@inproceedings{BartlBuchnerHausladenetal., author = {Bartl, Mathias and Buchner, Philipp and Hausladen, Matthias and Asgharzadehkhorasani, Ali and Bachmann, Michael and Schreiner, Rupert}, title = {Simulations and Investigations of Silicon Nanowire Field Emitters}, series = {37th International Vacuum Nanoelectronics Conference (IVNC), 15-19 July 2024, Brno, Czech Republic}, booktitle = {37th International Vacuum Nanoelectronics Conference (IVNC), 15-19 July 2024, Brno, Czech Republic}, publisher = {IEEE}, doi = {10.1109/IVNC63480.2024.10652355}, pages = {1 -- 2}, abstract = {The emission behavior of field emission electron sources consisting of a silicon nanowire cathode, an extraction grid electrode and a planar anode was investigated based on a particle tracing simulation using FEM. The focus was on the influence of the grid geometry as well as the positioning of the grid relative to the emitters on the electron transmission. The highest transmission can be achieved with the emitter tips protruding 10 µm trough the extraction grid openings. The transmission decreases more rapidly with increasing distance between the tip and the grid the thicker the grid is.}, language = {en} } @article{HausladenBuchnerBartletal., author = {Hausladen, Matthias and Buchner, Philipp and Bartl, Mathias and Bachmann, Michael and Schreiner, Rupert}, title = {Integrated multichip field emission electron source fabricated by laser-micromachining and MEMS technology}, series = {Journal of Vacuum Science \& Technology B}, volume = {42}, journal = {Journal of Vacuum Science \& Technology B}, number = {1}, publisher = {AIP Publishing}, doi = {10.1116/6.0003233}, abstract = {In this work, high-current field emission electron source chips were fabricated using laser-micromachining and MEMS technology. The resulting chips were combined with commercially available printed circuit boards (PCBs) to obtain a multichip electron source. By controlling the separate electron sources using an external current control circuit, we were able to divide the desired total current evenly across the individual chips deployed in the PCB-carrier. In consequence, we were able to show a decreased degradation due to the reduced current load per chip. First, a single electron source chip was measured without current regulation. A steady-state emission current of 1 mA with a high stability of ±1.3\% at an extraction voltage of 250 V was observed. At this current level, a mean degradation slope of -0.7 μA/min with a nearly perfect transmission ratio of 99\% ± 0.4\% was determined. The measurements of a fully assembled multichip PCB-carrier electron source, using a current control circuit for regulation, showed that an even distribution of the desired total current led to a decreased degradation. This was determined by the increase in the required extraction voltage over time. For this purpose, two current levels were applied to the electron source chips of the PCB-carrier using an external current control circuit. First, 300 μA total current was evenly distributed among the individual electron source chips followed by the emission of 300 μA per electron source chip. This allows the observation of the influence of a distributed and nondistributed total current, carried by the electron source chips. Thereby, we obtained an increase in the mean degradation slope from +0.011 V/min (300 μA distributed) to +0.239 V/min (300 μA per chip), which is approximately 21 times higher. Moreover, our current control circuit improved the current stability to under 0.1\% for both current levels, 300 μA distributed and 300 μA per chip.}, language = {en} } @inproceedings{HausladenSchelsBuchneretal., author = {Hausladen, Matthias and Schels, Andreas and Buchner, Philipp and Bartl, Mathias and Asgharzade, Ali and Edler, Simon and Wohlfartsst{\"a}tter, Dominik and Bachmann, Michael and Schreiner, Rupert}, title = {Improved Method for Determining the Distribution of FEA Currents by Optical CMOS Sensors}, series = {37th International Vacuum Nanoelectronics Conference (IVNC), 15-19 July 2024, Brno, Czech Republic}, booktitle = {37th International Vacuum Nanoelectronics Conference (IVNC), 15-19 July 2024, Brno, Czech Republic}, publisher = {IEEE}, doi = {10.1109/IVNC63480.2024.10652543}, pages = {1 -- 2}, abstract = {CMOS image sensors are utilized to determine the time- and spatially-resolved distribution of the electron emission of silicon field emission arrays. During initial experiments, rather low field emission currents already visibly damaged the sensor surface, altering the system accuracy over the measurement time. Therefore, we coated the sensor surface with copper for protection. In contrast to the original insulating surface, the Cu coating provides a conductive surface for incident electrons and improves heat dissipation in addition. This prevents localized surface charges and surface damages which stabilize the system accuracy.}, language = {en} } @article{HausladenSchelsBuchneretal., author = {Hausladen, Matthias and Schels, Andreas and Buchner, Philipp and Bartl, Mathias and Asgharzade, Ali and Edler, Simon and Wohlfartsst{\"a}tter, Dominik and Bachmann, Michael and Schreiner, Rupert}, title = {Measurement of field emission array current distributions by metal-coated CMOS image sensors}, series = {Journal of Vacuum Science \& Technology B}, volume = {42}, journal = {Journal of Vacuum Science \& Technology B}, number = {6}, publisher = {AIP Publishing}, doi = {10.1116/6.0004074}, abstract = {A CMOS image sensor is utilized to determine the time- and spatially resolved distribution of the total electron emission current of a silicon field emission array. The sensor measures electron emission without the need for phosphorus screens or scintillators as converters. However, in initial experiments, rather low field emission currents of several hundreds of nanoamperes per emitter already damaged the sensor surface, which altered the systems' signal response over the measurement time. In consequence, we coated the CMOS sensor surface with a Cu layer for surface protection. In contrast to the original insulating surface, Cu is an excellent current- and heat-conductor, which avoids lens charging by providing a conductive path for incident electrons and has an improved heat dissipation capability. Measurements using a segmented field emission cathode with four individually addressable tips demonstrate a consistent correlation between the emission current and the sensor signal of the metal-coated image sensor. Furthermore, the characterization of a field emission array showed that single tip emission currents of up to 12 μA per tip are measurable without discernible damage effects of the sensor's surface.}, language = {en} } @article{HausladenSchelsAsgharzadeetal., author = {Hausladen, Matthias and Schels, Andreas and Asgharzade, Ali and Buchner, Philipp and Bartl, Mathias and Wohlfartsst{\"a}tter, Dominik and Edler, Simon and Bachmann, Michael and Schreiner, Rupert}, title = {Investigation of Influencing Factors on the Measurement Signal of a CMOS Image Sensor for Measuring Field Emission Currents}, series = {Sensors}, volume = {25}, journal = {Sensors}, number = {5}, publisher = {MDPI}, doi = {10.3390/s25051529}, pages = {17}, language = {en} } @inproceedings{BuchnerHausladenBartletal., author = {Buchner, Philipp and Hausladen, Matthias and Bartl, Mathias and Schreiner, Rupert}, title = {Elektronenquellen basierend auf Feldemission aus Silizium}, series = {Tagungsband zum 4. Symposium Elektronik und Systemintegration ESI: 17. April 2024, Hochschule Landshut}, booktitle = {Tagungsband zum 4. Symposium Elektronik und Systemintegration ESI: 17. April 2024, Hochschule Landshut}, publisher = {Hochschule f{\"u}r Angewandte Wissenschaften Landshut}, address = {Landshut}, isbn = {978-3-9818439-9-6}, doi = {10.57688/421}, url = {http://nbn-resolving.de/urn:nbn:de:bvb:860-opus4-4212}, pages = {46 -- 53}, abstract = {Der Beitrag gibt einen {\"U}berblick {\"u}ber zwei typische Bauformen f{\"u}r Elektronenquellen auf der Basis von Feldemission aus Silizium. Des Weiteren wird eine typische Trioden-Beschaltung solcher Elektronenquellen f{\"u}r hohe Elektronentransmission vorgestellt und dabei auf ihre Leistungsf{\"a}higkeit eingegangen.}, language = {de} } @inproceedings{BartlHausladenAsgharzadeetal., author = {Bartl, Mathias and Hausladen, Matthias and Asgharzade, Ali and Buchner, Philipp and Krysztof, Michal and Kn{\´a}pek, Alexandr and Bachmann, Michael and Schreiner, Rupert}, title = {Experimental method for investigation of the emission pattern characteristics of individual field emission tips using a CMOS image sensor}, series = {38th International Vacuum Nanoelectronics Conference (IVNC)}, booktitle = {38th International Vacuum Nanoelectronics Conference (IVNC)}, publisher = {IEEE}, doi = {10.1109/IVNC65669.2025.11121040}, pages = {2}, abstract = {The emission pattern characteristics of individual silicon field emission tips were investigated using a CMOS image sensor. The quality of the image was improved by spatial and temporal averaging, so that individual emission centers could be identified and their temporal changes investigated. By mapping the emission current onto the image, the distribution of the current density on the image sensor could be calculated.}, language = {en} } @inproceedings{AsgharzadeBartlHausladenetal., author = {Asgharzade, Ali and Bartl, Mathias and Hausladen, Matthias and Chen, Yang and Buchner, Philipp and Edler, Simon and Bachmann, Michael and She, Juncong and Schreiner, Rupert}, title = {Investigation on the influence of internal voltage drops on the emission behavior of silicon field emission arrays using CMOS image sensor}, series = {38th International Vacuum Nanoelectronics Conference (IVNC)}, booktitle = {38th International Vacuum Nanoelectronics Conference (IVNC)}, publisher = {IEEE}, doi = {10.1109/IVNC65669.2025.11120937}, pages = {2}, abstract = {In this paper we report on an improved measurement and analysis method for determining the emission current distribution of field emitter arrays with CMOS sensors. It can also be used for field emission arrays where not all surfaces of the emitters are at the same electrical potential (e.g. for p-doped Si tips, where a strong current saturation occurs). To demonstrate the functionality of this method, a n-doped field emission array was measured using a variable external series resistance. Brightness variations in emission spots were analyzed to re-calculate the known series resistances for comparison. The re-calculated value is in good agreement with the actual value of the resistance. This method offers a quantitative approach to assess internal voltage drop effects on field emission using optical readout}, language = {en} } @article{BuchnerHausladenBartletal., author = {Buchner, Philipp and Hausladen, Matthias and Bartl, Mathias and Bachmann, Michael and Schreiner, Rupert}, title = {High current field emission from Si nanowires on pillar structures}, series = {Journal of Vacuum Science and Technology B: Nanotechnology and Microelectronics}, volume = {42}, journal = {Journal of Vacuum Science and Technology B: Nanotechnology and Microelectronics}, number = {2}, publisher = {AIP}, issn = {2166-2754}, doi = {10.1116/6.0003384}, abstract = {We investigate the influence of the geometry and doping level on the performance of n-type silicon nanowire field emitters on silicon pillar structures. Therefore, multiple cathodes with 50 by 50 pillar arrays (diameter: 5 μm, height: 30 μm, spacing: 50 μm) were fabricated and measured in diode configuration. In the first experiment, we compared two geometry types using the same material. Geometry 1 is black silicon, which is a highly dense surface covering a forest of tightly spaced silicon needles resulting from self-masking during a plasma etching process of single crystal silicon. Geometry 2 are silicon nanowires, which are individual spaced-out nanowires in a crownlike shape resulting from a plasma etching process of single crystal silicon. In the second experiment, we compared two different silicon doping levels [n-type (P), 1-10 and <0.005 Ω cm] for the same geometry. The best performance was achieved with lower doped silicon nanowire samples, emitting 2 mA at an extraction voltage of 1 kV. The geometry/material combination with the best performance was used to assemble an integrated electron source. These electron sources were measured in a triode configuration and reached onset voltages of about 125 V and emission currents of 2.5 mA at extraction voltages of 400 V, while achieving electron transmission rates as high as 85.0\%.}, language = {en} }