), 1–10 and <0.005 Ω cm] for the same geometry. The best performance was achieved with lower doped silicon nanowire samples, emitting 2 mA at an extraction voltage of 1 kV. The geometry/material combination with the best performance was used to assemble an integrated electron source. These electron sources were measured in a triode configuration and reached onset voltages of about 125 V and emission currents of 2.5 mA at extraction voltages of 400 V, while achieving electron transmission rates as high as 85.0%. KW - Doping KW - Electron sources KW - Nanowires KW - Plasma processing KW - Field emitter arrays KW - Triodes KW - Semiconductors Y1 - 2024 U6 - https://doi.org/10.1116/6.0003384 SN - 2166-2754 VL - 42 IS - 2 PB - AIP ER - TY - JOUR A1 - Tan, Jing Jie A1 - Schreiner, Rupert A1 - Hausladen, Matthias A1 - Asgharzade, Ali A1 - Edler, Simon A1 - Bartsch, Julian A1 - Bachmann, Michael A1 - Schels, Andreas A1 - Kwan, Ban-Hoe A1 - Ng, Danny Wee-Kiat A1 - Hum, Yan-Chai T1 - SiMiC: Context-aware silicon microstructure characterization using attention-based convolutional neural networks for field-emission tip analysis JF - Journal of Vacuum Science & Technology B N2 - Accurate characterization of silicon microstructures is essential for advancing microscale fabrication, quality control, and device performance. Traditional analysis using scanning electron microscopy (SEM) often requires labor-intensive, manual evaluation of feature geometry, limiting throughput and reproducibility. In this study, we propose SiMiC: Context-aware Silicon Microstructure Characterization Using Attention-based Convolutional Neural Networks for Field-Emission Tip Analysis. By leveraging deep learning, our approach efficiently extracts morphological features—such as size, shape, and apex curvature—from SEM images, significantly reducing human intervention while improving measurement consistency. A specialized dataset of silicon-based field-emitter tips was developed, and a customized convolutional neural network architecture incorporating attention mechanisms was trained for multiclass microstructure classification and dimensional prediction. Comparative analysis with classical image processing techniques demonstrates that SiMiC achieves high accuracy while maintaining interpretability. The proposed framework establishes a foundation for data-driven microstructure analysis directly linked to field-emission performance, opening avenues for correlating emitter geometry with emission behavior and guiding the design of optimized cold-cathode and SEM electron sources. The related dataset and algorithm repository that could serve as a baseline in this area can be found at https://research.jingjietan.com/?q=SIMIC. KW - Field emitter arrays KW - Quality assurance KW - Convolutional neural network KW - Deep learning KW - Image processing KW - Machine learning KW - Cold cathodes KW - Scanning electron microscopy KW - Electron sources KW - Chemical elements Y1 - 2025 U6 - https://doi.org/10.1116/6.0005068 VL - 43 IS - 6 PB - AVS ER -