TY - CHAP A1 - Asgharzade, Ali A1 - Bartl, Mathias A1 - Hausladen, Matthias A1 - Chen, Yang A1 - Buchner, Philipp A1 - Edler, Simon A1 - Bachmann, Michael A1 - She, Juncong A1 - Schreiner, Rupert T1 - Investigation on the influence of internal voltage drops on the emission behavior of silicon field emission arrays using CMOS image sensor T2 - 38th International Vacuum Nanoelectronics Conference (IVNC) N2 - In this paper we report on an improved measurement and analysis method for determining the emission current distribution of field emitter arrays with CMOS sensors. It can also be used for field emission arrays where not all surfaces of the emitters are at the same electrical potential (e.g. for p-doped Si tips, where a strong current saturation occurs). To demonstrate the functionality of this method, a n-doped field emission array was measured using a variable external series resistance. Brightness variations in emission spots were analyzed to re-calculate the known series resistances for comparison. The re-calculated value is in good agreement with the actual value of the resistance. This method offers a quantitative approach to assess internal voltage drop effects on field emission using optical readout KW - field emission imaging KW - field emission KW - CMOS sensor Y1 - 2025 U6 - https://doi.org/10.1109/IVNC65669.2025.11120937 PB - IEEE ER - TY - CHAP A1 - Schels, Andreas A1 - Herdl, Florian A1 - Hausladen, Matthias A1 - Wohlfartsstätter, Dominik A1 - Bachmann, Michael A1 - Edler, Simon A1 - Düsberg, Felix A1 - Pahlke, Andreas A1 - Buchner, Philipp A1 - Schreiner, Rupert A1 - Hansch, Walter T1 - Beta Factor Mapping of Individual Emitting Tips During Integral Operation of Field Emission Arrays T2 - 2023 IEEE 36th International Vacuum Nanoelectronics Conference (IVNC), 10-13 July 2023, Cambridge, MA, USA N2 - Emission uniformity mappings of field emitter arrays provide important insight into degradation mechanisms, but are often laborious, non-integral, costly, or not quantifiable. Here, a low-cost Raspberry Pi HQ camera is used as an extraction anode to quantify the emission distribution in field emitter arrays. A verification measurement using controlled SEM electron beams proves, that current-voltage characteristics of individual emission sites can be determined by combining the integral electrical data with the image data. The characteristics are used to quantify the field enhancement factors of an 30x30 silicon field emitter array during integral operation. Comparison of the field enhancement factor distributions before and after a one-hour constant current operation at 1 µA shows an increase from 50 actively emitting tips before to 156 after the measurement. It is shown, that the distribution of field enhancement factors shifts towards lower values, due to the increasing degradation for high field enhancement tips, especially above 1500. KW - field emission KW - field emission imaging KW - field emission distribution KW - field enhancement factor KW - CMOS imaging KW - beta factor Y1 - 2023 SN - 979-8-3503-0143-4 U6 - https://doi.org/10.1109/IVNC57695.2023.10188957 SP - 224 EP - 226 PB - IEEE ER - TY - CHAP A1 - Dams, Florian A1 - Prommesberger, Christian A1 - Schreiner, Rupert T1 - Fabrication process of silicon-tip-arrays for field emission applications T2 - 24th International Vacuum Nanoelectronics Conference (IVNC), 2011 : 18 - 22 July 2011, Historische Stadthalle Wuppertal, Germany N2 - A micromachined process to assemble homogeneous and reproducible tip arrays for field emission applications is developed and characterized. As substrate material p- as well as n-doped silicon is used. Lateral position of the tips is defined by structuring silicon dioxide to discs in a photolithographic process. Vertical structure of the tips is defined by a combination of RIE dry etching with controlled anisotropy and thermally oxidization of silicon in order to sharpen the tips. Hence field emitter arrays (FEAs) can be assembled both as bare and coated cathodes. To assemble field emission diodes, this fabrication process allows placing a metal anode in a micrometer order distance to the tips by a self-aligning procedure. The anode is placed in an evaporation process whereupon sharpening oxide is used as isolator between anode and cathode. Electrical characterization of the cathodes showed very good homogeneity, well alignment and stability over time of emission current from all tips (i.e. 100% efficiency). KW - elemental semiconductors KW - etching KW - fabrication KW - field emission KW - field emitter arrays KW - homogeneity KW - micromachining KW - oxidation, silicon KW - silicon technology Y1 - 2011 UR - https://ieeexplore.ieee.org/document/6004556?arnumber=6004556 SN - 978-3-00-035081-8 SN - 978-1-4577-1243-2 SN - 2380-6311 SN - 2164-2370 SP - 49 EP - 50 PB - IEEE ER - TY - CHAP A1 - Navitski, Aliaksandr A1 - Serbun, Pavel A1 - Müller, Günter A1 - Schreiner, Rupert A1 - Dams, Florian T1 - Efficient and reliable field emission from silicon tip arrays for miniaturized electron sources T2 - 2011 24th International Vacuum Nanoelectronics Conference ; 18-22 July 2011 Wuppertal N2 - Silicon-based cathodes with precisely aligned field emitter arrays (FEA) applicable for miniaturized electron sources were successfully developed and fabricated. The cathode chips contain about 3×105 Si tips/cm2 in a triangular array with a tip height of 2.5 μm, tip radius of 20 nm, and lateral distance between tips of 20 μm. Amazingly homogeneous and well-aligned field emission (FE) from all tips (i.e. 100% efficiency) and maximum stable currents of typically 0.1 μA for p- and 0.6 μA for n-type Si were reproducibly achieved. Current-voltage characteristics of p-type Si tips exhibit the expected saturation at around 10 nA due to limited supply of electrons from a depletion layer, while the n-type Si tips show the usual FN behaviour. Additional coating of the Si tips with a 10 nm Au layer resulted in at least 5 times higher average FE current levels i.e. typically 3 μA but lead, however, to a 30% increase of the onset voltage. KW - cathodes KW - coatings KW - elemental semiconductors KW - field emission KW - field emitter arrays KW - miniaturized electron sources KW - silicon tips KW - structured cold cathode Y1 - 2011 UR - https://ieeexplore.ieee.org/document/6004567?arnumber=6004567 SN - 978-3-00-035081-8 SN - 978-1-4577-1243-2 SN - 2380-6311 SN - 2164-2370 SP - 71 EP - 72 PB - IEEE CY - Piscataway, NJ ER - TY - CHAP A1 - Langer, Christoph A1 - Ławrowski, Robert Damian A1 - Prommesberger, Christian A1 - Dams, Florian A1 - Serbun, Pavel A1 - Bachmann, Michael A1 - Müller, Günter A1 - Schreiner, Rupert T1 - High aspect ratio silicon tip cathodes for application in field emission electron sources T2 - 2014 27th International Vacuum Nanoelectronics Conference (IVNC), 6-10 July 2014, Engelberg, Switzerland N2 - Precisely aligned arrays of sharp tip structures on top of elongated pillars were realized by using an improved fabrication process including an additional inductively-coupled-plasma reactive-ion etching step. Arrays of n-type and p-type silicon with 271 tips have been fabricated and investigated. Those structures have a total height of 5–6 µm and apex radii less than 20nm. Integral field emission measurements of the arrays yielded low onset-fields in the range of 8–12V=µm and field enhancement factors between 300 and 700. The I-E curves of n-type structures showed the usual Fowler-Nordheim behaviour, whereas p-type structures revealed a significant saturation region due to the limited number of electrons in the conduction band and a further carrier depletion effect caused by the pillar. The maximum integral current in the saturation region was 150 nA at fields above 30V=µm. An excellent stability of the emission current of less than ± 2% fluctuation was observed in the saturation region. For n-type Si a maximum integral current of 10 µA at 24V=µm and an average current stability with a fluctuation of ± 50% were measured. KW - Current measurement KW - Etching KW - FABRICATION KW - field emission KW - field emitter array KW - GEOMETRY KW - Iron KW - Sensor arrays KW - silicon KW - silicon tip Y1 - 2014 U6 - https://doi.org/10.1109/IVNC.2014.6894824 SP - 222 EP - 223 PB - IEEE ER - TY - CHAP A1 - Prommesberger, Christian A1 - Langer, Christoph A1 - Ławrowski, Robert Damian A1 - Dams, Florian A1 - Schreiner, Rupert A1 - Ławrowski, Robert Damian T1 - Gated p-Si field emitter arrays for sensor applications T2 - 2015 28th International Vacuum Nanoelectronics Conference (IVNC) N2 - We report on gated p-type Si-tip array cathodes for implementation into field emission electron sources for sensor applications. Arrays of 16 and 100 tips with tip heights of 3 μm and tip radii below 30 nm with integrated gate electrodes concentrically positioned 2 μm below the tip apexes were fabricated using an improved process, which leads to an enhanced isolation layer quality with sufficient breakdown field strengths and low leakage currents. Integral measurements with a fixed grid potential of 400 V showed emission currents up to 35 μA for 100 tips at a cathode voltage of 150 V and an almost negligible parasitic gate current. The array with 16 p-type Si-tips showed a significant stabilization of the emission current in the range of 0.3 - 0.4 μA, for cathode voltages between 90 V and 150 V. The current fluctuation in this saturation regime was measured for 10 minutes and a value of less than ± 1% was observed. No degradation of the cathode was found after 6 hours of operation at a constant cathode voltage of 100 V and a constant grid voltage of 400 V. KW - CATHODES KW - Current measurement KW - Current stabilization KW - field emission KW - integrated gate-electrode KW - Iron KW - Logic gates KW - semiconductor KW - Semiconductor device measurement KW - silicon KW - silicon tip array Y1 - 2015 U6 - https://doi.org/10.1109/IVNC.2015.7225567 SP - 164 EP - 165 PB - IEEE ER - TY - CHAP A1 - Ławrowski, Robert Damian A1 - Langer, Christoph A1 - Prommesberger, Christian A1 - Dams, Florian A1 - Bachmann, Michael A1 - Schreiner, Rupert T1 - Fabrication and simulation of silicon structures with high aspect ratio for field emission devices T2 - 2014 27th International Vacuum Nanoelectronics Conference (IVNC), 6-10 July 2014, Engelberg, Switzerland N2 - To obtain higher field enhancement factors of Si-tip structures, we present an improved fabrication process utilizing reactive-ion etching (RIE) with an inductively coupled plasma (ICP). In our design, a pillar under the tips is realized by a combination of RIE with ICP. With adjusted power settings (≈ 240 W) and step times (<; 5 s), vertical slopes with a low roughness of approximately 10 nm to 20 nm are possible. The remaining silicon is oxidized thermally to sharpen the emitters. A final tip radius of R <; 20 nm is obtained for the tips of the emitters. The pillar height HP can be mainly adjusted by the duration of the ICP-etching step. A total emitter height of H ≈ 6 μm with a pillar height of HP ≈ 5 μm is achieved. Simulations with COMSOL Multiphysics® are applied to calculate the field enhancement factor β. A two-dimensional model is used in rotational symmetry. In addition to the previous model, a pillar with a varying diameter ØP and height HP is added. A conventional emitter (H = 1 μm and R = 20 nm) placed on a pillar of the height HP ≈ 5 μm approximately results in a three times higher β-factor (β≈ 105). By decreasing the diameter ØP a slight increase of the β-factor is observed. However, the aspect ratio of the emitter mainly influences on the β-factor. KW - Anodes KW - CATHODES KW - FABRICATION KW - field emission KW - field emitter array KW - field enhancement factor KW - Iterative closest point algorithm KW - Lead KW - silicon tips Y1 - 2014 U6 - https://doi.org/10.1109/IVNC.2014.6894805 SP - 193 EP - 194 PB - IEEE ER - TY - CHAP A1 - Ławrowski, Robert Damian A1 - Langer, Christoph A1 - Prommesberger, Christian A1 - Schreiner, Rupert A1 - Mingels, Stephan A1 - Porshyn, Vitali A1 - Serbun, Pavel A1 - Müller, Günter T1 - Field emission from surface textured GaN with buried double-heterostructures T2 - 2015 28th International Vacuum Nanoelectronics Conference (IVNC), 13-17 July 2015, Guangzhou, China N2 - In this contribution we report on field emission (FE) cathodes based on thin-film LED-technology and surface texturing. The FE cathode can be used both as an n-GaN cathode with an electrical contact at the top side metallization as well as a pn-GaN diode contacting only the p-GaN layer at the bottom side of the structure. The local and integral FE properties of the textured surface of the LED structure were investigated. For n-GaN an integral emission current up to 1.0 μA at an electric field of 19 V/μm was achieved. The pn-GaN diode measurements showed an integral current saturation behavior with two orders of magnitude lower FE currents. Regulated voltage scans obtained by FE scanning microscopy revealed a well-distributed emission over the whole cathode area. Measurements under pulsed tunable laser illumination and moderate electric fields indicated charge carrier generation in the buried double-heterostructures at photon energies below 3.5 eV besides normal photoemission above 4.1 eV. KW - CATHODES KW - Current measurement KW - Electric fields KW - field emission KW - Gallium nitride KW - GaN KW - Iron KW - Light emitting diodes KW - photoemission KW - Surface texture Y1 - 2015 U6 - https://doi.org/10.1109/IVNC.2015.7225548 SP - 106 EP - 107 PB - IEEE ER - TY - CHAP A1 - Langer, Christoph A1 - Prommesberger, Christian A1 - Ławrowski, Robert Damian A1 - Müller, F. A1 - Schreiner, Rupert A1 - Serbun, Pavel A1 - Müller, Günter T1 - Enhanced field emission from p-doped black silicon on pillar structures T2 - 2015 28th International Vacuum Nanoelectronics Conference (IVNC), 13-17 July 2015, Guangzhou, China N2 - Aligned square arrays of black silicon (b-Si) on top of pillars were fabricated on p-type silicon substrate by a deep-etching step combined with a b-Si process. Two 10×10 arrays with pillar heights of 8 μm and 20 μm and one b-Si reference sample without pillars were investigated. Integral field emission (FE) measurements of the arrays yielded rather low onset-fields between 6.4 V/μm and 13.5 V/μm and field enhancement factors between 430 and 800. The I-V curves showed typical Fowler-Nordheim behavior for low fields, whereas a saturation region was observed at higher fields. The maximum integral current in the saturation region was 8 μA at a field of 20 V/μm. The stability of the emission current was investigated over 3 hours and revealed moderate fluctuations of ± 8% in the saturation region. Voltage scans showed well-aligned FE from nearly all pillars. KW - black silicon KW - CATHODES KW - Current measurement KW - Etching KW - FABRICATION KW - field emission KW - field emitter array KW - Iron KW - silicon KW - Vacuum technology Y1 - 2015 U6 - https://doi.org/10.1109/IVNC.2015.7225547 SP - 104 EP - 105 PB - IEEE ER - TY - CHAP A1 - Prommesberger, Christian A1 - Langer, Christoph A1 - Ławrowski, Robert Damian A1 - Muller, F. A1 - Dams, Florian A1 - Schreiner, Rupert A1 - Serbun, Pavel A1 - Müller, Günter T1 - Comparison of integral and local field-emission properties of Mo-coated p-Si tip arrays T2 - 2015 28th International Vacuum Nanoelectronics Conference (IVNC), 13-17 July 2015, Guangzhou, China N2 - Silicon tip arrays were fabricated by means of reactive ion etching followed by oxidation for final sharpening and molybdenum thin film coating. The field-emission (FE) properties of these Mo-coated p-Si tip arrays were systemically investigated by different measurement techniques. Integral measurements in diode configuration yielded a turn-on field (for 1 nA) of 22 V/μm and nearly stable FE currents up to 6.6 μA at 38 V/μm. The effective field enhancements factor extracted from the FN plots is about 180. Detailed investigations of these FE arrays were also performed by means of field emission scanning microscopy combined with electron microscopy. A rather limited efficiency of the tips (50% at 1500 V) and FE homogeneity (180 nA at 700 V) might be correlated with the varying morphology of the tips and the presence of oxides. Local I-V measurements of selected single tips revealed both activation and deactivation effects, which finally resulted in nearly reproducible I-V curves. Current stability measurements at a constant voltage showed rather large fluctuations (0.1-1 μA) of the FE current, which could be reduced up to 1.7% by using of a PID-regulated voltage source. SEM images showed unchanged tip shape after the current processing. KW - CATHODES KW - Coatings KW - Current measurement KW - field emission KW - Iron KW - Mo-coated KW - p-Si tip KW - Scanning electron microscopy KW - silicon KW - tip arrays KW - Vacuum technology Y1 - 2015 U6 - https://doi.org/10.1109/IVNC.2015.7225579 SP - 192 EP - 193 PB - IEEE ER - TY - CHAP A1 - Kleshch, Victor I. A1 - Serbun, Pavel A1 - Orekhov, Anton A1 - Lützenkirchen-Hecht, Dirk A1 - Obraztsov, Alexander N. A1 - Prommesberger, Christian A1 - Langer, Christoph A1 - Schreiner, Rupert A1 - Lutzenkirchen-Hecht, Dirk T1 - Field emission properties of p-type silicon tips decorated with tungsten nanoparticles T2 - 2017 30th International Vacuum Nanoelectronics Conference (IVNC), 10-14 July 2017, Regensburg, Germany N2 - An array of conical-shaped p-type silicon tips was fabricated by using reactive ion etching and sharpening oxidation. The apex of each tip was decorated by a tungsten hemispherical nanoparticle. Field emission properties of the tips were measured by a tungsten-needle anode positioned above the tip apex. Tips decorated with tungsten nanoparticles demonstrated a smaller saturation region in current-voltage characteristics compared to the pristine tips. An emission activation process, which consisted in sudden current increase at certain value of applied voltage, was observed for the decorated silicon tips. This behavior was explained by the formation of vertical protrusions extending from the metal particles revealed by scanning electron microscopy after field emission experiments. KW - Current measurement KW - field emission KW - Ions KW - Iron KW - metal nanoparticles KW - nanoparticles KW - p-type silicon KW - Scanning electron microscopy KW - silicon KW - Tungsten Y1 - 2017 U6 - https://doi.org/10.1109/IVNC.2017.8051580 SP - 138 EP - 139 PB - IEEE ER - TY - JOUR A1 - Schreiner, Rupert A1 - Langer, Christoph A1 - Prommesberger, Christian A1 - Dams, Florian T1 - Compact and Energy-Efficient Field Emission Cathodes for Sensor Applications JF - Advanced Materials Research N2 - We report on miniaturized silicon field emitter arrays for the application in compact and energy-saving vacuum-microelectronic devices, e.g. sensors or x-ray tubes. Since standard silicon semiconductor technology has been used for the fabrication, they may be easily integrated with other silicon based circuits and devices on the same chip. The silicon tip geometry and the operating conditions were optimized in order to obtain highly uniform and stable electron field emission from large area cathode arrays. A series of uniform hexagonal tip arrays containing each 547 tips were fabricated and characterized. The electron emission properties of both individual tips as well as of complete emitter arrays were investigated. A saturation level in the voltage-current characteristics was found, which can be explained by the limitation of the supply of electrons due to the p-type silicon wafer material. When operating the arrays in the current saturation regime at an emission current of ~ 1 nA per tip, a highly stable and low noise emission can be observed. KW - field emission KW - Si-Tip Cathodes KW - Vacuum Sensors Y1 - 2014 U6 - https://doi.org/10.4028/www.scientific.net/amr.1024.372 VL - 1024 SP - 372 EP - 375 PB - Scientific.net ER - TY - CHAP A1 - Bieker, Johannes A1 - Roustaie, Farough A1 - Schlaak, Helmut F. A1 - Langer, Christoph A1 - Schreiner, Rupert T1 - Field emission characterization of in-situ deposited metallic nanocones T2 - 2017 30th International Vacuum Nanoelectronics Conference (IVNC), 10-14 July 2017, Regensburg, Germany N2 - An in-situ fabrication technique based on ion track etched template electrodeposition of metallic nanocones was used for the production of field emitter cathodes. Gold nanocones with a height of 24 microns, a base diameter between 3 to 4 microns and a tip diameter below 300 nanometers were deposited on a circular electrode with a diameter of 2.5 mm. The integral field emission (FE) measurements of samples with cone densities of 6 · 104 cones/cm2 (sample A) and 1 · 106 cones/cm2 (sample B) yielded in a maximum current of 37.5 μA at an applied field of 12.5 V/μm for sample A and 29.1 μA at 9.4 V/μm for sample B. The stability of emission current was investigated for over 48 hours and no degradation was observed. KW - CATHODES KW - Current measurement KW - FABRICATION KW - field emission KW - ion track template KW - Ions KW - Iron KW - nanocones KW - Vacuum technology KW - Voltage measurement Y1 - 2017 U6 - https://doi.org/10.1109/IVNC.2017.8051571 SP - 120 EP - 121 PB - IEEE ER - TY - CHAP A1 - Knapp, Wolfram A1 - Langer, Christoph A1 - Prommesberger, Christian A1 - Lindner, Matthias A1 - Schreiner, Rupert T1 - Investigations of the transition from field electron emission to stable plasma discharge in a micro electron source at vacuum pressure T2 - 2017 30th International Vacuum Nanoelectronics Conference (IVNC), 10-14 July 2017, Regensburg, Germany N2 - We report on the transition from field electron emission to plasma discharges. During an experiment with a miniaturized field emission electron source a plasma discharge accompanied by a luminous effect was observed. A novel graphical evaluation method was used to interpret and to compare the observed phenomenon. KW - CATHODES KW - Discharges (electric) KW - electron source KW - electron sources KW - Fault location KW - field emission KW - field emission measurement KW - glow discharge KW - Glow discharges KW - micro arc KW - plasma discharge KW - Plasmas KW - Si-tip cathode Y1 - 2017 U6 - https://doi.org/10.1109/IVNC.2017.8051594 SP - 166 EP - 167 PB - IEEE ER - TY - CHAP A1 - Serbun, Pavel A1 - Porshyn, Vitali A1 - Müller, Günter A1 - Mingels, Stephan A1 - Lützenkirchen-Hecht, Dirk A1 - Bachmann, Michael A1 - Düsberg, Felix A1 - Dams, Florian A1 - Hofmann, Martin A1 - Pahlke, Andreas A1 - Prommesberger, Christian A1 - Langer, Christoph A1 - Ławrowski, Robert Damian A1 - Schreiner, Rupert T1 - Field emission behavior of Au-tip-coated p-type Si pillar structures T2 - 29th International Vacuum Nanoelectronics Conference (IVNC), 2016, 11-15 July, Vancouver, BC, Canada N2 - Precisely aligned high-aspect-ratio (HAR) silicon tip arrays were fabricated using enhanced reactive ion etching with an inductively-coupled-plasma followed by a sharpening oxidation. A gold thin film was then sputtered only on the tips of the HAR structures. Field-emission (FE) properties from Au-coated HAR p-Si tip array cathodes have been systematically investigated by means of field emission scanning microscopy (FESM). A rather high efficiency of the HAR Si structures (71% at 550 V), but limited homogeneous FE with currents of 1-600 nA might be correlated with the varying geometry of the tips and the presence of oxides. I-V measurements of single Au-coated HAR emitters revealed activation effects and the saturation current region at 3 nA. An increase of the saturation current by 4 orders of magnitude was observed during 20 hours of conditioning at constant voltage, which finally resulted in nearly reproducible FN curves with a ß-factor of 473. An excellent stability of the emission current of less than 1 % was obtained during the additional long-time conditioning at constant voltage. Optical switching under halogen lamp illumination resulted in at least 2 times higher saturation currents and showed a linear dependence of the FE current on the light color temperature. KW - field emission KW - p-type Si-pillar array KW - surface oxide effects KW - photoemission Y1 - 2016 U6 - https://doi.org/10.1109/IVNC.2016.7551516 SN - 2380-6311 SP - 181 EP - 182 PB - IEEE ER - TY - CHAP A1 - Prommesberger, Christian A1 - Langer, Christoph A1 - Ławrowski, Robert Damian A1 - Schreiner, Rupert T1 - Field emission from black silicon structures with integrated gate electrode T2 - 29th International Vacuum Nanoelectronics Conference (IVNC), 2016, 11-15 July, Vancouver, BC, Canada N2 - Black silicon structures with integrated gate electrode were realized by using an improved fabrication process. An enhanced insulation layer was achieved by a combination of dry and wet oxidation, and a gold layer was evaporated as gate electrode. The black silicon structures were prepared with a RIE/ICP etching process at room temperature. Arrays of 16 and 100 apertures with buried p-doped black silicon whiskers have been fabricated. These structures have an emitter height of approximately 1.5 μm with tip radii between 5 nm and 30 nm. The whiskers are surrounded by the gate electrode in a distance of 1.5 μm. Integral field emission measurements yielded an onset voltage of 92 V for 16 apertures and 60 V for 100 apertures for an emission current of 1 nA. Maximum emission currents up to 0.2 μA were observed for the array with 100 apertures at a cathode voltage of 200 V. Stability measurements showed a current fluctuation of ± 21% at a mean value of the emission current of 12 nA over a period of 30 minutes for 16 apertures with b-Si whiskers. KW - field emission KW - black silicon KW - integrated gate electrode Y1 - 2016 U6 - https://doi.org/10.1109/IVNC.2016.7551532 SN - 2380-6311 SP - 219 EP - 220 PB - IEEE ER -