@inproceedings{SerbunNavitskiMuelleretal., author = {Serbun, Pavel and Navitski, Aliaksandr and M{\"u}ller, G{\"u}nter and Schreiner, Rupert and Prommesberger, Christian and Langer, Christoph and Dams, Florian}, title = {Scaling of the field emission current from B-doped Si-tip arrays}, series = {25th International Vacuum Nanoelectronics Conference (IVNC) ; Jeju, Korea (South), 09.07.2012 - 13.07.2012}, booktitle = {25th International Vacuum Nanoelectronics Conference (IVNC) ; Jeju, Korea (South), 09.07.2012 - 13.07.2012}, publisher = {IEEE}, address = {Piscataway, N.J.}, isbn = {978-1-4673-1984-3}, issn = {2380-6311}, doi = {10.1109/IVNC.2012.6316965}, pages = {1 -- 2}, abstract = {We have fabricated a test chip with various hexagonal arrays of B-doped Si tips (height ~ 3 μm, apex radius <; 30 nm, number 1-4447, resistivity 4 Ωcm, 100 orientation) in triangular arrangement (pitch 10 μm, density 1.16×10 6 cm -2 ) in order to systematically investigate the field emission current scaling with the number N of tips. Regulated voltage scans for 1 nA revealed rather efficient emission from nearly all tips of the arrays at an average field of 15 V/μm. The expected current plateau was always obtained at fields around 20 V/μm, but its width strongly increased with N. In this carrier depletion range, the single tip provided a much higher stability (<; 5\%) of the current (2-3 nA) than at lower (>; 50 \%) and higher currents (>; 30\%). Integral current measurements of the hexagonal arrays resulted in a statistically improved current stability (<; 1\%) but only a weak increase of the total current with N 0.28 yet. These results will be discussed with respect to the remaining inhomogeneity of the tips.}, language = {en} } @inproceedings{SchreinerLangerPrommesbergeretal., author = {Schreiner, Rupert and Langer, Christoph and Prommesberger, Christian and Ławrowski, Robert Damian and Dams, Florian and Bachmann, Michael and D{\"u}sberg, F. and Hofmann, Martin and Pahlke, Andreas and Serbun, Pavel and Mingels, Stephan and M{\"u}ller, G{\"u}nter}, title = {Semiconductor field emission electron sources using a modular system concept for application in sensors and x-ray-sources}, series = {2015 28th International Vacuum Nanoelectronics Conference (IVNC), 13-17 July 2015, Guangzhou, China}, booktitle = {2015 28th International Vacuum Nanoelectronics Conference (IVNC), 13-17 July 2015, Guangzhou, China}, publisher = {IEEE}, doi = {10.1109/IVNC.2015.7225572}, pages = {178 -- 179}, abstract = {Semiconductor field emitters are suitable candidates for applications, which require a very stable field emission (FE) current and a high emission uniformity over the entire emission area. By using different materials and geometries, we are able to vary the FE characteristics within a wide range. Each specific application requires its own optimized design for the cathode as well as for the other parts of the FE electron source. To meet as many of these requirements as possible while using only a limited number of different prefabricated components, we established a modular system concept for our FE electron source. This allows the implementation of almost every cathode material. For first characterizations, we used gated p-type Si cathodes with 16 tips. We obtained stable FE currents of 0.4 μA for a grid-potential of 400 V and a gate potential of 100 V. Almost 100\% of the electrons are emitted towards the grid-electrode. Parasitic leakage paths, as well as the electron emission towards the gate-electrode can be neglected. Approximately 10\% of the electrons are transmitted through the grid and reach the external anode. This is in good agreement with the optical transmission through the grid-mesh.}, language = {en} } @inproceedings{ŁawrowskiLangerPrommesbergeretal., author = {Ławrowski, Robert Damian and Langer, Christoph and Prommesberger, Christian and Dams, Florian and Bachmann, Michael and Schreiner, Rupert}, title = {Fabrication and simulation of silicon structures with high aspect ratio for field emission devices}, series = {2014 27th International Vacuum Nanoelectronics Conference (IVNC), 6-10 July 2014, Engelberg, Switzerland}, booktitle = {2014 27th International Vacuum Nanoelectronics Conference (IVNC), 6-10 July 2014, Engelberg, Switzerland}, publisher = {IEEE}, doi = {10.1109/IVNC.2014.6894805}, pages = {193 -- 194}, abstract = {To obtain higher field enhancement factors of Si-tip structures, we present an improved fabrication process utilizing reactive-ion etching (RIE) with an inductively coupled plasma (ICP). In our design, a pillar under the tips is realized by a combination of RIE with ICP. With adjusted power settings (≈ 240 W) and step times (<; 5 s), vertical slopes with a low roughness of approximately 10 nm to 20 nm are possible. The remaining silicon is oxidized thermally to sharpen the emitters. A final tip radius of R <; 20 nm is obtained for the tips of the emitters. The pillar height HP can be mainly adjusted by the duration of the ICP-etching step. A total emitter height of H ≈ 6 μm with a pillar height of HP ≈ 5 μm is achieved. Simulations with COMSOL Multiphysics® are applied to calculate the field enhancement factor β. A two-dimensional model is used in rotational symmetry. In addition to the previous model, a pillar with a varying diameter {\O}P and height HP is added. A conventional emitter (H = 1 μm and R = 20 nm) placed on a pillar of the height HP ≈ 5 μm approximately results in a three times higher β-factor (β≈ 105). By decreasing the diameter {\O}P a slight increase of the β-factor is observed. However, the aspect ratio of the emitter mainly influences on the β-factor.}, language = {en} }