<?xml version="1.0" encoding="utf-8"?>
<export-example>
  <doc>
    <id>799</id>
    <completedYear/>
    <publishedYear>2014</publishedYear>
    <thesisYearAccepted/>
    <language>deu</language>
    <pageFirst/>
    <pageLast/>
    <pageNumber>80</pageNumber>
    <edition/>
    <issue/>
    <volume/>
    <type>periodicalpart</type>
    <publisherName/>
    <publisherPlace>Regensburg</publisherPlace>
    <creatingCorporation>Ostbayerische Technische Hochschule Regensburg</creatingCorporation>
    <contributingCorporation/>
    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="deu">Forschungsbericht 2013</title>
    <identifier type="urn">urn:nbn:de:bvb:898-opus4-7990</identifier>
    <identifier type="doi">10.35096/othr/pub-799</identifier>
    <author>Josef Beimler</author>
    <author>Caroline Leißl</author>
    <author>Lena Ebner</author>
    <author>Michael Elsner</author>
    <author>Gerhard Mühlbauer</author>
    <author>Dieter Kohlert</author>
    <author>Martin J. W. Schubert</author>
    <author>Andreas P. Weiß</author>
    <author>Michael Sterner</author>
    <author>Thomas Raith</author>
    <author>Martin Afranseder</author>
    <author>Tobias Krapf</author>
    <author>Jürgen Mottok</author>
    <author>Christian Siemers</author>
    <author>Benjamin Großmann</author>
    <author>Johannes Höcherl</author>
    <author>Thomas Schlegl</author>
    <author>Ralph Schneider</author>
    <author>Johannes Milaev</author>
    <author>Christina Rampelt</author>
    <author>Christian Roduner</author>
    <author>Christoph Glowa</author>
    <author>Christoph Bachl</author>
    <author>Claus Schliekmann</author>
    <author>Alfons Gnan</author>
    <author>Martin Grill</author>
    <author>Karl Ruhland</author>
    <author>Thomas Piehler</author>
    <author>Daniel Friers</author>
    <author>Harald Wels</author>
    <author>Kenny Pflug</author>
    <author>Markus Kucera</author>
    <author>Thomas Waas</author>
    <author>Felix Schlachetzki</author>
    <author>Sandra Boy</author>
    <author>Josef Pemmerl</author>
    <author>Alexander Leis</author>
    <author>Andreas F.X. Welsch</author>
    <author>Franz Graf</author>
    <author>Gerhard Zenger</author>
    <author>Klaus Volbert</author>
    <author>Thomas Waas</author>
    <author>Stefanie Scherzinger</author>
    <author>Meike Klettke</author>
    <author>Uta Störl</author>
    <author>C. Heyl</author>
    <author>A. Boldenko</author>
    <author>Gareth J. Monkman</author>
    <author>Richard Kujat</author>
    <author>Ulrich Briem</author>
    <author>Stefan Hierl</author>
    <author>Sebastian Talbot</author>
    <author>Anton Schmailzl</author>
    <author>Robert Damian Ławrowski</author>
    <author>Christian Prommesberger</author>
    <author>Christoph Langer</author>
    <author>Florian Dams</author>
    <author>Rupert Schreiner</author>
    <author>Piergiorgio Valentino</author>
    <author>Marco Romano</author>
    <author>Ingo Ehrlich</author>
    <author>Franco Furgiuele</author>
    <author>Norbert Gebbeken</author>
    <author>Michael Eisenried</author>
    <author>Bastian Jungbauer</author>
    <author>Albert Hutterer</author>
    <author>Michael Bauhuber</author>
    <author>Andreas Mikrievskij</author>
    <author>Monika Argauer</author>
    <author>Helmut Hummel</author>
    <author>Alfred Lechner</author>
    <author>Thomas Liebetruth</author>
    <author>Michael Schumm</author>
    <author>Saskia Joseph</author>
    <author>Michael Reschke</author>
    <author>Alexander Soska</author>
    <author>Irmgard Schroll-Decker</author>
    <author>Michael Putzer</author>
    <author>John Rasmussen</author>
    <author>Sebastian Dendorfer</author>
    <author>Tim Weber</author>
    <author>Amir Andreas Al-Munajjed</author>
    <author>Gijsbertus Jacob Verkerke</author>
    <author>Tobias Renkawitz</author>
    <author>Sonja Haug</author>
    <author>Clarissa Rudolph</author>
    <author>Annika Zeitler</author>
    <author>Simon Schaubeck</author>
    <author>Oliver Steffens</author>
    <author>Christian Rechenauer</author>
    <author>Thekla Schulz-Brize</author>
    <author>Florian Fleischmann</author>
    <author>Wolfgang Kusterle</author>
    <author>Anne Beer</author>
    <author>Bernd Wagner</author>
    <author>Thomas Neidhart</author>
    <series>
      <title>Forschungsberichte der OTH Regensburg</title>
      <number>2013</number>
    </series>
    <collection role="institutes" number="HL">Hochschulleitung/Hochschulverwaltung</collection>
    <collection role="othpublikationsherkunft" number="">Von der OTH Regensburg herausgegeben</collection>
    <collection role="institutes" number="IAFW">Zentrum für Forschung und Transfer (ZFT ab 2024; vorher: IAFW)</collection>
    <collection role="persons" number="sternerfenes">Sterner, Michael (Prof. Dr.) - FENES / Forschungsgruppe Energiespeicher</collection>
    <thesisPublisher>Ostbayerische Technische Hochschule Regensburg</thesisPublisher>
    <file>https://opus4.kobv.de/opus4-oth-regensburg/files/799/Forschungsbericht_2013.pdf</file>
  </doc>
  <doc>
    <id>3699</id>
    <completedYear/>
    <publishedYear>2014</publishedYear>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst>222</pageFirst>
    <pageLast>223</pageLast>
    <pageNumber/>
    <edition/>
    <issue/>
    <volume/>
    <type>conferenceobject</type>
    <publisherName>IEEE</publisherName>
    <publisherPlace/>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">High aspect ratio silicon tip cathodes for application in field emission electron sources</title>
    <abstract language="eng">Precisely aligned arrays of sharp tip structures on top of elongated pillars were realized by using an improved fabrication process including an additional inductively-coupled-plasma reactive-ion etching step. Arrays of n-type and p-type silicon with 271 tips have been fabricated and investigated. Those structures have a total height of 5–6 µm and apex radii less than 20nm. Integral field emission measurements of the arrays yielded low onset-fields in the range of 8–12V=µm and field enhancement factors between 300 and 700. The I-E curves of n-type structures showed the usual Fowler-Nordheim behaviour, whereas p-type structures revealed a significant saturation region due to the limited number of electrons in the conduction band and a further carrier depletion effect caused by the pillar. The maximum integral current in the saturation region was 150 nA at fields above 30V=µm. An excellent stability of the emission current of less than ± 2% fluctuation was observed in the saturation region. For n-type Si a maximum integral current of 10 µA at 24V=µm and an average current stability with a fluctuation of ± 50% were measured.</abstract>
    <parentTitle language="eng">2014 27th International Vacuum Nanoelectronics Conference (IVNC), 6-10 July 2014, Engelberg, Switzerland</parentTitle>
    <identifier type="doi">10.1109/IVNC.2014.6894824</identifier>
    <enrichment key="opus.import.date">2022-04-28T18:45:44+00:00</enrichment>
    <enrichment key="opus.source">sword</enrichment>
    <enrichment key="opus.import.user">importuser</enrichment>
    <enrichment key="BegutachtungStatus">peer-reviewed</enrichment>
    <licence>Keine Lizenz - Es gilt das deutsche Urheberrecht: § 53 UrhG</licence>
    <author>Christoph Langer</author>
    <author>Robert Damian Ławrowski</author>
    <author>Christian Prommesberger</author>
    <author>Florian Dams</author>
    <author>Pavel Serbun</author>
    <author>Michael Bachmann</author>
    <author>Günter Müller</author>
    <author>Rupert Schreiner</author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Current measurement</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Etching</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>FABRICATION</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>field emission</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>field emitter array</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>GEOMETRY</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Iron</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Sensor arrays</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>silicon</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>silicon tip</value>
    </subject>
    <collection role="institutes" number="FakANK">Fakultät Angewandte Natur- und Kulturwissenschaften</collection>
    <collection role="persons" number="schreinerlmconf">Schreiner, Rupert (Prof. Dr.), Konferenzbeiträge - Labor für Mikrosensorik</collection>
    <collection role="othforschungsschwerpunkt" number="16317">Sensorik</collection>
    <collection role="institutes" number="">Labor Mikrosensorik</collection>
  </doc>
  <doc>
    <id>3208</id>
    <completedYear/>
    <publishedYear>2014</publishedYear>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst>48</pageFirst>
    <pageLast>51</pageLast>
    <pageNumber/>
    <edition/>
    <issue/>
    <volume>1024</volume>
    <type>article</type>
    <publisherName/>
    <publisherPlace/>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">Simulation and Fabrication of Silicon Field Emission Cathodes for Cold Electron Sources</title>
    <abstract language="eng">We report on the simulation and fabrication of nanostructured silicon surfaces for field emission (FE) applications, e.g. ionization sensors and x-ray tubes. For the design and optimization of field-emitting silicon structures, the influence of the geometric parameters like tip height, apex radius, aperture angle and curvature shape on the field enhancement factor was investigated by simulation using finite element method. A universal geometric model which describes the real geometry of our silicon structures sufficiently accurate was taken for modeling a variety of different silicon tip structures as well as ridge structures. While a high dependency of the field enhancement on the aspect ratio and the aperture angle was found, the simulations show that the elliptic curvature affects the field enhancement only marginally. Finally, an improved process for fabrication of such silicon structures on n-type as well as p-type substrate is described, using reactive ion etching with adjustable anisotropy, wet thermal oxidation and wet etching.</abstract>
    <parentTitle language="eng">Advanced Materials Research</parentTitle>
    <identifier type="doi">10.4028/www.scientific.net/amr.1024.48</identifier>
    <enrichment key="opus.import.date">2022-03-17T07:14:43+00:00</enrichment>
    <enrichment key="opus.source">sword</enrichment>
    <enrichment key="opus.import.user">importuser</enrichment>
    <enrichment key="BegutachtungStatus">peer-reviewed</enrichment>
    <licence>Keine Lizenz - Es gilt das deutsche Urheberrecht: § 53 UrhG</licence>
    <author>Christoph Langer</author>
    <author>Christian Prommesberger</author>
    <author>Robert Damian Ławrowski</author>
    <author>Florian Dams</author>
    <author>Rupert Schreiner</author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>field emission cathodes</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>field enhancement factor</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>silicon field emitter</value>
    </subject>
    <collection role="institutes" number="FakANK">Fakultät Angewandte Natur- und Kulturwissenschaften</collection>
    <collection role="othforschungsschwerpunkt" number="16316">Produktion und Systeme</collection>
    <collection role="institutes" number="">Labor Mikrosensorik</collection>
  </doc>
  <doc>
    <id>3155</id>
    <completedYear/>
    <publishedYear>2014</publishedYear>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst/>
    <pageLast/>
    <pageNumber/>
    <edition/>
    <issue/>
    <volume>2014</volume>
    <type>article</type>
    <publisherName>Hindawi</publisherName>
    <publisherPlace/>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">Improvement of Homogenity and Aspect Ratio of Silicon Tips for Field Emission by Reactive-Ion Etching</title>
    <abstract language="eng">The homogeneity of emitters is very important for the performance of field emission (FE) devices. Reactive-ion etching (RIE) and oxidation have significant influences on the geometry of silicon tips. The RIE influences mainly the anisotropy of the emitters. Pressure has a strong impact on the anisotropic factor. Reducing the pressure results in a higher anisotropy, but the etch rate is also lower. A longer time of etching compensates this effect. Furthermore an improvement of homogeneity was observed. The impact of uprating is quite low for the anisotropic factor, but significant for the homogeneity. At low power the height and undercut of the emitters are more constant over the whole wafer. The oxidation itself is very homogeneous and has no observable effect on further variation of the homogeneity. This modified fabrication process allows solving the problem of inhomogeneity of previous field emission arrays.</abstract>
    <parentTitle language="eng">Advances in materials science and engineering</parentTitle>
    <identifier type="doi">10.1155/2014/948708</identifier>
    <enrichment key="opus.import.date">2022-03-17T06:33:09+00:00</enrichment>
    <enrichment key="opus.source">sword</enrichment>
    <enrichment key="opus.import.user">importuser</enrichment>
    <enrichment key="BegutachtungStatus">peer-reviewed</enrichment>
    <author>Robert Damian Ławrowski</author>
    <author>Christian Prommesberger</author>
    <author>Christoph Langer</author>
    <author>Florian Dams</author>
    <author>Rupert Schreiner</author>
    <collection role="institutes" number="FakANK">Fakultät Angewandte Natur- und Kulturwissenschaften</collection>
    <collection role="oaweg" number="">Gold Open Access- Erstveröffentlichung in einem/als Open-Access-Medium</collection>
    <collection role="persons" number="schreinerlm">Schreiner, Rupert (Prof. Dr.), Zeitschriftenaufsätze - Labor für Mikrosensorik</collection>
    <collection role="othforschungsschwerpunkt" number="16317">Sensorik</collection>
    <collection role="institutes" number="">Labor Mikrosensorik</collection>
  </doc>
  <doc>
    <id>3732</id>
    <completedYear/>
    <publishedYear>2014</publishedYear>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst>193</pageFirst>
    <pageLast>194</pageLast>
    <pageNumber/>
    <edition/>
    <issue/>
    <volume/>
    <type>conferenceobject</type>
    <publisherName>IEEE</publisherName>
    <publisherPlace/>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">Fabrication and simulation of silicon structures with high aspect ratio for field emission devices</title>
    <abstract language="eng">To obtain higher field enhancement factors of Si-tip structures, we present an improved fabrication process utilizing reactive-ion etching (RIE) with an inductively coupled plasma (ICP). In our design, a pillar under the tips is realized by a combination of RIE with ICP. With adjusted power settings (≈ 240 W) and step times (&lt;; 5 s), vertical slopes with a low roughness of approximately 10 nm to 20 nm are possible. The remaining silicon is oxidized thermally to sharpen the emitters. A final tip radius of R &lt;; 20 nm is obtained for the tips of the emitters. The pillar height HP can be mainly adjusted by the duration of the ICP-etching step. A total emitter height of H ≈ 6 μm with a pillar height of HP ≈ 5 μm is achieved. Simulations with COMSOL Multiphysics® are applied to calculate the field enhancement factor β. A two-dimensional model is used in rotational symmetry. In addition to the previous model, a pillar with a varying diameter ØP and height HP is added. A conventional emitter (H = 1 μm and R = 20 nm) placed on a pillar of the height HP ≈ 5 μm approximately results in a three times higher β-factor (β≈ 105). By decreasing the diameter ØP a slight increase of the β-factor is observed. However, the aspect ratio of the emitter mainly influences on the β-factor.</abstract>
    <parentTitle language="eng">2014 27th International Vacuum Nanoelectronics Conference (IVNC), 6-10 July 2014, Engelberg, Switzerland</parentTitle>
    <identifier type="doi">10.1109/IVNC.2014.6894805</identifier>
    <enrichment key="opus.import.date">2022-04-28T18:57:25+00:00</enrichment>
    <enrichment key="opus.source">sword</enrichment>
    <enrichment key="opus.import.user">importuser</enrichment>
    <enrichment key="BegutachtungStatus">peer-reviewed</enrichment>
    <enrichment key="opus.doi.autoCreate">false</enrichment>
    <enrichment key="opus.urn.autoCreate">false</enrichment>
    <licence>Keine Lizenz - Es gilt das deutsche Urheberrecht: § 53 UrhG</licence>
    <author>Robert Damian Ławrowski</author>
    <author>Christoph Langer</author>
    <author>Christian Prommesberger</author>
    <author>Florian Dams</author>
    <author>Michael Bachmann</author>
    <author>Rupert Schreiner</author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Anodes</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>CATHODES</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>FABRICATION</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>field emission</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>field emitter array</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>field enhancement factor</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Iterative closest point algorithm</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Lead</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>silicon tips</value>
    </subject>
    <collection role="institutes" number="FakANK">Fakultät Angewandte Natur- und Kulturwissenschaften</collection>
    <collection role="persons" number="schreinerlmconf">Schreiner, Rupert (Prof. Dr.), Konferenzbeiträge - Labor für Mikrosensorik</collection>
    <collection role="othforschungsschwerpunkt" number="16317">Sensorik</collection>
  </doc>
  <doc>
    <id>4683</id>
    <completedYear/>
    <publishedYear>2014</publishedYear>
    <thesisYearAccepted/>
    <language>deu</language>
    <pageFirst>36</pageFirst>
    <pageLast>41</pageLast>
    <pageNumber/>
    <edition/>
    <issue/>
    <volume/>
    <type>conferenceobject</type>
    <publisherName/>
    <publisherPlace>Landshut</publisherPlace>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="deu">Realisierung von Siliziumspitzenarrays mit integrierter Gate-Elektrode für Anwendungen in der Vakuumsensorik</title>
    <abstract language="deu">Bei der Feldemission (kalte Emission) können Elektronen durch ein starkes elektrisches Feld eine glatte und leitende Oberfläche verlassen. Die Elektronen tunneln dabei durch eine Potentialbarriere, deren Breite durch ein äußeres elektrisches Feld verkleinert wird. Durch das Hinzufügen einer integrierten Gate-Elektrode um eine Siliziumspitze kann die notwendige Einsatzspannung für Feldemission deutlich gesenkt werden. Zwischen Si-Kathode und Gate-Elektrode befindet sich dabei eine Isolationsschicht, die höchste Anforderungen bezüglich der elektrischen Durchbruchsfestigkeit erfüllen muss. Mit einer Kombination aus Trocken- (Schichtdicke 50 nm) und Feuchtoxid (Schichtdicke 950 nm) konnte eine Isolationsschicht entwickelt werden, die im integrierten Aufbau eine minimale Durchbruchsfeldstärke von 3,2 MV/cm aufweist. Für die Realisierung von Siliziumkathoden mit integrierter Gate-Elektrode wurde ein bereits bestehender Herstellungsprozess um zusätzliche Prozessschritte erweitert. Die Übertragung der lateralen Position der Spitze erfolgt durch Strukturierung des Umkehrlacks AZ5214 und einer RIE-Ätzung der zuvor hergestellten SiO2-Schicht. Nach dem Entfernen der Lackschicht wird die vertikale Struktur der Siliziumspitzen durch einen RIE-Ätzprozess mit den Prozessgasen SF6 und O)2 realisiert. Aus einer thermischen Oxidation bei 940 °C resultiert anschließend die Isolationsschicht zwischen Si-Kathode und Gate-Elektrode . Gleichzeitig wird diese Anschärfeoxidation auch zur Realisierung der endgültigen Spitzengeometrie verwendet. Durch die lithographische Strukturierung des Photolacks AZ5214 kann dabei die Fläche der aufgedampften Gate-Elektrode festgelegt werden. Die Gate-Elektrode wird in einem selbstjustierenden Prozessschritt exakt konzentrisch um die Si-Spitze aufgedampft. Der gerichtete Aufdampfprozess bewirkt eine Abschattung, so dass das Oxidplättchen nicht komplett von Metall ummantelt wird. Die Opferschicht aus Photolack wird mit den nicht benötigten Metallflächen in einem Lift-off-Prozess entfernt.</abstract>
    <parentTitle language="deu">4. Landshuter Symposium Mikrosystemtechnik, Mikrosystemtechnik als Schlüsseltechnologie der Systemintegration, Tagungsband zum Symposium 12./13. März 2014, Hochschule Landshut</parentTitle>
    <identifier type="isbn">978-3-9812696-5-9</identifier>
    <enrichment key="opus.import.date">2022-07-03T14:30:54+00:00</enrichment>
    <enrichment key="opus.source">sword</enrichment>
    <enrichment key="opus.import.user">importuser</enrichment>
    <licence>Keine Lizenz - Es gilt das deutsche Urheberrecht: § 53 UrhG</licence>
    <author>Christian Prommesberger</author>
    <author>Robert Damian Ławrowski</author>
    <author>Christoph Langer</author>
    <author>Florian Dams</author>
    <author>Rupert Schreiner</author>
    <subject>
      <language>deu</language>
      <type>uncontrolled</type>
      <value>elektrischer Durchbruch</value>
    </subject>
    <subject>
      <language>deu</language>
      <type>uncontrolled</type>
      <value>Feldelektronenemission</value>
    </subject>
    <subject>
      <language>deu</language>
      <type>uncontrolled</type>
      <value>Halbleiterschicht</value>
    </subject>
    <subject>
      <language>deu</language>
      <type>uncontrolled</type>
      <value>Isolierschicht</value>
    </subject>
    <subject>
      <language>deu</language>
      <type>uncontrolled</type>
      <value>Kathode</value>
    </subject>
    <subject>
      <language>deu</language>
      <type>uncontrolled</type>
      <value>Silicium</value>
    </subject>
    <subject>
      <language>deu</language>
      <type>uncontrolled</type>
      <value>Vakuumsensor</value>
    </subject>
    <collection role="ddc" number="621">Angewandte Physik</collection>
    <collection role="institutes" number="FakANK">Fakultät Angewandte Natur- und Kulturwissenschaften</collection>
    <collection role="persons" number="schreinerlmconf">Schreiner, Rupert (Prof. Dr.), Konferenzbeiträge - Labor für Mikrosensorik</collection>
    <collection role="othforschungsschwerpunkt" number="16317">Sensorik</collection>
    <collection role="institutes" number="">Labor Mikrosensorik</collection>
  </doc>
  <doc>
    <id>4682</id>
    <completedYear/>
    <publishedYear>2014</publishedYear>
    <thesisYearAccepted/>
    <language>deu</language>
    <pageFirst>28</pageFirst>
    <pageLast>35</pageLast>
    <pageNumber/>
    <edition/>
    <issue/>
    <volume/>
    <type>conferenceobject</type>
    <publisherName>Cluster Mikrosystemtechnik</publisherName>
    <publisherPlace>Landshut</publisherPlace>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="deu">Spitzen- und Kantenemitter aus Silizium mit einem hohen Aspektverhältnis für Ionisationsgassensoren</title>
    <abstract language="deu">Durch die Optimierung von reaktivem Ionenätzen mit induktiv gekoppeltem Plasma ist die Herstellung von verschiedenen Siliziumkathoden mit hoher Anisotropie und hohem Aspektverhältnis für Feldemissionsanwendungen möglich. Simulationen mit COMSOL Multiphysics untermauern das Potential von solchen Spitzen- und Kantenfeldemittern. Die Ergebnisse der Simulation zeigen einen zwei- bis sechsfach höheren Feldüberhöhungsfaktor der tiefgeätzten Strukturen im Vergleich zu identischen Emittern ohne zusätzliche Tiefenätzung. Feldemissionsmessungen bestätigen die Simulationsergebnisse. Der modifizierte Herstellungsprozess der Feldemitter ermöglicht somit einen zuverlässigen Betrieb von Feldemissionselektronenquellen bei kleineren makroskopischen Feldstärken. Außerdem weisen die Messungen des Emissionsstroms im Sättigungsbereich eine weitgehende Unabhängigkeit vom elektrischen Feld auf. Lokale Feldemissionsmessungen ergeben dadurch eine deutliche Stromstabilisierung, welche über große Feldstärkenbereiche konstant bleibt. Die Nutzung der HAR-Emitter (high aspect ratio) ist damit eine gute Voraussetzung für einen zuverlässigen Betrieb der Emissionskathoden bei kleinen Feldstärken für die Anwendung in Ionisationsgassensoren.</abstract>
    <parentTitle language="deu">Mikrosystemtechnik als Schlüsseltechnologie der Systemintegration : 4. Landshuter Symposium Mikrosystemtechnik ; Tagungsband zum Symposium ; 12./13. März 2014, Hochschule Landshut</parentTitle>
    <identifier type="isbn">978-3-9812696-5-9</identifier>
    <enrichment key="opus.import.date">2022-07-03T14:30:54+00:00</enrichment>
    <enrichment key="opus.source">sword</enrichment>
    <enrichment key="opus.import.user">importuser</enrichment>
    <enrichment key="OtherSeries">Tagungsbände / Landshuter Symposium Mikrosystemtechnik ; 4</enrichment>
    <licence>Keine Lizenz - Es gilt das deutsche Urheberrecht: § 53 UrhG</licence>
    <author>Robert Damian Ławrowski</author>
    <author>Christoph Langer</author>
    <author>Christian Prommesberger</author>
    <author>Florian Dams</author>
    <author>Pavel Serbun</author>
    <author>Günter Müller</author>
    <author>Rupert Schreiner</author>
    <subject>
      <language>deu</language>
      <type>uncontrolled</type>
      <value>Emitter</value>
    </subject>
    <subject>
      <language>deu</language>
      <type>uncontrolled</type>
      <value>Feldelektronenemission</value>
    </subject>
    <subject>
      <language>deu</language>
      <type>uncontrolled</type>
      <value>Gassensor</value>
    </subject>
    <subject>
      <language>deu</language>
      <type>uncontrolled</type>
      <value>Herstellung</value>
    </subject>
    <subject>
      <language>deu</language>
      <type>uncontrolled</type>
      <value>Ionenemission</value>
    </subject>
    <subject>
      <language>deu</language>
      <type>uncontrolled</type>
      <value>Silicium</value>
    </subject>
    <collection role="ddc" number="621">Angewandte Physik</collection>
    <collection role="institutes" number="FakANK">Fakultät Angewandte Natur- und Kulturwissenschaften</collection>
    <collection role="persons" number="schreinerlmconf">Schreiner, Rupert (Prof. Dr.), Konferenzbeiträge - Labor für Mikrosensorik</collection>
    <collection role="othforschungsschwerpunkt" number="16317">Sensorik</collection>
    <collection role="institutes" number="">Labor Mikrosensorik</collection>
  </doc>
  <doc>
    <id>5323</id>
    <completedYear/>
    <publishedYear>2014</publishedYear>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst>1</pageFirst>
    <pageLast>6</pageLast>
    <pageNumber/>
    <edition/>
    <issue/>
    <volume>2014</volume>
    <type>article</type>
    <publisherName>Hindawi</publisherName>
    <publisherPlace/>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>--</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">Improvement of Homogeneity and Aspect Ratio of Silicon Tips for Field Emission by Reactive-Ion Etching</title>
    <abstract language="eng">The homogeneity of emitters is very important for the performance of field emission (FE) devices. Reactive-ion etching (RIE) and oxidation have significant influences on the geometry of silicon tips. The RIE influences mainly the anisotropy of the emitters. Pressure has a strong impact on the anisotropic factor. Reducing the pressure results in a higher anisotropy, but the etch rate is also lower. A longer time of etching compensates this effect. Furthermore an improvement of homogeneity was observed. The impact of uprating is quite low for the anisotropic factor, but significant for the homogeneity. At low power the height and undercut of the emitters are more constant over the whole wafer. The oxidation itself is very homogeneous and has no observable effect on further variation of the homogeneity. This modified fabrication process allows solving the problem of inhomogeneity of previous field emission arrays.</abstract>
    <parentTitle language="eng">Advances in Materials Science and Engineering. Special issue: Advances in Smart Materials and Applications</parentTitle>
    <identifier type="doi">10.1155/2014/948708</identifier>
    <identifier type="issn">1687-8442</identifier>
    <identifier type="issn">1687-8434</identifier>
    <enrichment key="opus.import.date">2022-08-24T10:21:08+00:00</enrichment>
    <enrichment key="opus.source">sword</enrichment>
    <enrichment key="opus.import.user">importuser</enrichment>
    <enrichment key="BegutachtungStatus">peer-reviewed</enrichment>
    <author>Robert Damian Ławrowski</author>
    <author>Christian Prommesberger</author>
    <author>Christoph Langer</author>
    <author>Florian Dams</author>
    <author>Rupert Schreiner</author>
    <collection role="institutes" number="FakANK">Fakultät Angewandte Natur- und Kulturwissenschaften</collection>
    <collection role="persons" number="schreinerlm">Schreiner, Rupert (Prof. Dr.), Zeitschriftenaufsätze - Labor für Mikrosensorik</collection>
    <collection role="othforschungsschwerpunkt" number="16316">Produktion und Systeme</collection>
    <collection role="institutes" number="">Labor Mikrosensorik</collection>
  </doc>
</export-example>
