@misc{BeimlerLeisslEbneretal., author = {Beimler, Josef and Leißl, Caroline and Ebner, Lena and Elsner, Michael and M{\"u}hlbauer, Gerhard and Kohlert, Dieter and Schubert, Martin J. W. and Weiß, Andreas P. and Sterner, Michael and Raith, Thomas and Afranseder, Martin and Krapf, Tobias and Mottok, J{\"u}rgen and Siemers, Christian and Großmann, Benjamin and H{\"o}cherl, Johannes and Schlegl, Thomas and Schneider, Ralph and Milaev, Johannes and Rampelt, Christina and Roduner, Christian and Glowa, Christoph and Bachl, Christoph and Schliekmann, Claus and Gnan, Alfons and Grill, Martin and Ruhland, Karl and Piehler, Thomas and Friers, Daniel and Wels, Harald and Pflug, Kenny and Kucera, Markus and Waas, Thomas and Schlachetzki, Felix and Boy, Sandra and Pemmerl, Josef and Leis, Alexander and Welsch, Andreas F.X. and Graf, Franz and Zenger, Gerhard and Volbert, Klaus and Waas, Thomas and Scherzinger, Stefanie and Klettke, Meike and St{\"o}rl, Uta and Heyl, C. and Boldenko, A. and Monkman, Gareth J. and Kujat, Richard and Briem, Ulrich and Hierl, Stefan and Talbot, Sebastian and Schmailzl, Anton and Ławrowski, Robert Damian and Prommesberger, Christian and Langer, Christoph and Dams, Florian and Schreiner, Rupert and Valentino, Piergiorgio and Romano, Marco and Ehrlich, Ingo and Furgiuele, Franco and Gebbeken, Norbert and Eisenried, Michael and Jungbauer, Bastian and Hutterer, Albert and Bauhuber, Michael and Mikrievskij, Andreas and Argauer, Monika and Hummel, Helmut and Lechner, Alfred and Liebetruth, Thomas and Schumm, Michael and Joseph, Saskia and Reschke, Michael and Soska, Alexander and Schroll-Decker, Irmgard and Putzer, Michael and Rasmussen, John and Dendorfer, Sebastian and Weber, Tim and Al-Munajjed, Amir Andreas and Verkerke, Gijsbertus Jacob and Renkawitz, Tobias and Haug, Sonja and Rudolph, Clarissa and Zeitler, Annika and Schaubeck, Simon and Steffens, Oliver and Rechenauer, Christian and Schulz-Brize, Thekla and Fleischmann, Florian and Kusterle, Wolfgang and Beer, Anne and Wagner, Bernd and Neidhart, Thomas}, title = {Forschungsbericht 2013}, editor = {Baier, Wolfgang}, address = {Regensburg}, organization = {Ostbayerische Technische Hochschule Regensburg}, doi = {10.35096/othr/pub-799}, url = {http://nbn-resolving.de/urn:nbn:de:bvb:898-opus4-7990}, pages = {80}, language = {de} } @article{BauhuberMikrievskijLechner, author = {Bauhuber, Michael and Mikrievskij, Andreas and Lechner, Alfred}, title = {Isotropic wet chemical etching of deep channels with optical surface quality in silicon with HNA based etching solutions}, series = {Materials Science in Semiconductor Processing}, volume = {16}, journal = {Materials Science in Semiconductor Processing}, number = {6}, publisher = {Elsevier}, doi = {10.1016/j.mssp.2013.05.017}, pages = {1428 -- 1433}, abstract = {Online trace analysis based on UV/Vis spectroscopy requires long detection paths. Therefore an isotropic wet etch process in silicon is developed to fabricate a 300 µm deep channel with low channel wall roughness for desired light guidance application. Four etchant compositions were compared in terms of etching rate, surface roughness and selectivity in a beaker process. The best fitting mixture was selected. To further increase the surface quality (bubble issue) a spin etcher tool is used for producing the channels. The dependence of homogeneity and defect density on media flux, and rotation velocity was investigated. Results show that high rotation velocity and high media flux lead to great defects in the channel wall. Through rotation of the wafer during etching, the etching rate of silicon rises compared to the beaker process due to the rapid removal of etch products and simultaneous supply of fresh etchant. After 38 min of etching, 300 µm deep semi-circular channels with high optical quality (Rq=10 nm±2 nm) over 3 m were produced.}, language = {de} }