TY - JOUR A1 - Peter, Daniel A1 - Dalmer, Michael A1 - Lechner, Alfred A1 - Gigler, Alexander M. A1 - Stark, Robert W. A1 - Bensch, Wolfgang T1 - Measurement of the mechanical stability of semiconductor line structures in drying liquids with application to pattern collapse JF - Journal of Micromechanics and Microengineering N2 - Enhanced particle removal processes in wet cleaning as well as drying processes of semiconductor wafers can cause significant lateral forces on surface structures. These forces, however, must not exceed the mechanical stability of structures on the wafer. Thus, a mechanical fracture test was used to assess the lateral mechanical stability of polysilicon line structures in relevant process liquids. The mechanical test was based on nanomanipulation with an atomic force microscope. Compared to fracture tests in air, data acquired in liquid isopropanol revealed a stabilizing effect. The differences in fracture forces can be attributed to a stress corrosion process on the surface. The size of the generated damage was influenced by the viscosity of the surrounding media. Y1 - 2011 U6 - https://doi.org/10.1088/0960-1317/21/2/025001 VL - 21 IS - 2 PB - IOP Science ER - TY - CHAP A1 - Peter, Daniel A1 - Dalmer, Michael A1 - Lotnyk, Andriy A1 - Kienle, Lorenz A1 - Lechner, Alfred A1 - Bensch, Wolfgang T1 - Solid bridging during pattern collapse (stiction) studied on silicon nanoparticles T2 - MRS Online Proceedings Library N2 - The high surface to volume ratio of nanoparticles allows a detailed experimental study of the surface phenomena associated with solid bridging. Besides bulk analyses, the local view on the structure and composition via HRTEM is particularly essential. 50 nm core shell particles consisting of a silicon (Si) core and a SiO2 shell were used as model system to understand surface phenomena appearing for Si-based nanostructures. Evaporative drying from de-ionized water shows the most significant bridging effect based on SiO2. There is only a localized deposition of oxides between the particles during the drying process and no overall oxidation. For the deposition material, silicates are the most likely candidates. Y1 - 2011 U6 - https://doi.org/10.1557/opl.2011.397 VL - 1299 SP - 191 EP - 196 PB - Springer Nature ER - TY - JOUR A1 - Peter, Daniel A1 - Holsteyns, Frank A1 - Dalmer, Michael A1 - Kruwinus, Hans A1 - Lechner, Alfred A1 - Bensch, Wolfgang T1 - A Study on the Structure Collapse Mechanisms for High Aspect Ratio Structures with Application to Clean Processing JF - ECS Meeting Abstracts Y1 - 2009 U6 - https://doi.org/10.1149/MA2009-02/24/2084 VL - MA2009-02 IS - 24 PB - IOP Science ER - TY - JOUR A1 - Peter, Daniel A1 - Dalmer, Michael A1 - Lechner, Alfred A1 - Gigler, Alexander M. A1 - Stark, Robert W. A1 - Bensch, Wolfgang T1 - The influence of liquid media on the fracture strength of polysilicon nanostructures JF - Solid State Phenomena N2 - The mechanical stability of nanostructures depends on the surrounding medium. Their stability was probed by lateral force microscopy in liquid media. Previously reported data on water and isopropanol showed an increase in the fracture strength for the latter. Further tests with other alcohols (ethanol, 1-butanol) also showed an increasing strength. The interface between the liquid and the surface is the decisive factor for the influence of the media. When altering the interface with a cationic surfactant or a self-assembled monolayer, an increase of the fracture force by 100 % compared to de-ionized water could be measured. KW - pattern collapse KW - fracture strength KW - damage KW - atomic force microscopy Y1 - 2012 U6 - https://doi.org/10.4028/www.scientific.net/SSP.187.127 VL - 187 SP - 127 EP - 130 PB - Trans Tech Publications ER -