@inproceedings{DamsPrommesbergerSchreiner, author = {Dams, Florian and Prommesberger, Christian and Schreiner, Rupert}, title = {Fabrication process of silicon-tip-arrays for field emission applications}, series = {24th International Vacuum Nanoelectronics Conference (IVNC), 2011 : 18 - 22 July 2011, Historische Stadthalle Wuppertal, Germany}, booktitle = {24th International Vacuum Nanoelectronics Conference (IVNC), 2011 : 18 - 22 July 2011, Historische Stadthalle Wuppertal, Germany}, publisher = {IEEE}, isbn = {978-3-00-035081-8}, issn = {2380-6311}, pages = {49 -- 50}, abstract = {A micromachined process to assemble homogeneous and reproducible tip arrays for field emission applications is developed and characterized. As substrate material p- as well as n-doped silicon is used. Lateral position of the tips is defined by structuring silicon dioxide to discs in a photolithographic process. Vertical structure of the tips is defined by a combination of RIE dry etching with controlled anisotropy and thermally oxidization of silicon in order to sharpen the tips. Hence field emitter arrays (FEAs) can be assembled both as bare and coated cathodes. To assemble field emission diodes, this fabrication process allows placing a metal anode in a micrometer order distance to the tips by a self-aligning procedure. The anode is placed in an evaporation process whereupon sharpening oxide is used as isolator between anode and cathode. Electrical characterization of the cathodes showed very good homogeneity, well alignment and stability over time of emission current from all tips (i.e. 100\% efficiency).}, language = {en} } @inproceedings{NavitskiSerbunMuelleretal., author = {Navitski, Aliaksandr and Serbun, Pavel and M{\"u}ller, G{\"u}nter and Schreiner, Rupert and Dams, Florian}, title = {Efficient and reliable field emission from silicon tip arrays for miniaturized electron sources}, series = {2011 24th International Vacuum Nanoelectronics Conference ; 18-22 July 2011 Wuppertal}, booktitle = {2011 24th International Vacuum Nanoelectronics Conference ; 18-22 July 2011 Wuppertal}, publisher = {IEEE}, address = {Piscataway, NJ}, isbn = {978-3-00-035081-8}, issn = {2380-6311}, pages = {71 -- 72}, abstract = {Silicon-based cathodes with precisely aligned field emitter arrays (FEA) applicable for miniaturized electron sources were successfully developed and fabricated. The cathode chips contain about 3×105 Si tips/cm2 in a triangular array with a tip height of 2.5 μm, tip radius of 20 nm, and lateral distance between tips of 20 μm. Amazingly homogeneous and well-aligned field emission (FE) from all tips (i.e. 100\% efficiency) and maximum stable currents of typically 0.1 μA for p- and 0.6 μA for n-type Si were reproducibly achieved. Current-voltage characteristics of p-type Si tips exhibit the expected saturation at around 10 nA due to limited supply of electrons from a depletion layer, while the n-type Si tips show the usual FN behaviour. Additional coating of the Si tips with a 10 nm Au layer resulted in at least 5 times higher average FE current levels i.e. typically 3 μA but lead, however, to a 30\% increase of the onset voltage.}, language = {en} } @inproceedings{LangerŁawrowskiPrommesbergeretal., author = {Langer, Christoph and Ławrowski, Robert Damian and Prommesberger, Christian and Dams, Florian and Serbun, Pavel and Bachmann, Michael and M{\"u}ller, G{\"u}nter and Schreiner, Rupert}, title = {High aspect ratio silicon tip cathodes for application in field emission electron sources}, series = {2014 27th International Vacuum Nanoelectronics Conference (IVNC), 6-10 July 2014, Engelberg, Switzerland}, booktitle = {2014 27th International Vacuum Nanoelectronics Conference (IVNC), 6-10 July 2014, Engelberg, Switzerland}, publisher = {IEEE}, doi = {10.1109/IVNC.2014.6894824}, pages = {222 -- 223}, abstract = {Precisely aligned arrays of sharp tip structures on top of elongated pillars were realized by using an improved fabrication process including an additional inductively-coupled-plasma reactive-ion etching step. Arrays of n-type and p-type silicon with 271 tips have been fabricated and investigated. Those structures have a total height of 5-6 µm and apex radii less than 20nm. Integral field emission measurements of the arrays yielded low onset-fields in the range of 8-12V=µm and field enhancement factors between 300 and 700. The I-E curves of n-type structures showed the usual Fowler-Nordheim behaviour, whereas p-type structures revealed a significant saturation region due to the limited number of electrons in the conduction band and a further carrier depletion effect caused by the pillar. The maximum integral current in the saturation region was 150 nA at fields above 30V=µm. An excellent stability of the emission current of less than ± 2\% fluctuation was observed in the saturation region. For n-type Si a maximum integral current of 10 µA at 24V=µm and an average current stability with a fluctuation of ± 50\% were measured.}, language = {en} } @inproceedings{PrommesbergerLangerŁawrowskietal., author = {Prommesberger, Christian and Langer, Christoph and Ławrowski, Robert Damian and Dams, Florian and Schreiner, Rupert and Ławrowski, Robert Damian}, title = {Gated p-Si field emitter arrays for sensor applications}, series = {2015 28th International Vacuum Nanoelectronics Conference (IVNC)}, booktitle = {2015 28th International Vacuum Nanoelectronics Conference (IVNC)}, publisher = {IEEE}, doi = {10.1109/IVNC.2015.7225567}, pages = {164 -- 165}, abstract = {We report on gated p-type Si-tip array cathodes for implementation into field emission electron sources for sensor applications. Arrays of 16 and 100 tips with tip heights of 3 μm and tip radii below 30 nm with integrated gate electrodes concentrically positioned 2 μm below the tip apexes were fabricated using an improved process, which leads to an enhanced isolation layer quality with sufficient breakdown field strengths and low leakage currents. Integral measurements with a fixed grid potential of 400 V showed emission currents up to 35 μA for 100 tips at a cathode voltage of 150 V and an almost negligible parasitic gate current. The array with 16 p-type Si-tips showed a significant stabilization of the emission current in the range of 0.3 - 0.4 μA, for cathode voltages between 90 V and 150 V. The current fluctuation in this saturation regime was measured for 10 minutes and a value of less than ± 1\% was observed. No degradation of the cathode was found after 6 hours of operation at a constant cathode voltage of 100 V and a constant grid voltage of 400 V.}, language = {en} } @inproceedings{ŁawrowskiLangerPrommesbergeretal., author = {Ławrowski, Robert Damian and Langer, Christoph and Prommesberger, Christian and Dams, Florian and Bachmann, Michael and Schreiner, Rupert}, title = {Fabrication and simulation of silicon structures with high aspect ratio for field emission devices}, series = {2014 27th International Vacuum Nanoelectronics Conference (IVNC), 6-10 July 2014, Engelberg, Switzerland}, booktitle = {2014 27th International Vacuum Nanoelectronics Conference (IVNC), 6-10 July 2014, Engelberg, Switzerland}, publisher = {IEEE}, doi = {10.1109/IVNC.2014.6894805}, pages = {193 -- 194}, abstract = {To obtain higher field enhancement factors of Si-tip structures, we present an improved fabrication process utilizing reactive-ion etching (RIE) with an inductively coupled plasma (ICP). In our design, a pillar under the tips is realized by a combination of RIE with ICP. With adjusted power settings (≈ 240 W) and step times (<; 5 s), vertical slopes with a low roughness of approximately 10 nm to 20 nm are possible. The remaining silicon is oxidized thermally to sharpen the emitters. A final tip radius of R <; 20 nm is obtained for the tips of the emitters. The pillar height HP can be mainly adjusted by the duration of the ICP-etching step. A total emitter height of H ≈ 6 μm with a pillar height of HP ≈ 5 μm is achieved. Simulations with COMSOL Multiphysics® are applied to calculate the field enhancement factor β. A two-dimensional model is used in rotational symmetry. In addition to the previous model, a pillar with a varying diameter {\O}P and height HP is added. A conventional emitter (H = 1 μm and R = 20 nm) placed on a pillar of the height HP ≈ 5 μm approximately results in a three times higher β-factor (β≈ 105). By decreasing the diameter {\O}P a slight increase of the β-factor is observed. However, the aspect ratio of the emitter mainly influences on the β-factor.}, language = {en} } @inproceedings{PrommesbergerLangerŁawrowskietal., author = {Prommesberger, Christian and Langer, Christoph and Ławrowski, Robert Damian and Muller, F. and Dams, Florian and Schreiner, Rupert and Serbun, Pavel and M{\"u}ller, G{\"u}nter}, title = {Comparison of integral and local field-emission properties of Mo-coated p-Si tip arrays}, series = {2015 28th International Vacuum Nanoelectronics Conference (IVNC), 13-17 July 2015, Guangzhou, China}, booktitle = {2015 28th International Vacuum Nanoelectronics Conference (IVNC), 13-17 July 2015, Guangzhou, China}, publisher = {IEEE}, doi = {10.1109/IVNC.2015.7225579}, pages = {192 -- 193}, abstract = {Silicon tip arrays were fabricated by means of reactive ion etching followed by oxidation for final sharpening and molybdenum thin film coating. The field-emission (FE) properties of these Mo-coated p-Si tip arrays were systemically investigated by different measurement techniques. Integral measurements in diode configuration yielded a turn-on field (for 1 nA) of 22 V/μm and nearly stable FE currents up to 6.6 μA at 38 V/μm. The effective field enhancements factor extracted from the FN plots is about 180. Detailed investigations of these FE arrays were also performed by means of field emission scanning microscopy combined with electron microscopy. A rather limited efficiency of the tips (50\% at 1500 V) and FE homogeneity (180 nA at 700 V) might be correlated with the varying morphology of the tips and the presence of oxides. Local I-V measurements of selected single tips revealed both activation and deactivation effects, which finally resulted in nearly reproducible I-V curves. Current stability measurements at a constant voltage showed rather large fluctuations (0.1-1 μA) of the FE current, which could be reduced up to 1.7\% by using of a PID-regulated voltage source. SEM images showed unchanged tip shape after the current processing.}, language = {en} } @article{SchreinerLangerPrommesbergeretal., author = {Schreiner, Rupert and Langer, Christoph and Prommesberger, Christian and Dams, Florian}, title = {Compact and Energy-Efficient Field Emission Cathodes for Sensor Applications}, series = {Advanced Materials Research}, volume = {1024}, journal = {Advanced Materials Research}, publisher = {Scientific.net}, doi = {10.4028/www.scientific.net/amr.1024.372}, pages = {372 -- 375}, abstract = {We report on miniaturized silicon field emitter arrays for the application in compact and energy-saving vacuum-microelectronic devices, e.g. sensors or x-ray tubes. Since standard silicon semiconductor technology has been used for the fabrication, they may be easily integrated with other silicon based circuits and devices on the same chip. The silicon tip geometry and the operating conditions were optimized in order to obtain highly uniform and stable electron field emission from large area cathode arrays. A series of uniform hexagonal tip arrays containing each 547 tips were fabricated and characterized. The electron emission properties of both individual tips as well as of complete emitter arrays were investigated. A saturation level in the voltage-current characteristics was found, which can be explained by the limitation of the supply of electrons due to the p-type silicon wafer material. When operating the arrays in the current saturation regime at an emission current of ~ 1 nA per tip, a highly stable and low noise emission can be observed.}, language = {en} } @inproceedings{SerbunPorshynMuelleretal., author = {Serbun, Pavel and Porshyn, Vitali and M{\"u}ller, G{\"u}nter and Mingels, Stephan and L{\"u}tzenkirchen-Hecht, Dirk and Bachmann, Michael and D{\"u}sberg, Felix and Dams, Florian and Hofmann, Martin and Pahlke, Andreas and Prommesberger, Christian and Langer, Christoph and Ławrowski, Robert Damian and Schreiner, Rupert}, title = {Field emission behavior of Au-tip-coated p-type Si pillar structures}, series = {29th International Vacuum Nanoelectronics Conference (IVNC), 2016, 11-15 July, Vancouver, BC, Canada}, booktitle = {29th International Vacuum Nanoelectronics Conference (IVNC), 2016, 11-15 July, Vancouver, BC, Canada}, publisher = {IEEE}, issn = {2380-6311}, doi = {10.1109/IVNC.2016.7551516}, pages = {181 -- 182}, abstract = {Precisely aligned high-aspect-ratio (HAR) silicon tip arrays were fabricated using enhanced reactive ion etching with an inductively-coupled-plasma followed by a sharpening oxidation. A gold thin film was then sputtered only on the tips of the HAR structures. Field-emission (FE) properties from Au-coated HAR p-Si tip array cathodes have been systematically investigated by means of field emission scanning microscopy (FESM). A rather high efficiency of the HAR Si structures (71\% at 550 V), but limited homogeneous FE with currents of 1-600 nA might be correlated with the varying geometry of the tips and the presence of oxides. I-V measurements of single Au-coated HAR emitters revealed activation effects and the saturation current region at 3 nA. An increase of the saturation current by 4 orders of magnitude was observed during 20 hours of conditioning at constant voltage, which finally resulted in nearly reproducible FN curves with a ß-factor of 473. An excellent stability of the emission current of less than 1 \% was obtained during the additional long-time conditioning at constant voltage. Optical switching under halogen lamp illumination resulted in at least 2 times higher saturation currents and showed a linear dependence of the FE current on the light color temperature.}, language = {en} }