@inproceedings{AsgharzadeBartlHausladenetal., author = {Asgharzade, Ali and Bartl, Mathias and Hausladen, Matthias and Chen, Yang and Buchner, Philipp and Edler, Simon and Bachmann, Michael and She, Juncong and Schreiner, Rupert}, title = {Investigation on the influence of internal voltage drops on the emission behavior of silicon field emission arrays using CMOS image sensor}, series = {38th International Vacuum Nanoelectronics Conference (IVNC)}, booktitle = {38th International Vacuum Nanoelectronics Conference (IVNC)}, publisher = {IEEE}, doi = {10.1109/IVNC65669.2025.11120937}, pages = {2}, abstract = {In this paper we report on an improved measurement and analysis method for determining the emission current distribution of field emitter arrays with CMOS sensors. It can also be used for field emission arrays where not all surfaces of the emitters are at the same electrical potential (e.g. for p-doped Si tips, where a strong current saturation occurs). To demonstrate the functionality of this method, a n-doped field emission array was measured using a variable external series resistance. Brightness variations in emission spots were analyzed to re-calculate the known series resistances for comparison. The re-calculated value is in good agreement with the actual value of the resistance. This method offers a quantitative approach to assess internal voltage drop effects on field emission using optical readout}, language = {en} } @inproceedings{SchelsHerdlHausladenetal., author = {Schels, Andreas and Herdl, Florian and Hausladen, Matthias and Wohlfartsst{\"a}tter, Dominik and Bachmann, Michael and Edler, Simon and D{\"u}sberg, Felix and Pahlke, Andreas and Buchner, Philipp and Schreiner, Rupert and Hansch, Walter}, title = {Beta Factor Mapping of Individual Emitting Tips During Integral Operation of Field Emission Arrays}, series = {2023 IEEE 36th International Vacuum Nanoelectronics Conference (IVNC), 10-13 July 2023, Cambridge, MA, USA}, booktitle = {2023 IEEE 36th International Vacuum Nanoelectronics Conference (IVNC), 10-13 July 2023, Cambridge, MA, USA}, publisher = {IEEE}, isbn = {979-8-3503-0143-4}, doi = {10.1109/IVNC57695.2023.10188957}, pages = {224 -- 226}, abstract = {Emission uniformity mappings of field emitter arrays provide important insight into degradation mechanisms, but are often laborious, non-integral, costly, or not quantifiable. Here, a low-cost Raspberry Pi HQ camera is used as an extraction anode to quantify the emission distribution in field emitter arrays. A verification measurement using controlled SEM electron beams proves, that current-voltage characteristics of individual emission sites can be determined by combining the integral electrical data with the image data. The characteristics are used to quantify the field enhancement factors of an 30x30 silicon field emitter array during integral operation. Comparison of the field enhancement factor distributions before and after a one-hour constant current operation at 1 µA shows an increase from 50 actively emitting tips before to 156 after the measurement. It is shown, that the distribution of field enhancement factors shifts towards lower values, due to the increasing degradation for high field enhancement tips, especially above 1500.}, language = {en} } @inproceedings{DamsPrommesbergerSchreiner, author = {Dams, Florian and Prommesberger, Christian and Schreiner, Rupert}, title = {Fabrication process of silicon-tip-arrays for field emission applications}, series = {24th International Vacuum Nanoelectronics Conference (IVNC), 2011 : 18 - 22 July 2011, Historische Stadthalle Wuppertal, Germany}, booktitle = {24th International Vacuum Nanoelectronics Conference (IVNC), 2011 : 18 - 22 July 2011, Historische Stadthalle Wuppertal, Germany}, publisher = {IEEE}, isbn = {978-3-00-035081-8}, issn = {2380-6311}, pages = {49 -- 50}, abstract = {A micromachined process to assemble homogeneous and reproducible tip arrays for field emission applications is developed and characterized. As substrate material p- as well as n-doped silicon is used. Lateral position of the tips is defined by structuring silicon dioxide to discs in a photolithographic process. Vertical structure of the tips is defined by a combination of RIE dry etching with controlled anisotropy and thermally oxidization of silicon in order to sharpen the tips. Hence field emitter arrays (FEAs) can be assembled both as bare and coated cathodes. To assemble field emission diodes, this fabrication process allows placing a metal anode in a micrometer order distance to the tips by a self-aligning procedure. The anode is placed in an evaporation process whereupon sharpening oxide is used as isolator between anode and cathode. Electrical characterization of the cathodes showed very good homogeneity, well alignment and stability over time of emission current from all tips (i.e. 100\% efficiency).}, language = {en} }