@inproceedings{HerdlKueddelsmannSchelsetal., author = {Herdl, Florian and Kueddelsmann, Maximillian J. and Schels, Andreas and Bachmann, Michael and Edler, Simon and Wohlfartsst{\"a}tter, Dominik and D{\"u}sberg, Felix and Prugger, Alexander and Dillig, Michael and Dams, Florian and Schreiner, Rupert and Coile{\´a}in, Cormac {\´O}. and Zimmermann, Stefan and Pahlke, Andreas and Duesberg, Georg S.}, title = {Characterization and Operation of Graphene-Oxide-Semiconductor Emitters at Atmospheric Pressure Levels}, series = {2023 IEEE 36th International Vacuum Nanoelectronics Conference (IVNC), 10-13 July 2023, Cambridge, MA, USA}, booktitle = {2023 IEEE 36th International Vacuum Nanoelectronics Conference (IVNC), 10-13 July 2023, Cambridge, MA, USA}, publisher = {IEEE}, isbn = {979-8-3503-0143-4}, doi = {10.1109/IVNC57695.2023.10188974}, pages = {14 -- 16}, abstract = {In recent years Graphene-Oxide-Semiconductor (GOS) electron emitters have attracted a lot of interest due to their outstanding durability in modest vacuum conditions. However, the performance at ambient pressure remains largely unexplored. In this study GOS-emitters are characterized in nitrogen and air at atmospheric pressure, and compared with their vacuum characteristics. For this purpose, lifetime and IV-characteristics measurements are shown. Furthermore, the GOS-emitter was operated as an ionization source for ion mobility spectrometry (IMS) at ambient conditions.}, language = {en} } @inproceedings{LangerPrommesbergerDamsetal., author = {Langer, Christoph and Prommesberger, Christian and Dams, Florian and Serbun, Pavel and Bornmann, Benjamin and Mingels, Stephan and M{\"u}ller, G{\"u}nter and Schreiner, Rupert}, title = {Si-Feldemissionskathoden f{\"u}r Anwendungen in miniaturisierten Ionisationsvakuumsensoren}, series = {Verhandlungen der Deutschen Physikalischen Gesellschaft e.V. (DPG), Regensburg, 10. - 15. M{\"a}rz 2013}, booktitle = {Verhandlungen der Deutschen Physikalischen Gesellschaft e.V. (DPG), Regensburg, 10. - 15. M{\"a}rz 2013}, publisher = {Deutsche Physikalische Gesellschaft e.V.}, abstract = {Feldemissionselektronenquellen sind aufgrund ihrer prinzipiellen Vorteile gegen{\"u}ber Gl{\"u}hkathoden bereits seit l{\"a}ngerer Zeit Gegenstand der Forschung und werden bisher nur in einigen Spezialanwendungen erfolgreich eingesetzt. Hierbei werden Einzelspitzen mit Spannungen im kV-Bereich und Str{\"o}men im nA-Bereich betrieben. Dagegen werden f{\"u}r miniaturisierte Sensorsysteme eher Spannungen von ca. 100 V und Str{\"o}me von ca. 1 mA ben{\"o}tigt. Dazu wurden bisher meist Feldemissionskathoden mit CNTs vorgeschlagen, welche f{\"u}r Anwendungen in der Halbleiterindustrie aufgrund des Kohlenstoffanteils nicht erw{\"u}nscht sind. Ziel unserer Arbeit ist es, Si-basierte Elektronenquellen zu realisieren, die mit anderen miniaturisierten Vakuumsensoren auf einem Chip integrierbar sind. Mithilfe eines optimierten Herstellungsprozesses konnten wir p-Si-Spitzenarrays mit Spitzenradien von wenigen nm realisieren [1]. Messungen an diesen Strukturen zeigen ein sehr homogenes Emissionsverhalten, das vor allem im S{\"a}ttigungsbereich bei Emissionsstr{\"o}men von ca. 10 nA pro Spitze zeitlich stabil (Schwankungen < 5 \%) und optisch schaltbar (Faktor > 2.5) ist [2].}, language = {de} } @article{BornmannMingelsDamsetal., author = {Bornmann, Benjamin and Mingels, Stephan and Dams, Florian and Prommesberger, Christian and Schreiner, Rupert and L{\"u}tzenkirchen-Hecht, Dirk and M{\"u}ller, G{\"u}nter}, title = {Electron spectrometer in adjustable triode configuration for photo-induced field emission measurements}, series = {The Review of scientific instruments}, volume = {83}, journal = {The Review of scientific instruments}, number = {1}, publisher = {American Institute of Physics}, address = {Melville, NY}, doi = {10.1063/1.3673475}, abstract = {We have constructed a new ultrahigh vacuum apparatus with a triode configuration for the systematic investigation of photo-induced field emission (PFE) from metallic or semiconducting cathodes. These are exposed to electric fields up to 400 MV∕m and laser irradiation by means of hole or mesh gates. Cathodes and gates are in situ exchangeable and adjustable with high precision to ensure a homogeneous extraction of electrons which are partially transmitted to the fixed electron spectrometer. Its hemispherical sector analyzer provides an energy resolution limit of 8 meV. The commissioning of the measurement system has been performed with a tungsten needle. Its temperature showed up in the high-energy tail of the electron spectrum, while its work function was derived from the spectral low-energy part combined with the integral current-voltage curve. First PFE measurements on B-doped Si-tip arrays yielded a small field emission current increase under green laser illumination. A shift and splitting of the energy spectra was observed which revealed different emission regimes as well as the photosensitivity of the cathode due to carrier excitation into the conduction band. For the full exploitation of the PFE system, a tunable laser over a wide eV-range is required.}, language = {en} } @inproceedings{PrommesbergerDamsLangeretal., author = {Prommesberger, Christian and Dams, Florian and Langer, Christoph and Schreiner, Rupert and Rutkowski, S. and Bornmann, Benjamin and M{\"u}ller, G{\"u}nter}, title = {Simulation of electron trajectories of a field emission electron source in triode configuration by using finite element methods}, series = {24th International Vacuum Nanoelectronics Conference (IVNC), 2011 : 18 - 22 July 2011, Historische Stadthalle Wuppertal, Germany}, booktitle = {24th International Vacuum Nanoelectronics Conference (IVNC), 2011 : 18 - 22 July 2011, Historische Stadthalle Wuppertal, Germany}, publisher = {IEEE}, address = {Piscataway, NJ}, isbn = {978-3-00-035081-8}, issn = {2380-6311}, pages = {144 -- 145}, abstract = {The finite element simulation program COMSOL Multiphysics® was used to simulate the emission efficiency of a silicon tip electron source in triode configuration for different geometries and electrode potentials. The simulation predicts a maximum emission efficiency of 84\% for an optimized structure. In a second simulation a gate electrode was concentrically arranged above a single CNT column. Here, the efficiency was simulated as a function of gate hole geometry, electrode potentials and distances between the electrodes. The simulation shows that a conical shape of the gate hole results in an efficiency up to nearly 100\%.}, language = {en} } @inproceedings{BornmannMingelsSerbunetal., author = {Bornmann, Benjamin and Mingels, Stephan and Serbun, Pavel and L{\"u}tzenkirchen-Hecht, Dirk and M{\"u}ller, G{\"u}nter and Prommesberger, Christian and Langer, Christoph and Dams, Florian and Schreiner, Rupert}, title = {Photosensitivity of electron field emission from B-doped Si-tip arrays}, series = {25th International Vacuum Nanoelectronics Conference (IVNC) ; Jeju, Korea (South), 09.07.2012 - 13.07.2012}, booktitle = {25th International Vacuum Nanoelectronics Conference (IVNC) ; Jeju, Korea (South), 09.07.2012 - 13.07.2012}, publisher = {IEEE}, isbn = {978-1-4673-1984-3}, issn = {2380-6311}, doi = {10.1109/IVNC.2012.6316980}, pages = {1 -- 2}, abstract = {The electron current from field-emitting B-doped Si-tip arrays under illumination was studied. An improved cathode design with a patch of 271 tips yielded a reproducible cathode current between 0.2-2000 nA in the electric field range of 3.8-6.6 V/μm. The plateau in the Fowler-Nordheim plot shows the actual carrier depletion and leads to a very stable emission at ~1 μA with a current noise of less than 3.3 \%. Color-filtered halogen lamp illumination was used to investigate the photo-sensitivity of the saturation current. The intensity-normalized current switching ratio increases nonlinearly with the photon energy. This hints either for secondary generation in the conduction band or deeper valence band excitation. The first is supported by a rough estimation of the quantum efficiency. Further experiments with a tunable laser and electron spectroscopy are planned.}, language = {en} } @inproceedings{BornmannMingelsLuetzenkirchenHechtetal., author = {Bornmann, Benjamin and Mingels, Stephan and L{\"u}tzenkirchen-Hecht, Dirk and M{\"u}ller, G{\"u}nter and Dams, Florian and Schreiner, Rupert}, title = {Field emission spectroscopy studies on photo-sensitive p-doped Si-tip arrays}, series = {24th International Vacuum Nanoelectronics Conference (IVNC), 2011 : 18 - 22 July 2011, Historische Stadthalle Wuppertal, Germany}, booktitle = {24th International Vacuum Nanoelectronics Conference (IVNC), 2011 : 18 - 22 July 2011, Historische Stadthalle Wuppertal, Germany}, publisher = {IEEE}, isbn = {978-3-00-035081-8}, issn = {2380-6311}, pages = {101 -- 102}, abstract = {The influence of laser illumination on the integral as well as on the energy-resolved electron currents from well-defined p-doped Si-tip arrays was investigated. First results have provided stable cathode currents between 100 nA and 500 μA in a field range of 2-20 V/μm. Green laser illumination resulted in an enhanced cathode current and an increased population of the conduction band which can be seen in the spectra. Charging of the cathode surface, however, leads to a shift and broadening of the spectra which complicate their analysis. Therefore, further experiments with a rotatable cathode and a varying number of tips as well as with a tunable laser are planned.}, language = {en} } @inproceedings{DamsPrommesbergerSchreiner, author = {Dams, Florian and Prommesberger, Christian and Schreiner, Rupert}, title = {Fabrication process of silicon-tip-arrays for field emission applications}, series = {24th International Vacuum Nanoelectronics Conference (IVNC), 2011 : 18 - 22 July 2011, Historische Stadthalle Wuppertal, Germany}, booktitle = {24th International Vacuum Nanoelectronics Conference (IVNC), 2011 : 18 - 22 July 2011, Historische Stadthalle Wuppertal, Germany}, publisher = {IEEE}, isbn = {978-3-00-035081-8}, issn = {2380-6311}, pages = {49 -- 50}, abstract = {A micromachined process to assemble homogeneous and reproducible tip arrays for field emission applications is developed and characterized. As substrate material p- as well as n-doped silicon is used. Lateral position of the tips is defined by structuring silicon dioxide to discs in a photolithographic process. Vertical structure of the tips is defined by a combination of RIE dry etching with controlled anisotropy and thermally oxidization of silicon in order to sharpen the tips. Hence field emitter arrays (FEAs) can be assembled both as bare and coated cathodes. To assemble field emission diodes, this fabrication process allows placing a metal anode in a micrometer order distance to the tips by a self-aligning procedure. The anode is placed in an evaporation process whereupon sharpening oxide is used as isolator between anode and cathode. Electrical characterization of the cathodes showed very good homogeneity, well alignment and stability over time of emission current from all tips (i.e. 100\% efficiency).}, language = {en} } @inproceedings{ŁawrowskiPrommesbergerLangeretal., author = {Ławrowski, Robert Damian and Prommesberger, Christian and Langer, Christoph and Dams, Florian and Schreiner, Rupert}, title = {Influence of reactive ion etching parameters on the geometry of silicon tip cathodes for field emission}, series = {Applied Research Conference 2013, ARC 2013 : 17th and 18th October 2013, Deggendorf}, booktitle = {Applied Research Conference 2013, ARC 2013 : 17th and 18th October 2013, Deggendorf}, publisher = {Shaker}, address = {Aachen}, isbn = {978-3-8440-2274-2}, pages = {67 -- 69}, language = {en} } @inproceedings{NavitskiSerbunMuelleretal., author = {Navitski, Aliaksandr and Serbun, Pavel and M{\"u}ller, G{\"u}nter and Schreiner, Rupert and Dams, Florian}, title = {Efficient and reliable field emission from silicon tip arrays for miniaturized electron sources}, series = {2011 24th International Vacuum Nanoelectronics Conference ; 18-22 July 2011 Wuppertal}, booktitle = {2011 24th International Vacuum Nanoelectronics Conference ; 18-22 July 2011 Wuppertal}, publisher = {IEEE}, address = {Piscataway, NJ}, isbn = {978-3-00-035081-8}, issn = {2380-6311}, pages = {71 -- 72}, abstract = {Silicon-based cathodes with precisely aligned field emitter arrays (FEA) applicable for miniaturized electron sources were successfully developed and fabricated. The cathode chips contain about 3×105 Si tips/cm2 in a triangular array with a tip height of 2.5 μm, tip radius of 20 nm, and lateral distance between tips of 20 μm. Amazingly homogeneous and well-aligned field emission (FE) from all tips (i.e. 100\% efficiency) and maximum stable currents of typically 0.1 μA for p- and 0.6 μA for n-type Si were reproducibly achieved. Current-voltage characteristics of p-type Si tips exhibit the expected saturation at around 10 nA due to limited supply of electrons from a depletion layer, while the n-type Si tips show the usual FN behaviour. Additional coating of the Si tips with a 10 nm Au layer resulted in at least 5 times higher average FE current levels i.e. typically 3 μA but lead, however, to a 30\% increase of the onset voltage.}, language = {en} } @inproceedings{SchreinerDamsPrommesbergeretal., author = {Schreiner, Rupert and Dams, Florian and Prommesberger, Christian and Bornmann, Benjamin and Serbun, Pavel and Navitski, Aliaksandr and M{\"u}ller, G{\"u}nter}, title = {Silicon-based integrated field emission electron sources for sensor application}, series = {24th International Vacuum Nanoelectronics Conference (IVNC), 2011 : 18 - 22 July 2011, Wuppertal, Germany}, booktitle = {24th International Vacuum Nanoelectronics Conference (IVNC), 2011 : 18 - 22 July 2011, Wuppertal, Germany}, publisher = {IEEE}, address = {Piscataway, NJ}, pages = {19 -- 20}, abstract = {We report on the design, fabrication and characterization of p-type silicon field emitter arrays for the application in compact fast switchable electron sources. Since standard silicon technology has been used to prepare the devices, they can be easily integrated with other silicon based sensors and electronic components, too. The emitter arrays consist of approx. 3×105 tips per cm2, with a tip radius less than 20 nm. By using self-aligned processes, an integrated gate electrode with a diameter of  3 μm was placed concentrically around the tips. A mesh of silicon-beams with a grating period of 100 μm and beam width of 20 μm forms the anode of the electron source. A glass wafer (thickness 300 μm) acts as spacer between anode and Si-tip cathode. Characterization of the field emission properties of the emitter arrays was performed by high resolution field emission scanning microscopy. The emitter arrays exhibit a highly stable and very homogeneous emission. A maximum stable current of 0.1 μA per tip was found. A saturation level in the voltage current characteristics, which was found at around 10 nA, supports current stabilisation and will enable optical modulation of the emission current.}, language = {en} } @inproceedings{SerbunNavitskiMuelleretal., author = {Serbun, Pavel and Navitski, Aliaksandr and M{\"u}ller, G{\"u}nter and Schreiner, Rupert and Prommesberger, Christian and Langer, Christoph and Dams, Florian}, title = {Scaling of the field emission current from B-doped Si-tip arrays}, series = {25th International Vacuum Nanoelectronics Conference (IVNC) ; Jeju, Korea (South), 09.07.2012 - 13.07.2012}, booktitle = {25th International Vacuum Nanoelectronics Conference (IVNC) ; Jeju, Korea (South), 09.07.2012 - 13.07.2012}, publisher = {IEEE}, address = {Piscataway, N.J.}, isbn = {978-1-4673-1984-3}, issn = {2380-6311}, doi = {10.1109/IVNC.2012.6316965}, pages = {1 -- 2}, abstract = {We have fabricated a test chip with various hexagonal arrays of B-doped Si tips (height ~ 3 μm, apex radius <; 30 nm, number 1-4447, resistivity 4 Ωcm, 100 orientation) in triangular arrangement (pitch 10 μm, density 1.16×10 6 cm -2 ) in order to systematically investigate the field emission current scaling with the number N of tips. Regulated voltage scans for 1 nA revealed rather efficient emission from nearly all tips of the arrays at an average field of 15 V/μm. The expected current plateau was always obtained at fields around 20 V/μm, but its width strongly increased with N. In this carrier depletion range, the single tip provided a much higher stability (<; 5\%) of the current (2-3 nA) than at lower (>; 50 \%) and higher currents (>; 30\%). Integral current measurements of the hexagonal arrays resulted in a statistically improved current stability (<; 1\%) but only a weak increase of the total current with N 0.28 yet. These results will be discussed with respect to the remaining inhomogeneity of the tips.}, language = {en} } @inproceedings{LangerPrommesbergerDamsetal., author = {Langer, Christoph and Prommesberger, Christian and Dams, Florian and Schreiner, Rupert}, title = {Theoretical investigations into the field enhancement factor of silicon structures}, series = {25th International Vacuum Nanoelectronics Conference (IVNC) - Jeju, Korea (South), 09.- 13.07.2012}, booktitle = {25th International Vacuum Nanoelectronics Conference (IVNC) - Jeju, Korea (South), 09.- 13.07.2012}, publisher = {IEEE}, address = {Piscataway, N.J.}, isbn = {978-1-4673-1984-3}, issn = {2380-6311}, doi = {10.1109/IVNC.2012.6316886}, abstract = {In order to optimize our field-emitting silicon structures, the influence of geometric parameters like aspect ratio, aperture angle and curvature on the field enhancement factor was investigated by finite element simulations. A universal geometric model consisting of a rounded triangle and elliptic curvatures was taken for modeling a variety of different silicon tip as well as ridge structures. Whereas, a high dependency of the field enhancement on the aperture angle was found, the simulations show that the elliptic curvature affects the field enhancement only marginal.}, language = {en} } @incollection{ŁawrowskiPrommesbergerLangeretal., author = {Ławrowski, Robert Damian and Prommesberger, Christian and Langer, Christoph and Dams, Florian and Schreiner, Rupert}, title = {Feldemissionselektronenquellen basierend auf Siliziumemittern mit hohen Aspektverh{\"a}ltnis}, series = {Forschungsbericht der OTH Regensburg 2013}, booktitle = {Forschungsbericht der OTH Regensburg 2013}, address = {Regensburg}, pages = {47 -- 48}, language = {de} } @article{DamsNavitskiPrommesbergeretal., author = {Dams, Florian and Navitski, Aliaksandr and Prommesberger, Christian and Serbun, Pavel and Langer, Christoph and M{\"u}ller, G{\"u}nter and Schreiner, Rupert}, title = {Homogeneous Field Emission Cathodes With Precisely Adjustable Geometry Fabricated by Silicon Technology}, series = {IEEE Transactions on Electron Devices}, volume = {59}, journal = {IEEE Transactions on Electron Devices}, number = {10}, publisher = {IEEE}, issn = {0018-9383}, doi = {10.1109/TED.2012.2206598}, pages = {2832 -- 2837}, abstract = {Silicon-based cathodes with precisely aligned field emitter arrays of sharp tips applicable for miniaturized electron sources were successfully fabricated and characterized. This was made possible by an improved fabrication process using wet thermal oxidation, wet etching, and reactive-ion etching steps with adjustable anisotropy. As substrate materials, both p-doped silicon and n-doped silicon were used. The cathode chips contain about 3 × 10 5 Si tips/cm 2 in a triangular array with tip heights of 2.5 μm, tip radii of less than 30 nm, and spacing of 20 μm. Well-aligned field emission (FE) and excellent homogeneity from all tips (i.e., 100\% efficiency) and maximum stable currents of typically 0.1 μA (0.6 μA) for p (n)-type Si were reproducibly achieved. The current-voltage characteristics of the p-Si tips exhibit the expected saturation at around 10 nA with around ten times better current stability, whereas the n-Si tips show the usual Fowler-Nordheim behavior. Additional coating of the Si tips with 5-nm Cr and 10-nm Au layers resulted in improved stability and at least five times higher average FE current limits (about 3 μA) at about 30\% higher operation voltage.}, language = {en} } @article{ŁawrowskiPrommesbergerLangeretal., author = {Ławrowski, Robert Damian and Prommesberger, Christian and Langer, Christoph and Dams, Florian and Schreiner, Rupert}, title = {Improvement of Homogeneity and Aspect Ratio of Silicon Tips for Field Emission by Reactive-Ion Etching}, series = {Advances in Materials Science and Engineering. Special issue: Advances in Smart Materials and Applications}, volume = {2014}, journal = {Advances in Materials Science and Engineering. Special issue: Advances in Smart Materials and Applications}, publisher = {Hindawi}, issn = {1687-8442}, doi = {10.1155/2014/948708}, pages = {1 -- 6}, abstract = {The homogeneity of emitters is very important for the performance of field emission (FE) devices. Reactive-ion etching (RIE) and oxidation have significant influences on the geometry of silicon tips. The RIE influences mainly the anisotropy of the emitters. Pressure has a strong impact on the anisotropic factor. Reducing the pressure results in a higher anisotropy, but the etch rate is also lower. A longer time of etching compensates this effect. Furthermore an improvement of homogeneity was observed. The impact of uprating is quite low for the anisotropic factor, but significant for the homogeneity. At low power the height and undercut of the emitters are more constant over the whole wafer. The oxidation itself is very homogeneous and has no observable effect on further variation of the homogeneity. This modified fabrication process allows solving the problem of inhomogeneity of previous field emission arrays.}, language = {en} } @inproceedings{DamsSchreiner, author = {Dams, Florian and Schreiner, Rupert}, title = {A high thermal resistance MEMS-based Pirani vacuum sensor chip}, series = {Smart sensors, actuators and MEMS VI : 24 - 26 April 2013, Grenoble, France / [part of SPIE microtechnologies]}, booktitle = {Smart sensors, actuators and MEMS VI : 24 - 26 April 2013, Grenoble, France / [part of SPIE microtechnologies]}, publisher = {SPIE}, address = {Bellingham, Wash.}, doi = {10.1117/12.2017345}, abstract = {The performance of thermal conductivity vacuum gauges can be improved by a well-designed geometry. The lower measurement range limit is determined by the size of the active sensing area and the thermal conduction heat losses through the supporting structures. The upper measurement range is limited by the distance between the heated element and the cold reference plane. Silicon based MEMS-technology gives the possibility to fabricate both sensing structures with suitable areas out of low thermal conductive materials and narrow gaps in order to extend the measurement range in both directions. In this work we present a MEMS-process to fabricate high thermal resistance sensor structures. The rectangular sensitive areas are anchored by four beams and are structured out of low thermal conductive PECVD-siliconnitride films with 1 µm in thickness. The metallic heating structure is completely embedded in the SiN-layer. Both sensitive area and its support beams were released from the silicon bulk material by anisotropic underetching. In this way a free-supporting structure with a gap of 150 μm to the silicon substrate was formed. The influence of the filament geometry and temperature was systematically investigated to determine the properties of the chips as thermal conductivity vacuum gauges. The temperature of the sensitive area was held constant by a self-balancing bridge circuit and the heating power was measured by a Δ-Σ-ADC. The average solid state thermal conductivity is in the order of 106WK1. The measuring range of the most sensitive structures covers 8 orders of magnitude from 105 mbar to 1000mbar.}, language = {en} } @inproceedings{SchreinerPrommesbergerLangeretal., author = {Schreiner, Rupert and Prommesberger, Christian and Langer, Christoph and Dams, Florian and Serbun, Pavel and Bornmann, Benjamin and Navitski, Aliaksandr and M{\"u}ller, G{\"u}nter}, title = {Highly uniform and stable electron field emission from B-doped Si-tip arrays for applications in integrated vacuum microelectronic devices}, series = {25th International Vacuum Nanoelectronics Conference (IVNC) - Jeju, Korea (South), 09.07. - 13.07.2012}, booktitle = {25th International Vacuum Nanoelectronics Conference (IVNC) - Jeju, Korea (South), 09.07. - 13.07.2012}, publisher = {IEEE}, address = {Piscataway, NJ.}, isbn = {978-1-4673-1984-3}, issn = {2380-6311}, doi = {10.1109/IVNC.2012.6316857}, pages = {1 -- 2}, abstract = {In order to improve the uniformity and field emission stability of p-type silicon tip arrays for pulsed sensor applications, we have systematically studied the influence of the fabrication parameters on the tip shape and the specific operating conditions. Based on detailed design calculations of the field enhancement, we have fabricated a series of hexagonal arrays of B-doped Si-tips in a triangular arrangement, each containing a different number of tips (91, 575 and 1300) of 1 μm height, 20 nm apex radius, and 20 μm pitch. The field emission properties of both individual tips and complete arrays were investigated with by field emission scanning microscopy. The current plateaus of these tips typically occur at about 10 nA and 60 V/μm field level. In this carrier depletion range, single tips provide the highest current stability (<; 4\%) and optical current switching ratios of ~2.5. Rather homogeneous emission of the tip arrays leads to an almost linear scaling of the saturation current (2 nA/tip) and to a much improved current stability (<; 1\%) measured over 1 hour.}, language = {en} } @article{SerbunBornmannNavitskietal., author = {Serbun, Pavel and Bornmann, Benjamin and Navitski, Aliaksandr and M{\"u}ller, G{\"u}nter and Prommesberger, Christian and Langer, Christoph and Dams, Florian and Schreiner, Rupert}, title = {Stable field emission of single B-doped Si tips and linear current scaling of uniform tip arrays for integrated vacuum microelectronic devices}, series = {Journal of Vacuum Science \& Technology B Nanotechnology and Microelectronics}, volume = {31}, journal = {Journal of Vacuum Science \& Technology B Nanotechnology and Microelectronics}, number = {2}, publisher = {AIP Publishing}, doi = {10.1116/1.4765088}, abstract = {Advanced Si-based semiconductor technology is most suitable to fabricate uniform nanostructures as integrated field emitter arrays for novel vacuum electronic devices. In order to improve the field emission homogeneity and stability of p-type silicon tip arrays for pulsed sensor applications, the authors have systematically studied the influence of the fabrication parameters on the tip shape and on the specific operating conditions. Based on detailed design calculations of the field enhancement, they have fabricated two series of hexagonal arrays of B-doped Si-tips in a triangular arrangement. The first (second) type contains three (four) patches with different number of tips (1, 91, 547 and 1, 19, 1027, 4447 for the first and second type, respectively) of about 1 (2.5) μm height, ∼20 (20) nm apex radius, and 20 (10) μm pitch. The field emission properties of both individual tips and complete arrays were investigated with a field emission scanning microscope at a pressure of 10-9 mbar. The current plateau of these tips typically occurs at about 10 (3) nA and around 65 (25) V/μm field level. In this carrier saturation range, single tips provide the highest current stability (<5\%) and optical current switching ratio (∼2.5). Fairly homogeneous emission of the tip arrays leads to an undershooting of the expected linear scaling of the mean plateau current as well as to a much improved current stability (<1\%).}, language = {en} } @inproceedings{ŁawrowskiLangerPrommesbergeretal., author = {Ławrowski, Robert Damian and Langer, Christoph and Prommesberger, Christian and Dams, Florian and Serbun, Pavel and M{\"u}ller, G{\"u}nter and Schreiner, Rupert}, title = {Spitzen- und Kantenemitter aus Silizium mit einem hohen Aspektverh{\"a}ltnis f{\"u}r Ionisationsgassensoren}, series = {Mikrosystemtechnik als Schl{\"u}sseltechnologie der Systemintegration : 4. Landshuter Symposium Mikrosystemtechnik ; Tagungsband zum Symposium ; 12./13. M{\"a}rz 2014, Hochschule Landshut}, booktitle = {Mikrosystemtechnik als Schl{\"u}sseltechnologie der Systemintegration : 4. Landshuter Symposium Mikrosystemtechnik ; Tagungsband zum Symposium ; 12./13. M{\"a}rz 2014, Hochschule Landshut}, publisher = {Cluster Mikrosystemtechnik}, address = {Landshut}, isbn = {978-3-9812696-5-9}, pages = {28 -- 35}, abstract = {Durch die Optimierung von reaktivem Ionen{\"a}tzen mit induktiv gekoppeltem Plasma ist die Herstellung von verschiedenen Siliziumkathoden mit hoher Anisotropie und hohem Aspektverh{\"a}ltnis f{\"u}r Feldemissionsanwendungen m{\"o}glich. Simulationen mit COMSOL Multiphysics untermauern das Potential von solchen Spitzen- und Kantenfeldemittern. Die Ergebnisse der Simulation zeigen einen zwei- bis sechsfach h{\"o}heren Feld{\"u}berh{\"o}hungsfaktor der tiefge{\"a}tzten Strukturen im Vergleich zu identischen Emittern ohne zus{\"a}tzliche Tiefen{\"a}tzung. Feldemissionsmessungen best{\"a}tigen die Simulationsergebnisse. Der modifizierte Herstellungsprozess der Feldemitter erm{\"o}glicht somit einen zuverl{\"a}ssigen Betrieb von Feldemissionselektronenquellen bei kleineren makroskopischen Feldst{\"a}rken. Außerdem weisen die Messungen des Emissionsstroms im S{\"a}ttigungsbereich eine weitgehende Unabh{\"a}ngigkeit vom elektrischen Feld auf. Lokale Feldemissionsmessungen ergeben dadurch eine deutliche Stromstabilisierung, welche {\"u}ber große Feldst{\"a}rkenbereiche konstant bleibt. Die Nutzung der HAR-Emitter (high aspect ratio) ist damit eine gute Voraussetzung f{\"u}r einen zuverl{\"a}ssigen Betrieb der Emissionskathoden bei kleinen Feldst{\"a}rken f{\"u}r die Anwendung in Ionisationsgassensoren.}, language = {de} } @inproceedings{PrommesbergerŁawrowskiLangeretal., author = {Prommesberger, Christian and Ławrowski, Robert Damian and Langer, Christoph and Dams, Florian and Schreiner, Rupert}, title = {Realisierung von Siliziumspitzenarrays mit integrierter Gate-Elektrode f{\"u}r Anwendungen in der Vakuumsensorik}, series = {4. Landshuter Symposium Mikrosystemtechnik, Mikrosystemtechnik als Schl{\"u}sseltechnologie der Systemintegration, Tagungsband zum Symposium 12./13. M{\"a}rz 2014, Hochschule Landshut}, booktitle = {4. Landshuter Symposium Mikrosystemtechnik, Mikrosystemtechnik als Schl{\"u}sseltechnologie der Systemintegration, Tagungsband zum Symposium 12./13. M{\"a}rz 2014, Hochschule Landshut}, address = {Landshut}, isbn = {978-3-9812696-5-9}, pages = {36 -- 41}, abstract = {Bei der Feldemission (kalte Emission) k{\"o}nnen Elektronen durch ein starkes elektrisches Feld eine glatte und leitende Oberfl{\"a}che verlassen. Die Elektronen tunneln dabei durch eine Potentialbarriere, deren Breite durch ein {\"a}ußeres elektrisches Feld verkleinert wird. Durch das Hinzuf{\"u}gen einer integrierten Gate-Elektrode um eine Siliziumspitze kann die notwendige Einsatzspannung f{\"u}r Feldemission deutlich gesenkt werden. Zwischen Si-Kathode und Gate-Elektrode befindet sich dabei eine Isolationsschicht, die h{\"o}chste Anforderungen bez{\"u}glich der elektrischen Durchbruchsfestigkeit erf{\"u}llen muss. Mit einer Kombination aus Trocken- (Schichtdicke 50 nm) und Feuchtoxid (Schichtdicke 950 nm) konnte eine Isolationsschicht entwickelt werden, die im integrierten Aufbau eine minimale Durchbruchsfeldst{\"a}rke von 3,2 MV/cm aufweist. F{\"u}r die Realisierung von Siliziumkathoden mit integrierter Gate-Elektrode wurde ein bereits bestehender Herstellungsprozess um zus{\"a}tzliche Prozessschritte erweitert. Die {\"U}bertragung der lateralen Position der Spitze erfolgt durch Strukturierung des Umkehrlacks AZ5214 und einer RIE-{\"A}tzung der zuvor hergestellten SiO2-Schicht. Nach dem Entfernen der Lackschicht wird die vertikale Struktur der Siliziumspitzen durch einen RIE-{\"A}tzprozess mit den Prozessgasen SF6 und O)2 realisiert. Aus einer thermischen Oxidation bei 940 °C resultiert anschließend die Isolationsschicht zwischen Si-Kathode und Gate-Elektrode . Gleichzeitig wird diese Ansch{\"a}rfeoxidation auch zur Realisierung der endg{\"u}ltigen Spitzengeometrie verwendet. Durch die lithographische Strukturierung des Photolacks AZ5214 kann dabei die Fl{\"a}che der aufgedampften Gate-Elektrode festgelegt werden. Die Gate-Elektrode wird in einem selbstjustierenden Prozessschritt exakt konzentrisch um die Si-Spitze aufgedampft. Der gerichtete Aufdampfprozess bewirkt eine Abschattung, so dass das Oxidpl{\"a}ttchen nicht komplett von Metall ummantelt wird. Die Opferschicht aus Photolack wird mit den nicht ben{\"o}tigten Metallfl{\"a}chen in einem Lift-off-Prozess entfernt.}, language = {de} }