@article{LangerBomkeHausladenetal., author = {Langer, Christoph and Bomke, Vitali and Hausladen, Matthias and Ławrowski, Robert Damian and Prommesberger, Christian and Bachmann, Michael and Schreiner, Rupert}, title = {Silicon Chip Field Emission Electron Source Fabricated by Laser Micromachining}, series = {Journal of Vacuum Science \& Technology B}, volume = {38}, journal = {Journal of Vacuum Science \& Technology B}, number = {1}, publisher = {AIP Publishing}, doi = {10.1116/1.5134872}, abstract = {The components for a silicon chip electron source were fabricated by laser micromachining using pulsed laser ablation and wet chemical cleaning and etching dips. The field emission electron source consists of a silicon field emission cathode with 4 × 4 conical shaped emitters with a height of 250 μm and a tip radius of about 50 nm, a 50 μm thick laser-structured mica spacer, and a silicon grid electrode with a grid periodicity of 200 μm and a bar width of 50 μm. These three components are combined to a single chip with the size of 14 × 10 mm2 and the thickness of 1 mm to form the electron source. Several of these devices were characterized in ultrahigh vacuum. Onset voltages of about 165 V and cathode currents of about 15 μA for voltages lower than 350 V were observed. Operating the electron source with an anode voltage of 500 V and an extraction grid voltage of 300 V yielded a cathode current of 4.5 μA ± 8.9\%, an anode current of 4.0 μA ± 9.6\%, and a corresponding grid transmittance of 89\%. Regulating the anode current by the extraction grid voltage, an extremely stable anode current of 5.0 μA ± 0.017\% was observed. A long-term measurement over 120 h was performed, and no significant degradation or failure was observed.}, language = {en} }