TY - CHAP A1 - Schaller, R. A1 - Maier, F. A1 - Mandl, Roland T1 - Thermally stimulated depolarization current - characterization of a multi-layer dielectric stack for semiconductor packages T2 - 2022 14th International Conference on Advanced Semiconductor Devices and Microsystems (ASDAM), 23-26 October 2022, Smolenice Castle, Slovakia N2 - In this paper, the results of Thermally Stimulated Depolarization Currents (TSDC)-measurements of a complex system of stacked dielectric layers, like typically appearing in semiconductor packages, is presented. Characteristics of the individual isolation layers are presented solely and the results are compared to the stack. The investigated layers are comprising polyimide film, alkali-free glass, polyolefin film and epoxy based mold compound. Measurements have been carried out in the temperature range from 19 - 195°C at varying polarization fields for every material. Various relaxation peaks, originated by different polarization mechanisms within the materials could be observed. A comparison between the TSDC-peaks of the layer stack and the individual materials is shown. Our results demonstrate, that the super positioned spectrum is getting dominated by a single portion, the mold compound. KW - Glass KW - Micromechanical devices KW - Polyimides KW - Semiconductor device measurement KW - Semiconductor devices KW - Temperature distribution KW - Temperature measurement Y1 - 2022 SN - 978-1-6654-6977-7 U6 - https://doi.org/10.1109/ASDAM55965.2022.9966799 SP - 1 EP - 5 PB - IEEE ER -