TY - JOUR A1 - Edler, Simon A1 - Bachmann, Michael A1 - Breuer, Janis A1 - Dams, Florian A1 - Düsberg, Felix A1 - Hofmann, Martin A1 - Jakšič, Jasna A1 - Pahlke, Andreas A1 - Langer, Christoph A1 - Ławrowski, Robert Damian A1 - Prommesberger, Christian A1 - Schreiner, Rupert T1 - Influence of adsorbates on the performance of a field emitter array in a high voltage triode setup JF - Journal of Applied Physics N2 - In the present work, black-silicon field emitter arrays (FEAs) are investigated regarding the influence of residual gas pressure on the characteristics and lifetime in the high voltage triode setup. Current-voltage-characteristics at different pressure levels are recorded and show a decreasing emission current with rising pressure. This decrease can be explained by an increase of the work function and charging of the emitter surface caused by adsorbates. The emission current can be restored to its initial value by heating of the FEA up to 110 °C during active emission. With this regeneration procedure, an extended lifetime from about 20 h to 440 h at a residual gas pressure of 10−5 mbar is achieved. Y1 - 2017 U6 - https://doi.org/10.1063/1.4987134 VL - 122 ER - TY - JOUR A1 - Bachmann, Michael A1 - Dams, Florian A1 - Düsberg, Felix A1 - Hofmann, Martin A1 - Pahlke, Andreas A1 - Langer, Christoph A1 - Ławrowski, Robert Damian A1 - Prommesberger, Christian A1 - Schreiner, Rupert A1 - Serbun, Pavel A1 - Lützenkirchen-Hecht, Dirk A1 - Müller, Günter T1 - Extraction of the characteristics of current-limiting elements from field emission measurement data JF - Journal of Vacuum Science & Technology B N2 - In this contribution, the authors will present an algorithm to extract the characteristics of nonideal field emission circuit elements from saturation-limited field emission measurement data. The method for calculating the voltage drop on current-limiting circuit elements is based on circuit theory as well as Newton's method. Since the only assumption the authors make on the current-limiting circuit is a connection in series, this method is applicable to most field emission data showing saturation. To be able to determine the significance of any parameter output, the uncertainties of data and extracted parameters as well as the parameter correlations are fully taken into account throughout the algorithm. N-type silicon samples with varying external serial resistors are analyzed. All results show a good agreement to the nominal resistor values. Additionally, several p-type samples are analyzed, showing a diodelike behavior. The extracted current-limiting characteristics of the p-type samples are in good agreement with a pn-junction model. The stability of the emission current of the p-type samples is measured by constant voltage measurements and compared to the extracted current-limiting characteristics. The application of the algorithm to measurement data shows that the given algorithm is a valuable tool to analyze field emission measurement data influenced by nonemissive processes. Y1 - 2017 U6 - https://doi.org/10.1116/1.4971768 VL - 35 IS - 2 ER - TY - CHAP A1 - Bachmann, Michael A1 - Dams, Florian A1 - Düsberg, Felix A1 - Hofmann, Martin A1 - Pahlke, Andreas A1 - Langer, Christoph A1 - Ławrowski, Robert Damian A1 - Prommesberger, Christian A1 - Schreiner, Rupert T1 - Extraction of the characteristics of limiting elements from field emission measurement data T2 - 29th International Vacuum Nanoelectronics Conference (IVNC), 2016, 11-15 July, Vancouver, BC, Canada N2 - In this contribution we will present an algorithm to extract the characteristics of non-Fowler-Nordheim (FN) circuit elements from saturation limited field emission (FE) measurement data. The method for calculating the voltage drop on limiting circuit elements is based on circuit theory as well as Newton's method. Since no assumption on the limiting circuit is made, this method is applicable to any FE data showing saturation. To be able to determine the significance of any parameter output, the uncertainties of data and extracted parameters are fully taken into account throughout the algorithm. External serial resistors and a limiting p-doped substrate are analyzed, where the latter shows a diode-like behavior. Y1 - 2016 U6 - https://doi.org/10.1109/IVNC.2016.7551474 SN - 2380-6311 SP - 81 EP - 82 PB - IEEE ER - TY - CHAP A1 - Bachmann, Michael A1 - Dams, Florian A1 - Düsberg, Felix A1 - Hofmann, Martin A1 - Pahlke, Andreas A1 - Langer, Christoph A1 - Ławrowski, Robert Damian A1 - Prommesberger, Christian A1 - Schreiner, Rupert T1 - Control of the electron source current T2 - International Vacuum Nanoelectronics Conference (IVNC), 30th, 2017, Regensburg N2 - A control circuit to stabilize the flux of electrons transmitted through an extractor electrode is presented. By controlling the emission current a fluctuation with a standard deviation of 0.015% is observed. However, the achievable stability of the transmitted electron current is limited due to a variation of the extraction grid current ratio showing a standard deviation of 4.33%. By regulating the difference of the emission current and the extraction grid current an improved stability of the transmitted electron current down to a standard deviation of 0.280% is observed. Even with operation at 2 × 10 -5 mbar a standard deviation of 0.558% is achieved. KW - Standards KW - Circuit stability KW - Power system stability KW - Current measurement KW - Voltage measurement KW - Electron sources KW - Stability analysis Y1 - 2017 U6 - https://doi.org/10.1109/IVNC.2017.8051550 SP - 66 EP - 67 PB - IEEE ER - TY - CHAP A1 - Langer, Christoph A1 - Ławrowski, Robert Damian A1 - Prommesberger, Christian A1 - Dams, Florian A1 - Serbun, Pavel A1 - Bachmann, Michael A1 - Müller, Günter A1 - Schreiner, Rupert T1 - High aspect ratio silicon tip cathodes for application in field emission electron sources T2 - 2014 27th International Vacuum Nanoelectronics Conference (IVNC), 6-10 July 2014, Engelberg, Switzerland N2 - Precisely aligned arrays of sharp tip structures on top of elongated pillars were realized by using an improved fabrication process including an additional inductively-coupled-plasma reactive-ion etching step. Arrays of n-type and p-type silicon with 271 tips have been fabricated and investigated. Those structures have a total height of 5–6 µm and apex radii less than 20nm. Integral field emission measurements of the arrays yielded low onset-fields in the range of 8–12V=µm and field enhancement factors between 300 and 700. The I-E curves of n-type structures showed the usual Fowler-Nordheim behaviour, whereas p-type structures revealed a significant saturation region due to the limited number of electrons in the conduction band and a further carrier depletion effect caused by the pillar. The maximum integral current in the saturation region was 150 nA at fields above 30V=µm. An excellent stability of the emission current of less than ± 2% fluctuation was observed in the saturation region. For n-type Si a maximum integral current of 10 µA at 24V=µm and an average current stability with a fluctuation of ± 50% were measured. KW - Current measurement KW - Etching KW - FABRICATION KW - field emission KW - field emitter array KW - GEOMETRY KW - Iron KW - Sensor arrays KW - silicon KW - silicon tip Y1 - 2014 U6 - https://doi.org/10.1109/IVNC.2014.6894824 SP - 222 EP - 223 PB - IEEE ER - TY - JOUR A1 - Langer, Christoph A1 - Prommesberger, Christian A1 - Ławrowski, Robert Damian A1 - Dams, Florian A1 - Schreiner, Rupert T1 - Simulation and Fabrication of Silicon Field Emission Cathodes for Cold Electron Sources JF - Advanced Materials Research N2 - We report on the simulation and fabrication of nanostructured silicon surfaces for field emission (FE) applications, e.g. ionization sensors and x-ray tubes. For the design and optimization of field-emitting silicon structures, the influence of the geometric parameters like tip height, apex radius, aperture angle and curvature shape on the field enhancement factor was investigated by simulation using finite element method. A universal geometric model which describes the real geometry of our silicon structures sufficiently accurate was taken for modeling a variety of different silicon tip structures as well as ridge structures. While a high dependency of the field enhancement on the aspect ratio and the aperture angle was found, the simulations show that the elliptic curvature affects the field enhancement only marginally. Finally, an improved process for fabrication of such silicon structures on n-type as well as p-type substrate is described, using reactive ion etching with adjustable anisotropy, wet thermal oxidation and wet etching. KW - field emission cathodes KW - field enhancement factor KW - silicon field emitter Y1 - 2014 U6 - https://doi.org/10.4028/www.scientific.net/amr.1024.48 VL - 1024 SP - 48 EP - 51 ER - TY - JOUR A1 - Ławrowski, Robert Damian A1 - Prommesberger, Christian A1 - Langer, Christoph A1 - Dams, Florian A1 - Schreiner, Rupert T1 - Improvement of Homogenity and Aspect Ratio of Silicon Tips for Field Emission by Reactive-Ion Etching JF - Advances in materials science and engineering N2 - The homogeneity of emitters is very important for the performance of field emission (FE) devices. Reactive-ion etching (RIE) and oxidation have significant influences on the geometry of silicon tips. The RIE influences mainly the anisotropy of the emitters. Pressure has a strong impact on the anisotropic factor. Reducing the pressure results in a higher anisotropy, but the etch rate is also lower. A longer time of etching compensates this effect. Furthermore an improvement of homogeneity was observed. The impact of uprating is quite low for the anisotropic factor, but significant for the homogeneity. At low power the height and undercut of the emitters are more constant over the whole wafer. The oxidation itself is very homogeneous and has no observable effect on further variation of the homogeneity. This modified fabrication process allows solving the problem of inhomogeneity of previous field emission arrays. Y1 - 2014 U6 - https://doi.org/10.1155/2014/948708 VL - 2014 PB - Hindawi ER - TY - CHAP A1 - Prommesberger, Christian A1 - Langer, Christoph A1 - Ławrowski, Robert Damian A1 - Muller, F. A1 - Dams, Florian A1 - Schreiner, Rupert A1 - Serbun, Pavel A1 - Müller, Günter T1 - Comparison of integral and local field-emission properties of Mo-coated p-Si tip arrays T2 - 2015 28th International Vacuum Nanoelectronics Conference (IVNC), 13-17 July 2015, Guangzhou, China N2 - Silicon tip arrays were fabricated by means of reactive ion etching followed by oxidation for final sharpening and molybdenum thin film coating. The field-emission (FE) properties of these Mo-coated p-Si tip arrays were systemically investigated by different measurement techniques. Integral measurements in diode configuration yielded a turn-on field (for 1 nA) of 22 V/μm and nearly stable FE currents up to 6.6 μA at 38 V/μm. The effective field enhancements factor extracted from the FN plots is about 180. Detailed investigations of these FE arrays were also performed by means of field emission scanning microscopy combined with electron microscopy. A rather limited efficiency of the tips (50% at 1500 V) and FE homogeneity (180 nA at 700 V) might be correlated with the varying morphology of the tips and the presence of oxides. Local I-V measurements of selected single tips revealed both activation and deactivation effects, which finally resulted in nearly reproducible I-V curves. Current stability measurements at a constant voltage showed rather large fluctuations (0.1-1 μA) of the FE current, which could be reduced up to 1.7% by using of a PID-regulated voltage source. SEM images showed unchanged tip shape after the current processing. KW - CATHODES KW - Coatings KW - Current measurement KW - field emission KW - Iron KW - Mo-coated KW - p-Si tip KW - Scanning electron microscopy KW - silicon KW - tip arrays KW - Vacuum technology Y1 - 2015 U6 - https://doi.org/10.1109/IVNC.2015.7225579 SP - 192 EP - 193 PB - IEEE ER - TY - CHAP A1 - Ławrowski, Robert Damian A1 - Langer, Christoph A1 - Prommesberger, Christian A1 - Dams, Florian A1 - Bachmann, Michael A1 - Schreiner, Rupert T1 - Fabrication and simulation of silicon structures with high aspect ratio for field emission devices T2 - 2014 27th International Vacuum Nanoelectronics Conference (IVNC), 6-10 July 2014, Engelberg, Switzerland N2 - To obtain higher field enhancement factors of Si-tip structures, we present an improved fabrication process utilizing reactive-ion etching (RIE) with an inductively coupled plasma (ICP). In our design, a pillar under the tips is realized by a combination of RIE with ICP. With adjusted power settings (≈ 240 W) and step times (<; 5 s), vertical slopes with a low roughness of approximately 10 nm to 20 nm are possible. The remaining silicon is oxidized thermally to sharpen the emitters. A final tip radius of R <; 20 nm is obtained for the tips of the emitters. The pillar height HP can be mainly adjusted by the duration of the ICP-etching step. A total emitter height of H ≈ 6 μm with a pillar height of HP ≈ 5 μm is achieved. Simulations with COMSOL Multiphysics® are applied to calculate the field enhancement factor β. A two-dimensional model is used in rotational symmetry. In addition to the previous model, a pillar with a varying diameter ØP and height HP is added. A conventional emitter (H = 1 μm and R = 20 nm) placed on a pillar of the height HP ≈ 5 μm approximately results in a three times higher β-factor (β≈ 105). By decreasing the diameter ØP a slight increase of the β-factor is observed. However, the aspect ratio of the emitter mainly influences on the β-factor. KW - Anodes KW - CATHODES KW - FABRICATION KW - field emission KW - field emitter array KW - field enhancement factor KW - Iterative closest point algorithm KW - Lead KW - silicon tips Y1 - 2014 U6 - https://doi.org/10.1109/IVNC.2014.6894805 SP - 193 EP - 194 PB - IEEE ER - TY - CHAP A1 - Prommesberger, Christian A1 - Langer, Christoph A1 - Ławrowski, Robert Damian A1 - Dams, Florian A1 - Schreiner, Rupert A1 - Ławrowski, Robert Damian T1 - Gated p-Si field emitter arrays for sensor applications T2 - 2015 28th International Vacuum Nanoelectronics Conference (IVNC) N2 - We report on gated p-type Si-tip array cathodes for implementation into field emission electron sources for sensor applications. Arrays of 16 and 100 tips with tip heights of 3 μm and tip radii below 30 nm with integrated gate electrodes concentrically positioned 2 μm below the tip apexes were fabricated using an improved process, which leads to an enhanced isolation layer quality with sufficient breakdown field strengths and low leakage currents. Integral measurements with a fixed grid potential of 400 V showed emission currents up to 35 μA for 100 tips at a cathode voltage of 150 V and an almost negligible parasitic gate current. The array with 16 p-type Si-tips showed a significant stabilization of the emission current in the range of 0.3 - 0.4 μA, for cathode voltages between 90 V and 150 V. The current fluctuation in this saturation regime was measured for 10 minutes and a value of less than ± 1% was observed. No degradation of the cathode was found after 6 hours of operation at a constant cathode voltage of 100 V and a constant grid voltage of 400 V. KW - CATHODES KW - Current measurement KW - Current stabilization KW - field emission KW - integrated gate-electrode KW - Iron KW - Logic gates KW - semiconductor KW - Semiconductor device measurement KW - silicon KW - silicon tip array Y1 - 2015 U6 - https://doi.org/10.1109/IVNC.2015.7225567 SP - 164 EP - 165 PB - IEEE ER - TY - CHAP A1 - Prommesberger, Christian A1 - Ławrowski, Robert Damian A1 - Langer, Christoph A1 - Dams, Florian A1 - Schreiner, Rupert T1 - Realisierung von Siliziumspitzenarrays mit integrierter Gate-Elektrode für Anwendungen in der Vakuumsensorik T2 - 4. Landshuter Symposium Mikrosystemtechnik, Mikrosystemtechnik als Schlüsseltechnologie der Systemintegration, Tagungsband zum Symposium 12./13. März 2014, Hochschule Landshut N2 - Bei der Feldemission (kalte Emission) können Elektronen durch ein starkes elektrisches Feld eine glatte und leitende Oberfläche verlassen. Die Elektronen tunneln dabei durch eine Potentialbarriere, deren Breite durch ein äußeres elektrisches Feld verkleinert wird. Durch das Hinzufügen einer integrierten Gate-Elektrode um eine Siliziumspitze kann die notwendige Einsatzspannung für Feldemission deutlich gesenkt werden. Zwischen Si-Kathode und Gate-Elektrode befindet sich dabei eine Isolationsschicht, die höchste Anforderungen bezüglich der elektrischen Durchbruchsfestigkeit erfüllen muss. Mit einer Kombination aus Trocken- (Schichtdicke 50 nm) und Feuchtoxid (Schichtdicke 950 nm) konnte eine Isolationsschicht entwickelt werden, die im integrierten Aufbau eine minimale Durchbruchsfeldstärke von 3,2 MV/cm aufweist. Für die Realisierung von Siliziumkathoden mit integrierter Gate-Elektrode wurde ein bereits bestehender Herstellungsprozess um zusätzliche Prozessschritte erweitert. Die Übertragung der lateralen Position der Spitze erfolgt durch Strukturierung des Umkehrlacks AZ5214 und einer RIE-Ätzung der zuvor hergestellten SiO2-Schicht. Nach dem Entfernen der Lackschicht wird die vertikale Struktur der Siliziumspitzen durch einen RIE-Ätzprozess mit den Prozessgasen SF6 und O)2 realisiert. Aus einer thermischen Oxidation bei 940 °C resultiert anschließend die Isolationsschicht zwischen Si-Kathode und Gate-Elektrode . Gleichzeitig wird diese Anschärfeoxidation auch zur Realisierung der endgültigen Spitzengeometrie verwendet. Durch die lithographische Strukturierung des Photolacks AZ5214 kann dabei die Fläche der aufgedampften Gate-Elektrode festgelegt werden. Die Gate-Elektrode wird in einem selbstjustierenden Prozessschritt exakt konzentrisch um die Si-Spitze aufgedampft. Der gerichtete Aufdampfprozess bewirkt eine Abschattung, so dass das Oxidplättchen nicht komplett von Metall ummantelt wird. Die Opferschicht aus Photolack wird mit den nicht benötigten Metallflächen in einem Lift-off-Prozess entfernt. KW - elektrischer Durchbruch KW - Feldelektronenemission KW - Halbleiterschicht KW - Isolierschicht KW - Kathode KW - Silicium KW - Vakuumsensor Y1 - 2014 SN - 978-3-9812696-5-9 SP - 36 EP - 41 CY - Landshut ER - TY - CHAP A1 - Ławrowski, Robert Damian A1 - Langer, Christoph A1 - Prommesberger, Christian A1 - Dams, Florian A1 - Serbun, Pavel A1 - Müller, Günter A1 - Schreiner, Rupert T1 - Spitzen- und Kantenemitter aus Silizium mit einem hohen Aspektverhältnis für Ionisationsgassensoren T2 - Mikrosystemtechnik als Schlüsseltechnologie der Systemintegration : 4. Landshuter Symposium Mikrosystemtechnik ; Tagungsband zum Symposium ; 12./13. März 2014, Hochschule Landshut N2 - Durch die Optimierung von reaktivem Ionenätzen mit induktiv gekoppeltem Plasma ist die Herstellung von verschiedenen Siliziumkathoden mit hoher Anisotropie und hohem Aspektverhältnis für Feldemissionsanwendungen möglich. Simulationen mit COMSOL Multiphysics untermauern das Potential von solchen Spitzen- und Kantenfeldemittern. Die Ergebnisse der Simulation zeigen einen zwei- bis sechsfach höheren Feldüberhöhungsfaktor der tiefgeätzten Strukturen im Vergleich zu identischen Emittern ohne zusätzliche Tiefenätzung. Feldemissionsmessungen bestätigen die Simulationsergebnisse. Der modifizierte Herstellungsprozess der Feldemitter ermöglicht somit einen zuverlässigen Betrieb von Feldemissionselektronenquellen bei kleineren makroskopischen Feldstärken. Außerdem weisen die Messungen des Emissionsstroms im Sättigungsbereich eine weitgehende Unabhängigkeit vom elektrischen Feld auf. Lokale Feldemissionsmessungen ergeben dadurch eine deutliche Stromstabilisierung, welche über große Feldstärkenbereiche konstant bleibt. Die Nutzung der HAR-Emitter (high aspect ratio) ist damit eine gute Voraussetzung für einen zuverlässigen Betrieb der Emissionskathoden bei kleinen Feldstärken für die Anwendung in Ionisationsgassensoren. KW - Emitter KW - Feldelektronenemission KW - Gassensor KW - Herstellung KW - Ionenemission KW - Silicium Y1 - 2014 SN - 978-3-9812696-5-9 SP - 28 EP - 35 PB - Cluster Mikrosystemtechnik CY - Landshut ER - TY - JOUR A1 - Ławrowski, Robert Damian A1 - Prommesberger, Christian A1 - Langer, Christoph A1 - Dams, Florian A1 - Schreiner, Rupert T1 - Improvement of Homogeneity and Aspect Ratio of Silicon Tips for Field Emission by Reactive-Ion Etching JF - Advances in Materials Science and Engineering. Special issue: Advances in Smart Materials and Applications N2 - The homogeneity of emitters is very important for the performance of field emission (FE) devices. Reactive-ion etching (RIE) and oxidation have significant influences on the geometry of silicon tips. The RIE influences mainly the anisotropy of the emitters. Pressure has a strong impact on the anisotropic factor. Reducing the pressure results in a higher anisotropy, but the etch rate is also lower. A longer time of etching compensates this effect. Furthermore an improvement of homogeneity was observed. The impact of uprating is quite low for the anisotropic factor, but significant for the homogeneity. At low power the height and undercut of the emitters are more constant over the whole wafer. The oxidation itself is very homogeneous and has no observable effect on further variation of the homogeneity. This modified fabrication process allows solving the problem of inhomogeneity of previous field emission arrays. Y1 - 2014 U6 - https://doi.org/10.1155/2014/948708 SN - 1687-8442 SN - 1687-8434 VL - 2014 SP - 1 EP - 6 PB - Hindawi ER -