@inproceedings{HollerHauslerRothetal., author = {Holler, Sven and Hausler, Peter and Roth, Carina and Bierl, Rudolf}, title = {Gestapelte Au-Al-Au und Au-Ag-Au Schichten als aktive Schichten f{\"u}r die Oberfl{\"a}chenplasmonenresonanzspektroskopie}, series = {5. Landshuter Symposium Mikrosystemtechnik, M{\"a}rz 2016}, booktitle = {5. Landshuter Symposium Mikrosystemtechnik, M{\"a}rz 2016}, publisher = {Fachhochschule Landshut}, address = {Landshut}, isbn = {978-3-9812696-9-7}, pages = {192 -- 198}, language = {de} } @inproceedings{RothHauslerBierl, author = {Roth, Carina and Hausler, Peter and Bierl, Rudolf}, title = {Einbindung eines CMOS-Detektors in einen hochintegrierten SPR-Sensor}, series = {5. Landshuter Symposium Mikrosystemtechnik, M{\"a}rz 2016}, booktitle = {5. Landshuter Symposium Mikrosystemtechnik, M{\"a}rz 2016}, publisher = {Fachhochschule Landshut}, address = {Landshut}, isbn = {78-3-9812696-9-7}, pages = {200 -- 205}, language = {de} } @incollection{LangSteinbornSteffensetal., author = {Lang, Christian and Steinborn, Florian and Steffens, Oliver and Lang, Elmar Wolfgang}, title = {Applying a 1D-CNN Network to Electricity Load Forecasting}, series = {Theory and Applications of Time Series Analysis}, booktitle = {Theory and Applications of Time Series Analysis}, editor = {Valenzuela, O. and Rojas, F. and Herrera, L.J. and Pomares, H. and Rojas, I.}, publisher = {Springer}, doi = {10.1007/978-3-030-56219-9_14}, pages = {205 -- 218}, abstract = {This paper presents a convolutional neural network (CNN) which can be used for forecasting electricity load profiles 36 hours into the future. In contrast to well established CNN architectures, the input data is one-dimensional. A parameter scanning of network parameters is conducted in order to gain information about the influence of the kernel size, number of filters and number of nodes. Furthermore, different dropout methods are applied to the CNN and are evaluated. The results show that a good forecast quality can already be achieved with basic CNN architectures, the dropout improves the forecast. The method works not only for smooth sum loads of many hundred consumers, but also for the load of single apartment buildings.}, language = {en} } @article{ReutherSteffens, author = {Reuther, Maike and Steffens, Oliver}, title = {Evaluation der Bauteiltemperierung f{\"u}r den Herzogskasten Abensberg}, series = {Bauphysik}, volume = {37}, journal = {Bauphysik}, number = {2}, publisher = {Ernst \& Sohn, a Wiley Brand}, doi = {10.1002/bapi.201510010}, pages = {96 -- 99}, abstract = {Die These, dass die Methode der direkten Temperierung von erdber{\"u}hrten oder anderweitig feuchtebelasteten Bauteilen zur Beseitigung von Feuchtesch{\"a}den in Bestandsgeb{\"a}uden auch die Energieeffizienz des Geb{\"a}udes erh{\"o}hen und sogar ohne weitere energetische Sanierungsmaßnahmen die Anforderungen der Energieeinsparverordnung (EnEV) erf{\"u}llen kann, wird anhand des als Museum genutzten Herzogskastens in Abensberg {\"u}berpr{\"u}ft. In Verbindung mit einer Evaluation der Trocknungswirkung wird die Geb{\"a}ude-Energieeffizienz durch Vergleich von Bedarfsberechnungen auf Basis der DIN V 18599 mit realen Verbrauchszahlen {\"u}berpr{\"u}ft und diskutiert.}, language = {de} } @techreport{SchlampEhrlich, author = {Schlamp, Matthias and Ehrlich, Ingo}, title = {Analyse des Impact-Verhaltens gekr{\"u}mmter Strukturbauteile von Luftfahrzeugen zur Entwicklung eines Struktur{\"u}berwachungssystems f{\"u}r faserverst{\"a}rkte Kunststoffe - BIRD}, series = {Forschung 2019 / Ostbayerische Technische Hochschule Regensburg}, journal = {Forschung 2019 / Ostbayerische Technische Hochschule Regensburg}, editor = {Baier, Wolfgang}, publisher = {VMK Verlag f{\"u}r Marketing \& Kommunikation GmbH \& Co. KG}, organization = {Ostbayerische Technische Hochschule Regensburg}, isbn = {978-3-9818209-6-6}, pages = {40 -- 41}, abstract = {Die in Flugvorausrichtung weisenden Bauteile von Luftfahrzeugen sind oftmals durch Einschl{\"a}ge aufgrund von Vogelschlag, Hagel oder aufgewirbelten Kleinteilen gef{\"a}hrdet. Diese Einschl{\"a}ge, sogenannte Impacts, weisen bei faserverst{\"a}rkten Kunststoffen ein stark kr{\"u}mmungs- und materialabh{\"a}ngiges Verhalten und Schadensausmaß auf. Impact-Sch{\"a}digungen f{\"u}hren oftmals zu hohen Reparaturkosten, welche durch eine genauere Kenntnis des Schadens verringert werden k{\"o}nnen. Zur Klassifizierung dieser Sch{\"a}digungen steht dabei vor allem das auftretende Frequenz signal des Impacts im Fokus der Untersuchungen.}, language = {de} } @article{RomanoMicklitzOlbrichetal., author = {Romano, Marco and Micklitz, Matthias and Olbrich, Florian and Bierl, Rudolf and Ehrlich, Ingo and Gebbeken, Norbert}, title = {Experimental investigation of damping properties of unidirectionally and fabric reinforced plastics by the free decay method}, series = {Journal of Achievements in Materials and Manufacturing Engineering}, volume = {63}, journal = {Journal of Achievements in Materials and Manufacturing Engineering}, number = {2}, pages = {65 -- 80}, abstract = {Purpose: of this paper is experimental investigation of damping properties of unidirectionally and fabric reinforced plastics by the free decay method. Design/methodology/approach: For the evaluation of the presumed effect experimental structural dynamic investigations comparing unidirectionally and fabric reinforced plastics are carried out. In detail the free decay behaviour of flat beamlike specimens under fixed-free boundary conditions and relatively constant and reproducible displacement excitation is investigated. Findings: The vibrating structure has been measured by a laser scanning vibrometer PSV 400 from POLYTEC. In both cases evaluation of the results yields enhanced damping properties of the specimens with fabric reinforcement compared to the unidirectionally reinforced specimens. The results justify the presumed acting of a mesomechanic kinematic. Research limitations/implications: The results show that in either case the material damping in terms of the logarithmic decrement of the fabric reinforced material is higher than the material damping in of the unidirectionally reinforced material. Additionally, when the fabric reinforced specimens are addressed, in each case the plain weave reinforced specimens exhibited higher values of the material damping as the twill weave 2/2 reinforced ones. Originality/value: Ondulations in fabrics as a textile semi-finished product are caused by the alternating crossing of warp and fill yarns. In the mesoscopic scale the acting of a mesomechanic kinematic is presumed to enhance the damping properties under cyclic elastic deformation. For the evaluation of the presumed effect experimental structural dynamic investigations comparing unidirectionally and fabric reinforced plastics are carried out.}, language = {en} } @inproceedings{JobstBierl, author = {Jobst, Simon and Bierl, Rudolf}, title = {A Comparison of Correlation and Zero-Crossing Based Techniques in Ultrasonic Measurement}, series = {10th International Symposium on Applied Reconfigurable Computing (ARC'2014), Vilamoura, Algarve, Portugal, 14 - 16 April, 2014}, booktitle = {10th International Symposium on Applied Reconfigurable Computing (ARC'2014), Vilamoura, Algarve, Portugal, 14 - 16 April, 2014}, abstract = {Ultrasound measurement technology has advancedin previous decades due to positive developments in computing power and lower cost for the necessary hardware. Correlation-based processing can be advantageous for high-accuracy measurements, especially in noisy environments. Higher computational load makes correlation less attractive for industrialapplications, though, favouring traditional processing techniques. A platform for comparing various processing techniques hasbeen developed. It was found that both zero-crossing detectionas well as correlation can achieve very high accuracy over a hightemperature range but that correlation-based processing can lead to a significant precision bias depending on system bandwidth.}, language = {en} } @inproceedings{HofmannBierlRueck, author = {Hofmann, Matthias and Bierl, Rudolf and R{\"u}ck, Thomas}, title = {Implementation of a dual-phase lock-in amplifier on a TMS320C5515 digital signal processor}, series = {Proceedings of the 5th European DSP Education and Research Conference (EDERC), 13-14 Sept. 2012, Amsterdam}, booktitle = {Proceedings of the 5th European DSP Education and Research Conference (EDERC), 13-14 Sept. 2012, Amsterdam}, doi = {10.1109/EDERC.2012.6532217}, abstract = {A digital dual-phase lock-in amplifier that is capable to run on a low-cost, low-power platform comprising a 16-bit fixed-point digital signal processor was developed. This is achieved by a set of optimised digital filters including an exponential averager to adjust the time constant of the overall filter. The reference frequency is generated using a direct digital synthesis source utilising angle decomposition with a resolution of 1 Hz. The digital lock-in algorithm is described and the performance of the algorithm is analysed. The experimental results show that the developed lock-in amplifier achieves similar performance to a commercially available lock-in amplifier.}, language = {en} } @inproceedings{RueckLandgrafLaeppleetal., author = {R{\"u}ck, Thomas and Landgraf, Ferdinand and L{\"a}pple, I. and Unger, J. and Matysik, Frank-Michael and Bierl, Rudolf}, title = {Specification of an improved photoacoustic setup for high-sensitive, low-cost NO2 trace gas detection}, series = {18th International Conference on Photoacoustic and Photothermal Phenomena (ICPPP18), 2015, September 6-10, Novi Sad, Serbia}, booktitle = {18th International Conference on Photoacoustic and Photothermal Phenomena (ICPPP18), 2015, September 6-10, Novi Sad, Serbia}, language = {en} } @inproceedings{vanderWeerdBierlMatysik, author = {van der Weerd, Bastiaan and Bierl, Rudolf and Matysik, Frank-Michael}, title = {A Conductivity Probe for the Determination of Carbon Dioxide Tension at the Oxygenator Exhaust Outlet during Extracorporeal Membrane Oxygenation (ECMO)}, series = {analytica Conference 2014, 1. bis 4. April, M{\"u}nchen}, booktitle = {analytica Conference 2014, 1. bis 4. April, M{\"u}nchen}, language = {en} } @inproceedings{vanderWeerdBierlMatysik, author = {van der Weerd, Bastiaan and Bierl, Rudolf and Matysik, Frank-Michael}, title = {A Conductivity Probe for the Determination of Carbon Dioxide Tension at the Oxygenator Exhaust Outlet during Extracorporeal Membrane Oxygenation (ECMO)}, series = {Electrochemistry 2014, September 22 - 24, Mainz}, booktitle = {Electrochemistry 2014, September 22 - 24, Mainz}, language = {en} } @inproceedings{vanderWeerdBierlMatysik, author = {van der Weerd, Bastiaan and Bierl, Rudolf and Matysik, Frank-Michael}, title = {A Planar Conductivity Probe for CO2 Determination at the Oxygenator Outlet}, series = {Doktorandenseminar GDCh Prozessanalytik 2014, Berlin}, booktitle = {Doktorandenseminar GDCh Prozessanalytik 2014, Berlin}, language = {en} } @inproceedings{TheussElianFinketal., author = {Theuss, Horst and Elian, Klaus and Fink, Markus and Fries, M. and Kalz, Franz-Peter and Schwabe, B. and Vaupel, M. and Jaroschek, C. and Schubert, A. and Hummel, H. and Steffens, Oliver}, title = {Mechanical Stress Impact of Assembly Processes onto a Stress-sensitive Testchip}, series = {44th International Symposium on Microelectronics (IMAPS 2011), October 9 - 13, 2011, Long Beach, California, USA}, booktitle = {44th International Symposium on Microelectronics (IMAPS 2011), October 9 - 13, 2011, Long Beach, California, USA}, number = {1}, publisher = {International Microelectronics \& Packaging}, address = {Washington}, isbn = {978-1-61839-850-5}, doi = {10.4071/isom-2011-WA5-Paper3}, pages = {619 -- 626}, abstract = {A semiconductor die typically undergoes a variety of assembly processes, each of them influencing the mechanical stress environment of the chip. We report on a stress-sensitive testchip and its application to measure and characterize the respective stress distributions across the die. Particularly in the field of MEMS and sensor devices, even low stresses might deteriorate the electrical performance of a device significantly, while higher stress levels may even cause cracks and irreversible damage. This is why the present methodology has a high potential to develop into a useful tool in the field of sensor package development. After a brief introduction to the sensing principle, we investigate the stress distribution in various sample assemblies - all of them targeting pressure sensors. Typical low stress packages use silicone based soft elastic encapsulations. Changing to a harder material with a young's modulus comparable to standard mold compounds, we demonstrate an increase of the average stress level by more than one order of magnitude.}, language = {en} } @article{MalzSteiningerDawoudetal., author = {Malz, Sebastian and Steininger, Peter and Dawoud, Belal and Krenkel, Walter and Steffens, Oliver}, title = {On the Development of a Building Insulation using Air Layers with Highly Reflective Interfaces}, series = {Energy and Buildings}, journal = {Energy and Buildings}, number = {236, April}, publisher = {Elsevier}, doi = {10.1016/j.enbuild.2021.110779}, abstract = {In this work, a novel building insulation system implying wooden fiberboards and intermediate air layers with highly reflective interfaces for the reflection of longwave IR radiation is introduced. A wall test sample with a double air insulation layer has been built and experimentally investigated in a dedicated setup, which consists of a differential climatic chamber to simulate different indoor and outdoor conditions. The test results have been utilized in validating the developed simulation model. In addition, a thorough numerical parameter study has been conducted, through which the general design rules of the introduced insulation system for realizing the lowest possible effective thermal conductivity have been defined. Furthermore, a multi-air-layer-insulation concept is developed, and the energy saving potential is evaluated. It turned out that, emissivity, object size and air layer thickness are the most dominant design parameters which influence the thermal conductivity of the introduced insulation. A thermal conductivity of 0.033 W/(mK) has been estimated for a multi-air-layer insulation with 7 layers. The obtained results prove the high insulation potential of the introduced building insulation system compared with insulating materials available in the market while outlining their limitations.}, language = {en} } @inproceedings{SteffensSzaboLenzetal., author = {Steffens, Oliver and Szab{\´o}, Peter and Lenz, Michael and Farkas, G{\´a}bor}, title = {Thermal transient characterization methodology for single-chip and stacked structures}, series = {Semiconductor Thermal Measurement and Management Symposium, 2005}, booktitle = {Semiconductor Thermal Measurement and Management Symposium, 2005}, publisher = {IEEE}, issn = {1065-2221}, doi = {10.1109/STHERM.2005.1412198}, pages = {313 -- 321}, abstract = {High-power semiconductor packages typically exhibit a 3D heat flow, resulting in large lateral changes in chip and case surface temperature. For single-chip devices we propose to use an unambiguous definition for the junction-to-case thermal resistance as a key parameter, based on a transient measurement technique with much higher repeatability, also for very low thermal resistances compared to a two-point thermal resistance measurement. The technique is illustrated on thermal transient measurements of power MOSFETs. A comparison between different thermal coupling to the ambient is used to demonstrate the method's capability to reveal even subtle internal details of the package. The concept is extended to multichip and stacked-chip structures, where transfer impedances have to be introduced. Here, the dynamic properties of the package are important and complex impedance mapping is the proper way to characterize the package.}, language = {en} } @article{PuffSeidelSteffens, author = {Puff, Simone and Seidel, Uwe M. and Steffens, Oliver}, title = {Pflege- und intensivmedizinische Bereiche im EnEV-Bewertungsverfahren}, series = {Bauphysik}, volume = {37}, journal = {Bauphysik}, number = {6}, doi = {10.1002/bapi.201510036}, pages = {307}, abstract = {Die Anwendbarkeit des derzeit g{\"u}ltigen Verfahrens zur energetischen Bewertung von Nichtwohngeb{\"a}uden gem{\"a}ß aktueller Energieeinsparverordnung (EnEV 2014) in Verbindung mit DIN V 18599 als Planungs- und Bewertungstool auf Pflege- und intensiv-medizinische Bereiche von Krankenh{\"a}usern wird an einem beispielhaften, mittelgroßen Krankenhaus untersucht. Der Fokus liegt dabei auf der Praktikabilit{\"a}t der Abbildung von thermischen Lasten und Raumzust{\"a}nden durch die Normnutzungsprofile aus DIN V 18599 Teil 10 im Vergleich zu realen, vor Ort erfassten Nutzungsbedingungen. Weitere Betrachtungen in einer einfachen thermischen Simulation (TRNSYSlite) erlauben eine methodische Kritik in Bezug auf die Aussagekraft der nach Norm berechneten EnEV-Ergebnisse. Es werden Empfehlungen f{\"u}r Maßnahmen zur Verbesserung der energetischen Performance und der Behaglichkeit in Krankenh{\"a}usern im Bereich der Planung erarbeitet.}, subject = {Energieeinsparungsverordnung}, language = {de} } @article{WensauerSteffensSuhrkeetal., author = {Wensauer, Andreas and Steffens, Oliver and Suhrke, Michael and R{\"o}ssler, Ulrich}, title = {Laterally coupled few-electron quantum dots}, series = {Physical Review B}, volume = {62}, journal = {Physical Review B}, number = {4}, doi = {10.1103/PhysRevB.62.2605}, pages = {2605}, abstract = {We present ground-state calculations for laterally coupled quantum dots containing 2, 4, and 8 electrons. As our emphasis is on spin effects our results are obtained by applying spin-density functional theory (SDFT). By varying the distance between the centers of the coupled quantum dots, the transition from weak to strong coupling situation is realized. For the 2-electron system we also apply the Heitler-London approximation and analytical concepts to check the reliability of SDFT calculations in this case. In addition we discuss the features of the Coulomb staircase of laterally coupled quantum dots in the weak and strong coupling regimes in comparison to that of a circular parabolic quantum dot.}, language = {en} } @inproceedings{Steffens, author = {Steffens, Oliver}, title = {"Gr{\"u}nes Denkmal" - Denkmalpflege und Erneuerbare Energien erg{\"a}nzen sich}, series = {Vorsicht Baudenkmal! Konfliktfelder Umwelt - Nutzung - Geschichte. Beitr{\"a}ge des 28. Regensburger Herbstsymposions f{\"u}r Kunst, Geschichte und Denkmalpflege vom 22. bis 24. November 2013}, booktitle = {Vorsicht Baudenkmal! Konfliktfelder Umwelt - Nutzung - Geschichte. Beitr{\"a}ge des 28. Regensburger Herbstsymposions f{\"u}r Kunst, Geschichte und Denkmalpflege vom 22. bis 24. November 2013}, editor = {Trapp, Eugen}, publisher = {Regensburg}, address = {Morsbach-Verl.}, isbn = {978-3-937527-77-2}, pages = {9 -- 17}, subject = {Denkmalpflege}, language = {de} } @inproceedings{SteffensSuhrkeRoessler, author = {Steffens, Oliver and Suhrke, Michael and R{\"o}ssler, Ulrich}, title = {Correlation in few-electron quantum dots: Spin effects and spontaneous currents}, series = {24rd International Conference on the Physics of Semiconductors (ICPS 24), Jerusalem, Israel, August 2-7, 1998}, booktitle = {24rd International Conference on the Physics of Semiconductors (ICPS 24), Jerusalem, Israel, August 2-7, 1998}, editor = {Gershoni, David}, publisher = {World Scientific}, address = {Singapore}, isbn = {978-981-02-3613-7}, language = {en} } @masterthesis{Gering, type = {Bachelor Thesis}, author = {Gering, Stefan}, title = {Thermische Detailsimulationen in der Bestandssanierung}, address = {Regensburg}, language = {de} }