@article{SchelsEdlerHerdletal., author = {Schels, Andreas and Edler, Simon and Herdl, Florian and Hansch, Walter and Bachmann, Michael and Ritter, Daniela and Dudeck, Markus and Duesberg, Felix and Meyer, Manuel and Pahlke, Andreas and Hausladen, Matthias and Buchner, Philipp and Schreiner, Rupert}, title = {In situ quantitative field emission imaging using a low-cost CMOS imaging sensor}, series = {Journal of Vacuum Science \& Technology B}, volume = {40}, journal = {Journal of Vacuum Science \& Technology B}, number = {1}, publisher = {AIP Publishing}, doi = {10.1116/6.0001551}, abstract = {Spatially resolved field emission measurements represent an important factor in further development of existing field emitter concepts. In this work, we present a novel approach that allows quantitative analysis of individual emission spots from integral current-voltage measurements using a low-cost and commercially available CMOS camera. By combining different exposure times to extrapolate oversaturated and underexposed pixels, a near congruence of integral current and image brightness is shown. The extrapolation also allows parallel investigation of all individual tips participating in the total current with currents ranging from a few nanoampere to one microampere per tip. The sensitivity, which is determined by the integral brightness-to-current ratio, remains unchanged within the measurement accuracy even after ten full measurement cycles. Using a point detection algorithm, the proportional current load of each individual tip of the field emitter array is analyzed and compared at different times during the initial measurement cycle. Together with the extracted I-V curves of single emission spots from the integral measurement, the results indicate the effect of premature burnout of particularly sharp tips during conditioning of the emitter.}, language = {en} } @article{EdlerSchelsHerdletal., author = {Edler, Simon and Schels, Andreas and Herdl, Florian and Hansch, Walter and Bachmann, Michael and Dudeck, Markus and Duesberg, Felix and Pahlke, Andreas and Hausladen, Matthias and Buchner Philipp, and Schreiner, Rupert}, title = {Origin of the current saturation level of p-doped silicon field emitters}, series = {Journal of Vacuum Science \& Technology B}, volume = {40}, journal = {Journal of Vacuum Science \& Technology B}, number = {1}, publisher = {AIP Publishing}, doi = {10.1116/6.0001554}, abstract = {Using p-type semiconductors for field emitters is one simple way to realize an integrated current limiter to improve the lifetime of the cathode. In this work, the origin of the current saturation of p-type silicon emitters is investigated in detail. Single emitters are electrically characterized and compared to simulation results. With a simulation model considering a high surface generation rate and elevated tip temperature, a good agreement to the measured data is found. This observation is supported further by alteration of the surface experimentally. Electrical measurements after different treatments in hydrofluoric acid as well as heated and subsequent operation at room temperature are well explained by the influence of surface generation. Furthermore, it is shown that the field penetration leads to a small voltage drop and a strong geometry-dependent reduction of the field enhancement factor.}, language = {en} } @article{HausladenBuchnerBartletal., author = {Hausladen, Matthias and Buchner, Philipp and Bartl, Mathias and Bachmann, Michael and Schreiner, Rupert}, title = {Integrated multichip field emission electron source fabricated by laser-micromachining and MEMS technology}, series = {Journal of Vacuum Science \& Technology B}, volume = {42}, journal = {Journal of Vacuum Science \& Technology B}, number = {1}, publisher = {AIP Publishing}, doi = {10.1116/6.0003233}, abstract = {In this work, high-current field emission electron source chips were fabricated using laser-micromachining and MEMS technology. The resulting chips were combined with commercially available printed circuit boards (PCBs) to obtain a multichip electron source. By controlling the separate electron sources using an external current control circuit, we were able to divide the desired total current evenly across the individual chips deployed in the PCB-carrier. In consequence, we were able to show a decreased degradation due to the reduced current load per chip. First, a single electron source chip was measured without current regulation. A steady-state emission current of 1 mA with a high stability of ±1.3\% at an extraction voltage of 250 V was observed. At this current level, a mean degradation slope of -0.7 μA/min with a nearly perfect transmission ratio of 99\% ± 0.4\% was determined. The measurements of a fully assembled multichip PCB-carrier electron source, using a current control circuit for regulation, showed that an even distribution of the desired total current led to a decreased degradation. This was determined by the increase in the required extraction voltage over time. For this purpose, two current levels were applied to the electron source chips of the PCB-carrier using an external current control circuit. First, 300 μA total current was evenly distributed among the individual electron source chips followed by the emission of 300 μA per electron source chip. This allows the observation of the influence of a distributed and nondistributed total current, carried by the electron source chips. Thereby, we obtained an increase in the mean degradation slope from +0.011 V/min (300 μA distributed) to +0.239 V/min (300 μA per chip), which is approximately 21 times higher. Moreover, our current control circuit improved the current stability to under 0.1\% for both current levels, 300 μA distributed and 300 μA per chip.}, language = {en} } @article{ŁawrowskiHausladenBuchneretal., author = {Ławrowski, Robert Damian and Hausladen, Matthias and Buchner, Philipp and Schreiner, Rupert}, title = {Silicon Field Emission Electron Source With Individually Controllable Single Emitters}, series = {IEEE Transactions on Electron Devices}, volume = {68}, journal = {IEEE Transactions on Electron Devices}, number = {8}, publisher = {IEEE}, doi = {10.1109/TED.2021.3093374}, pages = {4116 -- 4122}, abstract = {An electron source with an array of individually controllable single tips allows the observation of each emitter current simultaneously as well as the measurement of the integral current. Furthermore, the initial activation process of the individual tips and current distribution of the source can be examined. The Si cathode consists of an array of 2 x 2 conically shaped emitter structures on a borosilicate glass substrate. The emitters were fabricated by laser micromachining and wet etching. Integral field emission (FE) measurements were performed in a diode configuration in a vacuum chamber at pressures of about 10(-9) mbar with a self-aligned Si extraction grid, due to adjustment pins. The total emission current was regulated to a predefined value (4.0, 10, 20, 40, and 50 mu A) by an external regulating circuit and recorded individually during the measurement. The onset voltage for a current of 1 nA varied between 320 and 430 V. The voltage conversion factor is in the range of 7.6 x 10(4) cm(-1) to 1.3 x 10(5) cm(-1). Constant currentmeasurementsover a longer periodof time (1800 values with a sample rate of 0.5 Hz) were performed and show a total current fluctuation less than 0.6\% due to the regulation circuit. Despite the stable total current in regulated operation, it was observed that the individual emitters fluctuate up to 75\% for low (similar to 10(-8) A) and 5\% for high (similar to 10(-5) A) currents.}, language = {en} } @article{ThumannBuchnerMarburgetal., author = {Thumann, Philipp and Buchner, Stefan and Marburg, Steffen and Wagner, Marcus}, title = {A comparative study of Glinka and Neuber approaches for fatigue strength assessment on 42CrMoS4-QT specimens}, series = {Strain}, volume = {2023}, journal = {Strain}, number = {e12470}, publisher = {Wiley}, issn = {1475-1305}, doi = {10.1111/str.12470}, pages = {21}, abstract = {In fatigue strength assessment, the methods based on ideal elastic stresses according to Basquin and the less established method based on elastic-plastic stress quantities according to Manson, Coffin and Morrow are applied. The former calculates loads using linear-elastic stresses, the latter requires elasticplastic evaluation parameters, such as stresses and strains. These can be determined by finite element analysis (FEA) with a linear-elastic constitutive law, and subsequent conversion to elastic-plastic loads, using the macro support formula by Neuber. In this contribution, an alternative approach to approximate elastic-plastic parameters proposed by Glinka is compared to the the strain-life method using Neuber's formula, as well as the stress-life method of Basquin. Several component tests on 42CrMoS4-QT specimens are investigated. To determine the input data for the fatigue strength evaluations, the entire test setup is computed by FEA. The nodal displacements from these validated full-model simulations are used as boundary conditions for a submodel simulation of a notch, whose results serve as input for the fatigue strength assessments. It is shown that all approaches provide a reliable assessment of components. Our key result is that the strain-life method using the concept by Glinka for notch stress computation, yields improved results in fatigue strength assessments.}, language = {en} } @article{BachmannDuesbergPahlkeetal., author = {Bachmann, Michael and D{\"u}sberg, Felix and Pahlke, Andreas and Edler, Simon and Schels, Andreas and Herdl, Florian and Hausladen, Matthias and Buchner, Philipp and Schreiner, Rupert}, title = {The "LED-version" of the electron gun: An electron source for operation in ambient pressure environments based on silicon field emitter arrays}, series = {Vakuum in Forschung und Praxis}, volume = {35}, journal = {Vakuum in Forschung und Praxis}, number = {3}, publisher = {Wiley}, doi = {10.1002/vipr.202300801}, pages = {32 -- 37}, abstract = {We report on our progress to develop and optimize electron sources for practical applications. A simple fabrication process is introduced based on a wafer dicing saw and a wet chemical etch step without the need for a clean room. Due to the formation of crystal facets the samples show a homogeneous geometry throughout the array. Characterization techniques are developed to systematically compare various arrays. A very defined measurement procedure based on current controlled IV-sweeps as well as lifetime measurements at various currents is proposed. To investigate the current distribution in the array a commercial CMOS detector is used and shows the potential for in depth analysis of the arrays. Finally, a compact hermetically sealed housing is presented enabling electron generation in atmospheric pressure environments.}, language = {en} } @article{HausladenSchelsBuchneretal., author = {Hausladen, Matthias and Schels, Andreas and Buchner, Philipp and Bartl, Mathias and Asgharzade, Ali and Edler, Simon and Wohlfartsst{\"a}tter, Dominik and Bachmann, Michael and Schreiner, Rupert}, title = {Measurement of field emission array current distributions by metal-coated CMOS image sensors}, series = {Journal of Vacuum Science \& Technology B}, volume = {42}, journal = {Journal of Vacuum Science \& Technology B}, number = {6}, publisher = {AIP Publishing}, doi = {10.1116/6.0004074}, abstract = {A CMOS image sensor is utilized to determine the time- and spatially resolved distribution of the total electron emission current of a silicon field emission array. The sensor measures electron emission without the need for phosphorus screens or scintillators as converters. However, in initial experiments, rather low field emission currents of several hundreds of nanoamperes per emitter already damaged the sensor surface, which altered the systems' signal response over the measurement time. In consequence, we coated the CMOS sensor surface with a Cu layer for surface protection. In contrast to the original insulating surface, Cu is an excellent current- and heat-conductor, which avoids lens charging by providing a conductive path for incident electrons and has an improved heat dissipation capability. Measurements using a segmented field emission cathode with four individually addressable tips demonstrate a consistent correlation between the emission current and the sensor signal of the metal-coated image sensor. Furthermore, the characterization of a field emission array showed that single tip emission currents of up to 12 μA per tip are measurable without discernible damage effects of the sensor's surface.}, language = {en} } @article{HausladenSchelsAsgharzadeetal., author = {Hausladen, Matthias and Schels, Andreas and Asgharzade, Ali and Buchner, Philipp and Bartl, Mathias and Wohlfartsst{\"a}tter, Dominik and Edler, Simon and Bachmann, Michael and Schreiner, Rupert}, title = {Investigation of Influencing Factors on the Measurement Signal of a CMOS Image Sensor for Measuring Field Emission Currents}, series = {Sensors}, volume = {25}, journal = {Sensors}, number = {5}, publisher = {MDPI}, doi = {10.3390/s25051529}, pages = {17}, language = {en} } @article{BuchnerHausladenBartletal., author = {Buchner, Philipp and Hausladen, Matthias and Bartl, Mathias and Bachmann, Michael and Schreiner, Rupert}, title = {High current field emission from Si nanowires on pillar structures}, series = {Journal of Vacuum Science and Technology B: Nanotechnology and Microelectronics}, volume = {42}, journal = {Journal of Vacuum Science and Technology B: Nanotechnology and Microelectronics}, number = {2}, publisher = {AIP}, issn = {2166-2754}, doi = {10.1116/6.0003384}, abstract = {We investigate the influence of the geometry and doping level on the performance of n-type silicon nanowire field emitters on silicon pillar structures. Therefore, multiple cathodes with 50 by 50 pillar arrays (diameter: 5 μm, height: 30 μm, spacing: 50 μm) were fabricated and measured in diode configuration. In the first experiment, we compared two geometry types using the same material. Geometry 1 is black silicon, which is a highly dense surface covering a forest of tightly spaced silicon needles resulting from self-masking during a plasma etching process of single crystal silicon. Geometry 2 are silicon nanowires, which are individual spaced-out nanowires in a crownlike shape resulting from a plasma etching process of single crystal silicon. In the second experiment, we compared two different silicon doping levels [n-type (P), 1-10 and <0.005 Ω cm] for the same geometry. The best performance was achieved with lower doped silicon nanowire samples, emitting 2 mA at an extraction voltage of 1 kV. The geometry/material combination with the best performance was used to assemble an integrated electron source. These electron sources were measured in a triode configuration and reached onset voltages of about 125 V and emission currents of 2.5 mA at extraction voltages of 400 V, while achieving electron transmission rates as high as 85.0\%.}, language = {en} }