TY - CHAP A1 - Ławrowski, Robert Damian A1 - Schreiner, Rupert A1 - Linghu, Shuangyi A1 - Gu, Fuxing T1 - Field Emission Behaviour of Single-Crystal Pd Nanowires T2 - 33rd International Vacuum Nanoelectronics Conference (IVNC): 6-10 July 2020, Lyon, France N2 - Single-crystal Pd nanowires with typically 100 nm diameters and lengths from several micrometers to tens of micrometers were grown on Al 2 O 3 substrates in a furnace with Ar atmosphere. Integral field emission measurements of such samples after Pd coating (~10 nm) were performed in a diode configuration with a 50 μm mica spacer in a vacuum chamber at pressures of about 10 -9 mbar. The IV measurement of the sample shows an integral emission current up to 2 μA at a voltage of 500 V (10 MV/m) and an onset voltage for a current of 1 nA of about 275 V. The corresponding Fowler-Nordheim plot show a linear behavior, like expected for a metal needle. Y1 - 2020 SN - 978-1-7281-9454-7 U6 - https://doi.org/10.1109/IVNC49440.2020.9203510 SP - 1 EP - 2 PB - IEEE ER - TY - JOUR A1 - Ławrowski, Robert Damian A1 - Prommesberger, Christian A1 - Langer, Christoph A1 - Dams, Florian A1 - Schreiner, Rupert T1 - Improvement of Homogenity and Aspect Ratio of Silicon Tips for Field Emission by Reactive-Ion Etching JF - Advances in materials science and engineering N2 - The homogeneity of emitters is very important for the performance of field emission (FE) devices. Reactive-ion etching (RIE) and oxidation have significant influences on the geometry of silicon tips. The RIE influences mainly the anisotropy of the emitters. Pressure has a strong impact on the anisotropic factor. Reducing the pressure results in a higher anisotropy, but the etch rate is also lower. A longer time of etching compensates this effect. Furthermore an improvement of homogeneity was observed. The impact of uprating is quite low for the anisotropic factor, but significant for the homogeneity. At low power the height and undercut of the emitters are more constant over the whole wafer. The oxidation itself is very homogeneous and has no observable effect on further variation of the homogeneity. This modified fabrication process allows solving the problem of inhomogeneity of previous field emission arrays. Y1 - 2014 U6 - https://doi.org/10.1155/2014/948708 VL - 2014 PB - Hindawi ER - TY - JOUR A1 - Ławrowski, Robert Damian A1 - Prommesberger, Christian A1 - Langer, Christoph A1 - Dams, Florian A1 - Schreiner, Rupert T1 - Improvement of Homogeneity and Aspect Ratio of Silicon Tips for Field Emission by Reactive-Ion Etching JF - Advances in Materials Science and Engineering. Special issue: Advances in Smart Materials and Applications N2 - The homogeneity of emitters is very important for the performance of field emission (FE) devices. Reactive-ion etching (RIE) and oxidation have significant influences on the geometry of silicon tips. The RIE influences mainly the anisotropy of the emitters. Pressure has a strong impact on the anisotropic factor. Reducing the pressure results in a higher anisotropy, but the etch rate is also lower. A longer time of etching compensates this effect. Furthermore an improvement of homogeneity was observed. The impact of uprating is quite low for the anisotropic factor, but significant for the homogeneity. At low power the height and undercut of the emitters are more constant over the whole wafer. The oxidation itself is very homogeneous and has no observable effect on further variation of the homogeneity. This modified fabrication process allows solving the problem of inhomogeneity of previous field emission arrays. Y1 - 2014 U6 - https://doi.org/10.1155/2014/948708 SN - 1687-8442 SN - 1687-8434 VL - 2014 SP - 1 EP - 6 PB - Hindawi ER - TY - JOUR A1 - Ławrowski, Robert Damian A1 - Pirker, Luka A1 - Kaneko, Keita A1 - Kokubo, Hiroki A1 - Bachmann, Michael A1 - Ikuno, Takashi A1 - Remskar, Maja A1 - Schreiner, Rupert T1 - Field emission from nanotubes and flakes of transition metal dichalcogenides JF - Journal of Vacuum Science and Technology B N2 - Transition metal dichalcogenides such as MoS2 and WS2 are low-dimensional semiconductor materials. MoS2 and WS2 nanotubes and flakes were grown by a chemical transport reaction under a temperature gradient. I2 was used as a transport agent for previously synthesized MoS2 and WS2, respectively. These multilayered nanotubes are indirect bandgap semiconductors with a bandgap depending on their diameter. WS2 flakes were prepared by the sulfurization of thin WOx flakes. To increase the field enhancement of such low-dimensional structures by a higher aspect ratio, two approaches were examined: (a) the MoS2 and WS2 nanotubes were attached individually by a focused ion beam with Pt on dry etched n-type Si pillars and (b) the WS2 flakes were grown directly on the surface of the (n-type and p-type) Si pillars. Integral field emission measurements were performed in a diode configuration with a 50 μm mica spacer in a vacuum chamber at pressures of about 10−9 mbar. At a voltage of 900 V (18 MV/m), the integral emission current from the nanotubes is up to 11 μA for the lateral mounted MoS2 and about 1.3 μA (1.0 μA) for the upright mounted WS2 (MoS2). The onset voltage for a current of 1 nA is about 550 V for MoS2 and 500 V for WS2, respectively. The voltage conversion factor is in the range of 6 × 104–8 × 104 cm−1 for the nanotubes. The mounted MoS2 flakes show a field emission current of about 6 μA at 18 MV/m in contrast to the directly grown WS2 flakes, which show a pronounced saturation regime and, therefore, a lower emission current of about 0.5 μA is reached at 1500 V (25 MV/m). The WS2 flakes show a two times higher (1 × 105 cm−1) voltage conversion factor in comparison to the MoS2 flakes (5 × 104 cm−1). The extracted characteristics of the current-limiting part show a difference in the behavior of the extracted current-limiting characteristics between the lateral (linear) and upright mounted (exponential) nanotubes and the MoS2 flakes. In contrast, the WS2 flakes show charge carrier depletion effects. Y1 - 2020 U6 - https://doi.org/10.1116/1.5140474 VL - 38 IS - 3 SP - 032801 PB - AIP Publishing ER - TY - CHAP A1 - Ławrowski, Robert Damian A1 - Langer, Christoph A1 - Schreiner, Rupert A1 - Sellmair, J. T1 - Nano Emitters on Silicon Pillar Structures generated by a Focused Electron Beam Induced Deposition T2 - International Vacuum Nanoelectronics Conference (IVNC), 31st, 2018, Kyoto, Japan N2 - Nano emitters were deposited by focused electron beam induced deposition of Trimethyl-(methylcyclopentadienyl)platinum(IV) on top of silicon pillars. The nano emitters were exactly positioned in the center on the top of up to four pillars of a quadratic arranged array of sixteen pillars with a pitch of 50 μm. Integral field emission measurements were performed in a diode configuration with a 50 μm mica spacer in a vacuum chamber at pressures of about 10 -9 mbar. The Fowler-Nordheim plots show a linear behavior, like expected for an n-type silicon material and a metal needle. The I-V measurement of the most promising sample shows an integral emission current up to 2 μm at a voltage of 600 V (12 MV/m) and an onset voltage for a current of 1 nA of about 300 V. KW - field emission KW - nano emitter KW - focused electron beam induced deposition KW - MeCpPtMe3 Y1 - 2018 U6 - https://doi.org/10.1109/IVNC.2018.8520059 PB - IEEE ER - TY - CHAP A1 - Ławrowski, Robert Damian A1 - Langer, Christoph A1 - Prommesberger, Christian A1 - Schreiner, Rupert A1 - Mingels, S. A1 - Porshyn, V. A1 - Serbun, Pavel A1 - Müller, Günter T1 - Field emission from surface textured GaN with buried double-heterostructures T2 - 2015 28th International Vacuum Nanoelectronics Conference (IVNC), 13-17 July 2015, Guangzhou, China N2 - In this contribution we report on field emission (FE) cathodes based on thin-film LED-technology and surface texturing. The FE cathode can be used both as an n-GaN cathode with an electrical contact at the top side metallization as well as a pn-GaN diode contacting only the p-GaN layer at the bottom side of the structure. The local and integral FE properties of the textured surface of the LED structure were investigated. For n-GaN an integral emission current up to 1.0 μA at an electric field of 19 V/μm was achieved. The pn-GaN diode measurements showed an integral current saturation behavior with two orders of magnitude lower FE currents. Regulated voltage scans obtained by FE scanning microscopy revealed a well-distributed emission over the whole cathode area. Measurements under pulsed tunable laser illumination and moderate electric fields indicated charge carrier generation in the buried double-heterostructures at photon energies below 3.5 eV besides normal photoemission above 4.1 eV. KW - CATHODES KW - Current measurement KW - Electric fields KW - field emission KW - Gallium nitride KW - GaN KW - Iron KW - Light emitting diodes KW - photoemission KW - Surface texture Y1 - 2015 U6 - https://doi.org/10.1109/IVNC.2015.7225548 SP - 106 EP - 107 PB - IEEE ER - TY - CHAP A1 - Ławrowski, Robert Damian A1 - Langer, Christoph A1 - Prommesberger, Christian A1 - Schreiner, Rupert T1 - Microrods and microlines by three-dimensional epitaxially grown GaN for field emission cathodes T2 - International Vacuum Nanoelectronics Conference (IVNC), 30th, 2017, Regensburg N2 - The three-dimensional epitaxial technique allows the realization of gallium nitride lines in addition to the rods. To optimize the properties of GaN-based field emission cathodes further investigations and an improvement of the epitaxial process were performed. The microrods and microlines consist of a one-order higher n-doped gallium nitride in comparison to the gallium nitride layer on the sapphire substrate. The typical height of the microrods and -lines is about 5 μm. The field emission properties of these structures were investigated in diode configuration by integral field emission measurements at pressures below 10 -9 mbar. For the microrods (microlines) a voltage of 1100 V (2000 V) was measured for a field emission current of about 0.5 μA with an onset field of about 12 MV/m (24 MV/m). Furthermore, the field enhancement factors for microrods and -lines are in the range of 300 and 200, respectively. KW - field emission KW - GaN KW - LED KW - Gallium nitride KW - Epitaxial growth Y1 - 2017 U6 - https://doi.org/10.1109/IVNC.2017.8051576 SP - 130 EP - 131 PB - IEEE ER - TY - CHAP A1 - Ławrowski, Robert Damian A1 - Langer, Christoph A1 - Prommesberger, Christian A1 - Schreiner, Rupert T1 - Field emission from three-dimensional epitaxial grown GaN-microrods T2 - 29th International Vacuum Nanoelectronics Conference (IVNC), 2016, 11-15 July, Vancouver, BC, Canada N2 - A novel three-dimensional epitaxial technique allows on patterned substrates the realization of gallium nitride pillars, also known as nano- and microrods. The typical dimensions of the microrods are in the range of one micron for the radius of the hexagonal footprint and about 10 μm in height. The microrods consist of a semiconductor heterostructure with an n GaN core, a n-GaN shell, a p GaN shell and an intermediate quantum well layer. The field emission properties were investigated in diode configuration by integral field emission measurements in a vacuum chamber at pressures around 10 -9 mbar. The spacer was mica with a thickness of 50 μm. A metallized fine-meshed nitride grid (or a metallized Si-grid) was used as anode. A current of about 1 μA at a voltage of 1250 V (1750 V) was measured. An onset field of about 12.5 MV/m (20 MV/m) and field enhancement factors in the range of 200 to 500 (150 to 300) were found. The investigation with the fine-meshed grid showed an expected pronounced saturation region. KW - field emission KW - GaN KW - LED Y1 - 2016 U6 - https://doi.org/10.1109/IVNC.2016.7551477 SN - 2380-6311 SP - 87 EP - 88 PB - IEEE ER - TY - CHAP A1 - Ławrowski, Robert Damian A1 - Langer, Christoph A1 - Prommesberger, Christian A1 - Dams, Florian A1 - Bachmann, Michael A1 - Schreiner, Rupert T1 - Fabrication and simulation of silicon structures with high aspect ratio for field emission devices T2 - 2014 27th International Vacuum Nanoelectronics Conference (IVNC), 6-10 July 2014, Engelberg, Switzerland N2 - To obtain higher field enhancement factors of Si-tip structures, we present an improved fabrication process utilizing reactive-ion etching (RIE) with an inductively coupled plasma (ICP). In our design, a pillar under the tips is realized by a combination of RIE with ICP. With adjusted power settings (≈ 240 W) and step times (<; 5 s), vertical slopes with a low roughness of approximately 10 nm to 20 nm are possible. The remaining silicon is oxidized thermally to sharpen the emitters. A final tip radius of R <; 20 nm is obtained for the tips of the emitters. The pillar height HP can be mainly adjusted by the duration of the ICP-etching step. A total emitter height of H ≈ 6 μm with a pillar height of HP ≈ 5 μm is achieved. Simulations with COMSOL Multiphysics® are applied to calculate the field enhancement factor β. A two-dimensional model is used in rotational symmetry. In addition to the previous model, a pillar with a varying diameter ØP and height HP is added. A conventional emitter (H = 1 μm and R = 20 nm) placed on a pillar of the height HP ≈ 5 μm approximately results in a three times higher β-factor (β≈ 105). By decreasing the diameter ØP a slight increase of the β-factor is observed. However, the aspect ratio of the emitter mainly influences on the β-factor. KW - Anodes KW - CATHODES KW - FABRICATION KW - field emission KW - field emitter array KW - field enhancement factor KW - Iterative closest point algorithm KW - Lead KW - silicon tips Y1 - 2014 U6 - https://doi.org/10.1109/IVNC.2014.6894805 SP - 193 EP - 194 PB - IEEE ER - TY - CHAP A1 - Ławrowski, Robert Damian A1 - Hausladen, Matthias A1 - Schreiner, Rupert T1 - Individually Addressable Fully Integrated Field Emission Electron Source Fabricated by Laser Micromachining of Silicon T2 - 33rd International Vacuum Nanoelectronics Conference (IVNC): 6-10 July 2020, Lyon N2 - A cathode with individually addressable Si tips allows the observation of the activation procedure and emission behaviour of each field emission emitter at any time of the measurement. The cathode consists of an array of 2x2 conically shaped emitter structures, which were fabricated by laser micromachining and wet etching of a Si substrate bonded on a glass carrier. Using the same process, a Si extractions grid was fabricated and mounted onto the emitter. Integral field emission measurements were performed in a diode configuration in a vacuum chamber at pressures of about 10- 9 mbar. The emitters show an onset voltage between 200 V and 300 V. The emission current for each emitter on the cathode was regulated to a given value (1.0 μA, 2.5μA, 5.0μA) by an external regulating circuit and was recorded individually during the measurement. With such approach, the relation between the emission behaviour and the geometry of emitters can be studied in detail. In addition, the current stabilization of each emitters of an array can be investigated, which led to a current stability of better than 0.5%. Y1 - 2020 SN - 978-1-7281-9454-7 U6 - https://doi.org/10.1109/IVNC49440.2020.9203470 SP - 1 EP - 2 PB - IEEE ER -