@article{SzaboSteffensLenzetal., author = {Szab{\´o}, Peter and Steffens, Oliver and Lenz, Michael and Farkas, G{\´a}bor}, title = {Transient junction-to-case thermal resistance measurement methodology of high accuracy and high repeatability}, series = {IEEE Transactions on Components and Packaging Technologies}, volume = {28}, journal = {IEEE Transactions on Components and Packaging Technologies}, number = {4}, issn = {1521-3331}, doi = {10.1109/TCAPT.2005.859768}, pages = {630 -- 636}, abstract = {High-power packages show a characteristic three-dimensional heat flow resulting in large lateral changes in chip and case surface temperature. This paper proposes an unambiguous definition for the R/sub thJC/ junction-to-case thermal resistance as a key parameter of such packages based on a transient measurement technique ensuring high repeatability even at very low R/sub th/ values. The technique is illustrated on thermal transient measurements of high-power MOSFET devices. It is also presented how the same measurement results can be used for die attach quality analysis. Finally, a comparative method is shown for measuring the differences of R/sub th/ values among samples with many times higher resolution compared with a direct R/sub thJC/ measurement.}, language = {en} }